Patent US5391087A successfully refreshed from Google Patents.
US5547530A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a ceramic substrate
Assignee: Panasonic Holdings Corp
•
Filing: 1994-01-31
•
Granted: 1996-08-20
•
Expires: 2014-01-31
Abstract
Abstract The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
Inventors
- 👤 Yoshifumi Nakamura
- 👤 Yoshihiro Bessho
- 👤 Satoru Yuhaku
- 👤 Yasuhiko Hakotani
- 👤 Minehiro Itagaki
- 👤 Kazuhiro Miura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 21:38
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/40; H05K3/4007; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H10W70/099; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/035; H05K2201/0364; H05K2201/0367; H05K3/4611; H05K3/4626; H05K3/4629; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49163; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
93 words
A method of manufacturing a ceramic substrate having a plurality of bumps comprising the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste wherein the bump forming layer is not sintered; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
Claim 2
Independent Claim
93 words
A method of manufacturing a ceramic substrate having a plurality of bumps comprising the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste wherein the bump forming layer is not sintered; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
Claim 3
Dependent Claim
59 words
A method according to claim 1, wherein the step of forming the bump forming layer comprises the steps of: making the plurality of holes in at least one green sheet for bump forming layer; and applying the at least one green sheet for bump forming layer onto the at least one face of the laminated body of green sheets.
Claim 4
Dependent Claim
20 words
A method according to claim 2, wherein the green sheet for bump forming layer includes inorganic components as major components.
Claim 5
Dependent Claim
40 words
A method according to claim 2, wherein the green sheet for bump forming layer includes at least one component selected from a group consisting of Al 2 O 3 , MgO, ZrO 2 , TiO 2 , BeO and BN.
Claim 6
Dependent Claim
55 words
A method according to claim 1, further comprising, before the sintering step, the steps of: applying heat treatment to the laminated body of green sheets and the bump forming paste in order to remove organic substances included in the laminated body of green sheets and the bump forming paste; and reducing the bump forming paste.
Claim 7
Dependent Claim
51 words
A method according to claim 1, wherein the step of forming the bump forming layer comprises the step of: printing the bump forming layer having the plurality of holes therein on the at least one face of the laminated body of green sheets by using a paste for bump forming layer.
Claim 8
Dependent Claim
67 words
A method according to claim 6, further comprising, before the sintering step, the steps of: applying heat treatment to the laminated body of green sheets, the bump forming paste and the paste for bump forming layer in order to remove organic substances included in the laminated body of green sheets, the bump forming paste and the paste for bump forming layer; and reducing the bump forming paste.
Claim 9
Dependent Claim
44 words
A method according to claim 6, further comprising, before the step of forming the bump forming layer, the step of forming a substrate forming layer on at least one face of the laminated body of green sheets by printing a paste for forming substrate.
Claim 10
Dependent Claim
19 words
A method according to claim 6, wherein the paste for bump forming layer includes inorganic components as major components.
Claim 11
Dependent Claim
39 words
A method according to claim 6, wherein the paste for bump forming layer includes at least one component selected from a group consisting of Al 2 O 3 , MgO, ZrO 2 , TiO 2 , BeO and BN.
Claim 12
Dependent Claim
31 words
A method according to claim 1, wherein the bump forming paste is a conductive paste including at least one component selected from a group consisting of Ag, Pd, Pt and Cu.
Claim 13
Dependent Claim
22 words
A method according to claim 1, wherein the bump forming paste is a metal oxide paste including CuO as the major component.
Claim 14
Dependent Claim
18 words
A method according to claim 1, wherein the plurality of bumps each have a form of a pillar.
Claim 15
Independent Claim
86 words
A method of manufacturing a ceramic substrate having a plurality of bumps comprising the step of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a ceramic substrate; filling the holes in the bump forming layer with a bump forming paste; sintering the ceramic substrate and the bump forming paste wherein the bump forming layer is not sintered; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
Claim 16
Independent Claim
86 words
A method of manufacturing a ceramic substrate having a plurality of bumps comprising the step of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a ceramic substrate; filling the holes in the bump forming layer with a bump forming paste; sintering the ceramic substrate and the bump forming paste wherein the bump forming layer is not sintered; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
Claim 17
Dependent Claim
56 words
A method according to claim 14, wherein the step of forming the bump forming layer comprises the steps of: making the plurality of holes in at least one green sheet for bump forming layer; and applying the at least one green sheet for bump forming layer onto the at least one face of the ceramic substrate.
Claim 18
Dependent Claim
57 words
A method according to claim 15, further comprising, before the sintering step, the steps of: applying heat treatment to the green sheet for bump forming layer and the bump forming paste in order to remove organic substances included in the green sheets for bump forming layer and the bump forming paste; and reducing the bump forming paste.
Claim 19
Dependent Claim
20 words
A method according to claim 15, wherein the green sheet for bump forming layer includes inorganic components as major components.
Claim 20
Dependent Claim
40 words
A method according to claim 15, wherein the green sheet for bump forming layer includes at least one component selected from a group consisting of Al 2 O 3 , MgO, ZrO 2 , TiO 2 , BeO and BN.
Claim 21
Dependent Claim
48 words
A method according to claim 14, wherein the step of forming the bump forming layer comprises the step of: printing the bump forming layer having a plurality of holes therein on the at least one face of the ceramic substrate by using a paste for bump forming layer.
Claim 22
Dependent Claim
41 words
A method according to claim 19, further comprising, before the step of forming the bump forming layer, the step of forming a substrate forming layer on at least one face of the ceramic substrate by printing a paste for forming substrate.
Claim 23
Dependent Claim
19 words
A method according to claim 19, wherein the paste for bump forming layer includes inorganic components as major components.
Claim 24
Dependent Claim
39 words
A method according to claim 19, wherein the paste for bump forming layer includes at least one component selected from a group consisting of Al 2 O 3 , MgO, ZrO 2 , TiO 2 , BeO and BN.
Claim 25
Dependent Claim
55 words
A method according to claim 19, further comprising, before the sintering step, the steps of: applying heat treatment to the bump forming paste and the paste for bump forming layer in order to remove organic substances included in the bump forming paste and the paste for bump forming layer; and reducing the bump forming paste.
Claim 26
Dependent Claim
31 words
A method according to claim 14, wherein the bump forming paste is a conductive paste including at least one component selected from a group consisting of Ag, Pd, Pt and Cu.
Claim 27
Dependent Claim
22 words
A method according to claim 14, wherein the bump forming paste is a metal oxide paste including CuO as the major component.
Claim 28
Dependent Claim
18 words
A method according to claim 14, wherein the plurality of bumps each have a form of a pillar.
References Cited (Backward Citations)
US4461077A
Cited
JPS61188942A
Cited
US5130067A
Cited
US5135595A
Cited
JPH01293539A
Cited
JPH0292936A
Cited
JPH03112191A
Cited
US5085720A
Cited
EP0464224A1
Cited
US5093986A
Cited
JPH05218133A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-08-20 | 2000-02-19 | 2000-08-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-08-20 | 2004-02-19 | 2004-08-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-08-20 | 2008-02-19 | 2008-08-20 | $7700.00 | Window Closed / Lapsed |