Patent US5923955A successfully refreshed from Google Patents.
US5923955A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fine flip chip interconnection
Assignee: Xerox Corp
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Filing: 1998-05-28
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Granted: 1999-07-13
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Expires: 2018-05-28
Abstract
Abstract There is disclosed a process for creating a flip chip bonded combination for a first integrated circuit and a second integrated circuit. Creating a first connection means on each bonding pad of a first integrated circuit within a first wall structure and a second connection means on each bonding pad of a second integrated circuit within a second wall structure. Removing the second wall structure and partially placing each second connection means within the first wall structure over a respective connection means of the first integrated circuit.
Inventors
- 👤 Kaiser H. Wong
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 13:19
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/20; H10W72/251; H10W72/252; H10W72/90; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
209 words
A process for creating a flip chip bonded combination comprising the steps of: a. creating a plurality of bonding pads with a pitch less than 15 microns on a first integrated circuit and on a second integrated circuit; b. applying a layer of negative photoimagable polyimide over said first integrated circuit; c. patterning said polyimide on said first integrated circuit by photolithography to create a first wall structure around each one of said plurality of bonding pads of a said first integrated circuit; d. creating a first connection means over each one of said plurality of bonding pads within said first wall structure; e. applying a layer of negative photoimagable polyimide over said second integrated circuit; f. patterning said polyimide on said second integrated circuit by photolithography to create a second wall structure around each one of said plurality of bonding pads of said second integrated circuit; g. creating a second connection means over each one of said plurality of bonding pads within said second wall structure; h. removing said second wall structure; i. placing each of said second connection means partially within said first wall structure to contact said respective first connection means; and j. creating electrical connection between two respective connection means within said first wall structure.
Claim 2
Dependent Claim
209 words
A process for creating a flip chip bonded combination comprising the steps of: a. creating a plurality of bonding pads with a pitch less than 15 microns on a first integrated circuit and on a second integrated circuit; b. applying a layer of negative photoimagable polyimide over said first integrated circuit; c. patterning said polyimide on said first integrated circuit by photolithography to create a first wall structure around each one of said plurality of bonding pads of a said first integrated circuit; d. creating a first connection means over each one of said plurality of bonding pads within said first wall structure; e. applying a layer of negative photoimagable polyimide over said second integrated circuit; f. patterning said polyimide on said second integrated circuit by photolithography to create a second wall structure around each one of said plurality of bonding pads of said second integrated circuit; g. creating a second connection means over each one of said plurality of bonding pads within said second wall structure; h. removing said second wall structure; i. placing each of said second connection means partially within said first wall structure to contact said respective first connection means; and j. creating electrical connection between two respective connection means within said first wall structure.
Claim 3
Dependent Claim
46 words
The process in claim 1, wherein said first connection means and said second connection means each further comprises a layer of nickel over said respective bonding pad, a layer of copper over said layer of nickel, and a layer of tin over said layer of copper.
Claim 4
Dependent Claim
39 words
The process in claim 1, wherein said plurality of bonding pads of said first integrated circuit and said second integrated circuit have a first shape and said first wall structure and said second wall structure have a second shape.
Claim 5
Dependent Claim
15 words
The process in claim 1, wherein said step of creating electrical connection uses thermal compression.
Claim 6
Dependent Claim
27 words
The process in claim 1 further comprises a step after step d and prior to step i for placing an adhesive layer over said first wall structure.
Claim 7
Dependent Claim
14 words
The process in claim 1, wherein step h further comprises removing first wall structure.
Claim 8
Dependent Claim
202 words
A process for creating a flip chip bonded combination comprising the steps of: a. creating a plurality of bonding pads with a pitch less than 15 microns on an integrated circuit and on an interconnect substrate; b. applying a layer of negative photoimagable polyimide over said integrated circuit; c. patterning said polyimide on said integrated circuit by photolithography to create a first wall structure around each one of said plurality of bonding pads of a said integrated circuit; d. creating a first connection means over each one of said plurality of bonding pads within said first wall structure; e. applying a layer of negative photoimagable polyimide over said interconnect substrate; f. patterning said polyimide on said interconnect substrate by photolithography to create a first wall structure around each one of said plurality of bonding pads of a said interconnect substrate; g. creating a second connection means over each one of said plurality of bonding pads within said second wall structure; h. removing said second wall structure; i. placing each of said second connection means partially within said first wall structure to contact said respective first connection means; and j. creating electrical connection between two respective connection means within said first wall structure.
Claim 9
Dependent Claim
202 words
A process for creating a flip chip bonded combination comprising the steps of: a. creating a plurality of bonding pads with a pitch less than 15 microns on an integrated circuit and on an interconnect substrate; b. applying a layer of negative photoimagable polyimide over said integrated circuit; c. patterning said polyimide on said integrated circuit by photolithography to create a first wall structure around each one of said plurality of bonding pads of a said integrated circuit; d. creating a first connection means over each one of said plurality of bonding pads within said first wall structure; e. applying a layer of negative photoimagable polyimide over said interconnect substrate; f. patterning said polyimide on said interconnect substrate by photolithography to create a first wall structure around each one of said plurality of bonding pads of a said interconnect substrate; g. creating a second connection means over each one of said plurality of bonding pads within said second wall structure; h. removing said second wall structure; i. placing each of said second connection means partially within said first wall structure to contact said respective first connection means; and j. creating electrical connection between two respective connection means within said first wall structure.
Claim 10
Dependent Claim
46 words
The process in claim 7, wherein said first connection means and said second connection means each further comprises a layer of nickel over said respective bonding pad, a layer of copper over said layer of nickel, and a layer of tin over said layer of copper.
Claim 11
Dependent Claim
37 words
The process in claim 7, wherein said plurality of bonding pads of said integrated circuit and said interconnect substrate have a first shape and said first wall structure and said second wall structure have a second shape.
Claim 12
Dependent Claim
15 words
The process in claim 7, wherein said step of creating electrical connection uses thermal compression.
Claim 13
Dependent Claim
27 words
The process in claim 7 further comprises a step after step d and prior to step i for placing an adhesive layer over said first wall structure.
Claim 14
Dependent Claim
14 words
The process in claim 7, wherein step h further comprises removing first wall structure.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-07-12 | 2003-01-11 | 2003-07-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-07-12 | 2007-01-11 | 2007-07-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-07-12 | 2011-01-11 | 2011-07-13 | $7700.00 | Window Closed / Lapsed |