US5406459A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Surface mounting module for an electric circuit board
Assignee: Panasonic Holdings Corp
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Filing: 1992-09-02
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Granted: 1995-04-11
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Expires: 2012-09-02
Abstract
Abstract An electric circuit board module includes a substrate with electric components mounted on one side thereof and electrodes provided on the other side thereof for the electric connection with the mounted electrical components. The electric circuit board module further includes conductor columns adhered to the electrodes and an adhesion layer provided on the other side of the substrate and around the conductor columns such that the conductor columns extrude from the adhesion layer by a predetermined length. By pressing the electric circuit board module against a separate circuit board to mount thereon, the electric components are electrically connected with electrodes of the sperate circuit board through conductor columns. Since conductor columns are made of a resinous paste with metallic powders dispersed therein, no heating operation as required in conventional module using a solder flow is necessary, resulting in that electric components are kept from the degradation caused by the heat.
Inventors
- 👤 Masahide Tsukamoto
- 👤 Seiichi Nakatani
- 👤 Toru Ishida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 23:22
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H05K3/30; H05K3/32; H05K3/321; H05K1/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0183; H05K2201/0195; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10613; H05K2201/10621; H05K2201/10719; H05K2201/10954; H05K2201/10977; H05K2201/10984; H05K2203/00; H05K2203/01; H05K2203/0191; H05K3/22; H05K3/28; H05K3/303; H05K3/305; H05K3/34; H05K3/3465; H05K3/3485; H05K3/38; H05K3/386; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/4623
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
109 words
A surface mounting module comprising: a substrate having a first surface for mounting an electric component thereon and a second surface; an electrode means provided on said second surface for electric connection with a mother printed circuit board; a conductor means provided on said electrode means in an electric connection therewith; an adhesion means provided on said second surface and around said conductor means; and a cover layer which covers said adhesion means except for top surface areas of said conductor means, such that said conductor means extrudes from said adhesion means when said cover layer is removed before mounting said surface mounting module on said mother circuit board.
Claim 2
Dependent Claim
109 words
A surface mounting module comprising: a substrate having a first surface for mounting an electric component thereon and a second surface; an electrode means provided on said second surface for electric connection with a mother printed circuit board; a conductor means provided on said electrode means in an electric connection therewith; an adhesion means provided on said second surface and around said conductor means; and a cover layer which covers said adhesion means except for top surface areas of said conductor means, such that said conductor means extrudes from said adhesion means when said cover layer is removed before mounting said surface mounting module on said mother circuit board.
Claim 3
Dependent Claim
29 words
A surface mounting module as claimed in claim 1, wherein said conductor means is comprised of conductive paste having resinous matrix and metallic powders dispersed in said resinous matrix.
Claim 4
Dependent Claim
34 words
A surface mounting module as claimed in claim 1, wherein said adhesion means is comprised of an insulating and thermosetting material which is adhesive at room temperature and is hardened at a high temperature.
Claim 5
Dependent Claim
59 words
A surface mounting module as claimed in claim 1, wherein said adhesion means comprising: a first adhesion layer of an insulating and adhesive material adhered to said second surface; an intermediate layer of an insulating resinous material adhered to said first adhesion layer; and a second adhesion layer of an insulating and adhesive material adhered to said intermediate layer.
Claim 6
Dependent Claim
32 words
A surface mounting module as claimed in claim 4, wherein said cover layer is adhered to said second adhesion layer in a separable manner for keeping said second adhesion layer from contamination.
Claim 7
Dependent Claim
28 words
A surface mounting module as claimed in claim 1 that further comprises a protection layer provided on said cover layer to protect the top of said conductor means.
Claim 8
Dependent Claim
58 words
A multilayer substrate as claimed in claim 6, wherein said adhesion means comprising: a first adhesion layer of an insulating and adhesive material adhered to said second surface; an intermediate layer of an insulating resinous material adhered to said first adhesion layer; and a second adhesion layer of an insulating and adhesive material adhered to said intermediate layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-04-10 | 1998-10-10 | 1999-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-04-10 | 2002-10-10 | 2003-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-04-10 | 2006-10-10 | 2007-04-11 | $7700.00 | Window Closed / Lapsed |