Patent US5920120A successfully refreshed from Google Patents.
US5920120A
Expired / Lapsed
US
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Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved
Assignee: Intel Corp
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Filing: 1997-12-19
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Granted: 1999-07-06
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Expires: 2017-12-19
Abstract
Abstract An assembly comprising a substrate, a thermally conductive member which is spaced from the substrate, and a semiconductor chip located on a side of the substrate facing the thermally conductive member. A resilient component is compressed between the substrate and the thermally conductive member so that a force clamping the substrate and the thermally conductive member together is shared by at least the semiconductor chip and the component.
Inventors
- 👤 James S. Webb
- 👤 Jack L. Goodman
- 👤 Nadir Sharaf
- 👤 Lawrence E. McKay
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:19
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/641; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H10W72/00; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
109 words
An assembly comprising: a substrate; a thermally conductive member which is spaced from the substrate; a semiconductor chip located on a side of the substrate facing the thermally conductive member, the semiconductor chip being thermally coupled to the thermally conductive member; at least one resilient component located between the substrate and the thermally conductive member; and a clamping structure clamping the substrate and the thermally conductive member together under a clamping force so as to compress the resilient component between the substrate and the thermally conductive member against a spring force of the resilient component until the clamping force is shared between the semiconductor chip and the resilient component.
Claim 2
Dependent Claim
109 words
An assembly comprising: a substrate; a thermally conductive member which is spaced from the substrate; a semiconductor chip located on a side of the substrate facing the thermally conductive member, the semiconductor chip being thermally coupled to the thermally conductive member; at least one resilient component located between the substrate and the thermally conductive member; and a clamping structure clamping the substrate and the thermally conductive member together under a clamping force so as to compress the resilient component between the substrate and the thermally conductive member against a spring force of the resilient component until the clamping force is shared between the semiconductor chip and the resilient component.
Claim 3
Dependent Claim
19 words
The assembly as recited in claim 1 wherein the semiconductor chip carries less than 50% of the clamping force.
Claim 4
Dependent Claim
20 words
The assembly as recited in claim 1 wherein the component has a spring constant which is less than 10 N/mm.
Claim 5
Dependent Claim
23 words
The assembly as recited in claim 1 wherein the substrate comprises a main substrate and an interposer substrate located on the main substrate.
Claim 6
Dependent Claim
21 words
The assembly as recited in claim 1, further comprising a heat sink contacting the thermally conductive member to transfer heat therefrom.
Claim 7
Dependent Claim
22 words
The assembly as recited in claim 1, further comprising an array of solder connectors located between the substrate and the semiconductor chip.
Claim 8
Dependent Claim
25 words
The assembly as recited in claim 1, further comprising a layer of thermally conductive material located between the semiconductor chip and the thermally conductive member.
Claim 9
Dependent Claim
101 words
An assembly comprising: a substrate; a semiconductor chip located on the substrate; a thermally conductive member; a resilient component which is located between the substrate and the thermally conductive member; and a clamping structure clamping the substrate and the thermally conductive member together so that the resilient component is deflected under a force exerted by the clamping structure against a spring force of the resilient component until the semiconductor chip is thermally coupled with the thermally conductive member and the force is shared between the semiconductor chip and the component with the resilient component carrying at least 50% of the force.
Claim 10
Dependent Claim
101 words
An assembly comprising: a substrate; a semiconductor chip located on the substrate; a thermally conductive member; a resilient component which is located between the substrate and the thermally conductive member; and a clamping structure clamping the substrate and the thermally conductive member together so that the resilient component is deflected under a force exerted by the clamping structure against a spring force of the resilient component until the semiconductor chip is thermally coupled with the thermally conductive member and the force is shared between the semiconductor chip and the component with the resilient component carrying at least 50% of the force.
Claim 11
Independent Claim
73 words
A method of assembling a semiconductor chip located on a substrate and a thermally conductive member, comprising the steps of: locating a member between the substrate and the thermally conductive member; and clamping the substrate and the thermally conductive member to one another under a force so as to deflect the resilient member against a spring force of the resilient component until the semiconductor chip is thermally coupled with the thermally conductive member.
Claim 12
Independent Claim
73 words
A method of assembling a semiconductor chip located on a substrate and a thermally conductive member, comprising the steps of: locating a member between the substrate and the thermally conductive member; and clamping the substrate and the thermally conductive member to one another under a force so as to deflect the resilient member against a spring force of the resilient component until the semiconductor chip is thermally coupled with the thermally conductive member.
Claim 13
Dependent Claim
18 words
The assembly of claim 8 wherein the component has a spring constant which is less than 10 N/mm.
Claim 14
Dependent Claim
21 words
The assembly of claim 8 wherein the substrate comprises a main substrate and an interposer substrate located on the main substrate.
Claim 15
Dependent Claim
19 words
The assembly of claim 8, further comprising a heat sink contacting the thermally conductive member to transfer heat therefrom.
Claim 16
Dependent Claim
20 words
The assembly of claim 8, further comprising an array of solder connectors located between the substrate and the semiconductor chip.
Claim 17
Dependent Claim
23 words
The assembly of claim 8, further comprising a layer of thermally conductive material located between the semiconductor chip and the thermally conductive member.
Claim 18
Dependent Claim
15 words
The assembly of claim 14 wherein the thermally conductive material is a thermally conductive grease.
References Cited (Backward Citations)
JPH0410458A
Cited
US5065280A
Cited
US5345102A
Cited
US5500556A
Cited
US5719443A
Cited
US5592021A
Cited
US5754400A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-07-05 | 2003-01-04 | 2003-07-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-07-05 | 2007-01-04 | 2007-07-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-07-05 | 2011-01-04 | 2011-07-06 | $7700.00 | Window Closed / Lapsed |