Abstract An improved circuit module construction for mounting and interconnecting electronic components to substrates, which is applicable to mounting a wide variety of electronic components and conductors, including inverted or `flip chip` mounted integrated circuits. The components are mounted to the substrate with a sandwiched non-conductive polymer layer which acts as the bonding agent and underfill. The substrate and underfill have apertures aligned with signal traces on the substrate and the contacts of the component and conductive polymer is injected through the apertures to fill the area between the substrate contacts and the component contacts, to secure good electrical connection. In one embodiment the non-conductive polymer is printed on the contact side of the substrate with gaps for the contacts. In another embodiment B-staged non-conductive polymer is coated on the non-contact side of the substrate, prior to forming contact apertures and mounting of components. Conductive polymer is then injected in the apertures to make the electrical connections, and the assembly is cured. No coating or pre-treatment of the components is needed.
An electronic circuit module, comprising a substrate, having apertures therethrough, and having electrical contact areas on a mounting surface thereof as surrounds for the apertures wherein the electrical contact surrounds have a thickness above the adjacent surface of the substrate; one or more electronic components for mounting on the substrate, the components having bond pads thereon for positioning in alignment with the electrical contact surrounds on the substrate wherein the components are mounted on the same side of the substrate as the electrical contact surrounds; a non-conductive polymer layer positioned between the component and the substrate, and forming an underfill for the component, the layer having gaps therein aligned with the electrical contact surrounds and bond pads wherein the non-conductive polymer layer has a corresponding or slightly greater thickness than the thickness of the electrical contact surrounds; and conductive polymer material positioned within the apertures, the gaps and in contact with the electric contact surrounds and the bond pads, for making electrical contact therebetween wherein the surrounds and layer form barriers to prevent bridging of the conductive polymer.
Claim 2
Dependent Claim
178 words
An electronic circuit module, comprising a substrate, having apertures therethrough, and having electrical contact areas on a mounting surface thereof as surrounds for the apertures wherein the electrical contact surrounds have a thickness above the adjacent surface of the substrate; one or more electronic components for mounting on the substrate, the components having bond pads thereon for positioning in alignment with the electrical contact surrounds on the substrate wherein the components are mounted on the same side of the substrate as the electrical contact surrounds; a non-conductive polymer layer positioned between the component and the substrate, and forming an underfill for the component, the layer having gaps therein aligned with the electrical contact surrounds and bond pads wherein the non-conductive polymer layer has a corresponding or slightly greater thickness than the thickness of the electrical contact surrounds; and conductive polymer material positioned within the apertures, the gaps and in contact with the electric contact surrounds and the bond pads, for making electrical contact therebetween wherein the surrounds and layer form barriers to prevent bridging of the conductive polymer.