US5936845A
Expired / Lapsed
US
⏱️ 0.0 years remaining
IC package and IC probe card with organic substrate
Assignee: NEC Corp
•
Filing: 1997-06-23
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Granted: 1999-08-10
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Expires: 2017-06-23
Abstract
Abstract An IC package includes an IC chip substrate having a first surface on which a plurality of electrodes are formed, and an organic substrate having a first surface on which a plurality of bump electrodes are provided. The organic substrate is combined with the IC chip substrate. Each of the bump electrodes is in contact with a corresponding one of the electrodes on the IC chip substrate. The organic substrate has a plurality of through holes and metallization patterns electrically connecting each of the bump electrodes to a corresponding one of the through holes.
Inventors
- 👤 Koji Soejima
- 👤 Nobuaki Takahashi
- 👤 Naoji Senba
- 👤 Yuzo Shimada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:54
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886; H10W70/67; H10W70/68; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/851; H10W72/853; H10W72/856
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
168 words
An IC package comprising: an IC chip substrate having a first surface with a plurality of electrodes thereon; an organic substrate having a first surface with a plurality of bump electrodes thereon that are aligned in a matrix, said organic substrate being combined with said IC chip substrate, each of said bump electrodes being in contact with a corresponding one of said electrodes on said IC chip substrate, said organic substrate having a plurality of through holes aligned in a matrix and positioned adjacent corresponding ones of said bump electrodes and first metallization patterns electrically connecting each of said bump electrodes to a corresponding one of said through holes; and said organic substrate having a second surface with a plurality of ball grid arrays that are aligned in a matrix in positions corresponding to said bums electrodes and adjacent corresponding ones of said through holes, said second surface having second metallization patterns electrically connecting each of said ball grid arrays to a corresponding one of said through holes.
Claim 2
Dependent Claim
168 words
An IC package comprising: an IC chip substrate having a first surface with a plurality of electrodes thereon; an organic substrate having a first surface with a plurality of bump electrodes thereon that are aligned in a matrix, said organic substrate being combined with said IC chip substrate, each of said bump electrodes being in contact with a corresponding one of said electrodes on said IC chip substrate, said organic substrate having a plurality of through holes aligned in a matrix and positioned adjacent corresponding ones of said bump electrodes and first metallization patterns electrically connecting each of said bump electrodes to a corresponding one of said through holes; and said organic substrate having a second surface with a plurality of ball grid arrays that are aligned in a matrix in positions corresponding to said bums electrodes and adjacent corresponding ones of said through holes, said second surface having second metallization patterns electrically connecting each of said ball grid arrays to a corresponding one of said through holes.
Claim 3
Dependent Claim
27 words
The IC package as claimed in claim 1, wherein a space between said IC chip substrate and said organic substrate is filled with a sealing resin material.
Claim 4
Dependent Claim
18 words
The IC package as claimed in claim 1, wherein each of said bump electrodes has a pyramidal shape.
Claim 5
Dependent Claim
37 words
The IC package as claimed in claim 1, wherein each of said bump electrodes comprises a bump body which is made of the same material as said organic substrate and a metal film coating said bump body.
Claim 6
Dependent Claim
80 words
The IC package as claimed in claim 1, wherein said bump electrodes are aligned to form a rectangle having four sides, each of which comprises an alignment of said bump electrodes, said through holes are aligned outside and along said each side of said rectangle of said bump electrodes and said through holes are distanced from said bump electrodes and said metallization patterns provide electrical connections between each of said bump electrodes and the corresponding one of said through holes.
Claim 7
Dependent Claim
17 words
The IC package as claimed in claim 1, wherein said organic substrate is made of ABS resin.
Claim 8
Dependent Claim
19 words
The IC package as claimed in claim 1, wherein said organic substrate is made of liquid crystal polymer resin.
Claim 9
Dependent Claim
16 words
The IC package as claimed in claim 1, wherein said organic substrate is made of elastomer.
Claim 10
Dependent Claim
151 words
An IC probe card comprising: a multilevel interconnection substrate; a plurality of organic substrates provided on said multilevel interconnection substrate, each of said organic substrates having a first surface with a plurality of bump electrodes thereon that are aligned in a matrix for contacting electrodes of an IC chip, each said organic substrate having a plurality of through holes aligned in a matrix and positioned adjacent corresponding ones of said bump electrodes and first metallization patterns electrically connecting each of said bump electrodes to a corresponding one of said through holes; and each said organic substrate having a second surface with a plurality of ball grid arrays that are aligned in a matrix in positions corresponding to said bump electrodes and adjacent corresponding ones of said through holes, said second surface having second metallization patterns electrically connecting each of said ball grid arrays to a corresponding one of said through holes.
Claim 11
Dependent Claim
151 words
An IC probe card comprising: a multilevel interconnection substrate; a plurality of organic substrates provided on said multilevel interconnection substrate, each of said organic substrates having a first surface with a plurality of bump electrodes thereon that are aligned in a matrix for contacting electrodes of an IC chip, each said organic substrate having a plurality of through holes aligned in a matrix and positioned adjacent corresponding ones of said bump electrodes and first metallization patterns electrically connecting each of said bump electrodes to a corresponding one of said through holes; and each said organic substrate having a second surface with a plurality of ball grid arrays that are aligned in a matrix in positions corresponding to said bump electrodes and adjacent corresponding ones of said through holes, said second surface having second metallization patterns electrically connecting each of said ball grid arrays to a corresponding one of said through holes.
Claim 12
Dependent Claim
28 words
The IC probe card as claimed in claim 9, wherein a space between said IC chip substrate and said organic substrate is filled with a sealing resin material.
Claim 13
Dependent Claim
19 words
The IC probe card as claimed in claim 9, wherein each of said bump electrodes has a pyramidal shape.
Claim 14
Dependent Claim
38 words
The IC probe card as claimed in claim 9, wherein each of said bump electrodes comprises a bump body which is made of the same material as said organic substrate and a metal film coating said bump body.
Claim 15
Dependent Claim
81 words
The IC probe card as claimed in claim 9, wherein said bump electrodes are aligned to form a rectangle having four sides, each of which comprises an alignment of said bump electrodes, said through holes are aligned outside and along said each side of said rectangle of said bump electrodes and said through holes are distanced from said bump electrodes and said metallization patterns provide electrical connections between each of said bump electrodes and the corresponding one of said through holes.
Claim 16
Dependent Claim
18 words
The IC probe card as claimed in claim 9, wherein said organic substrate is made of ABS resin.
Claim 17
Dependent Claim
20 words
The IC probe card as claimed in claim 9, wherein said organic substrate is made of liquid crystal polymer resin.
Claim 18
Dependent Claim
17 words
The IC probe card as claimed in claim 9, wherein said organic substrate is made of elastomer.
References Cited (Backward Citations)
US4954458A
Cited
US4707657A
Cited
JPS63220533A
Cited
JPH02161739A
Cited
US5055780A
Cited
US5012187A
Cited
JPH03219650A
Cited
US5177439A
Cited
US5477160A
Cited
US5401689A
Cited
JPH0778645A
Cited
US5434452A
Cited
US5677575A
Cited
JPH0832183A
Cited
US5476818A
Cited
WO1996015458A1
Cited
US5657207A
Cited
US5831444A
Cited
US5808875A
Cited
US5759047A
Cited
US5790377A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-08-09 | 2003-02-08 | 2003-08-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-08-09 | 2007-02-08 | 2007-08-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-08-09 | 2011-02-08 | 2011-08-10 | $7700.00 | Window Closed / Lapsed |