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US5754400A Expired / Lapsed US ⏱️ 0.0 years remaining

Demountable heat sink

Assignee: International Business Machines Corp
•
Filing: 1997-02-05
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Granted: 1998-05-19
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Expires: 2017-02-05
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Abstract

Abstract A demountable, and thus re-usable, conductive heat sink for dissipation of excess heat of an electronic component. The heat sink uses a T-bolt and T-slot for attachment to the electronic component and the printed circuit board, respectively. This attachment eliminates the typical concerns associated with the placement of traces on the PCB to accommodate the holes placed therein for the attachment of conventional heat sinks. The improved designed also facilitates demounting of the heat sink from the printed circuit board and the electronic component without damage thereto.

Inventors

  • 👤 Sanjeev Balwant Sathe
  • 👤 Pratap Singh

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 13:22
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W72/00; H10W72/851; H10W72/874; H10W72/877

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 129 words
An apparatus comprising: a printed circuit board; an integrated circuit attached to a surface of said printed circuit board; a heat sink placed on top of the integrated circuit; a bolt having upper and lower portions; a non-threaded slot having the same shape as the upper portion for receiving the upper portion and restraining the upper portion from vertical movement, the non-threaded slot being attached to the surface of the printed circuit board; a spring located between the bottom of the heat sink and the top of the non-threaded slot; and securing means for securing the lower portion to the heat sink and for applying an upward force via the spring to the upper portion such that the upper portion is restrained from horizontal movement via the non-threaded slot.
Claim 2
Independent Claim 129 words
An apparatus comprising: a printed circuit board; an integrated circuit attached to a surface of said printed circuit board; a heat sink placed on top of the integrated circuit; a bolt having upper and lower portions; a non-threaded slot having the same shape as the upper portion for receiving the upper portion and restraining the upper portion from vertical movement, the non-threaded slot being attached to the surface of the printed circuit board; a spring located between the bottom of the heat sink and the top of the non-threaded slot; and securing means for securing the lower portion to the heat sink and for applying an upward force via the spring to the upper portion such that the upper portion is restrained from horizontal movement via the non-threaded slot.
Claim 3
Dependent Claim 20 words
The apparatus of claim 1 wherein the non-thread slot is substantially similar in length to that of the heat sink.
Claim 4
Dependent Claim 24 words
The apparatus of claim 2 wherein the upper and lower portions of the bolt are a threaded end and a T shaped end, respectively.
Claim 5
Dependent Claim 12 words
The apparatus of claim 3 wherein the non-threaded slot is T shaped.
Claim 6
Dependent Claim 24 words
The apparatus of claim 1 wherein the upper and lower portions of the bolt are a threaded end and a T shaped end, respectively.
Claim 7
Dependent Claim 12 words
The apparatus of claim 5 wherein the non-threaded slot is T shaped.

References Cited (Backward Citations)

US3867003A Cited
US4068368A Cited
US4333101A Cited
US4636580A Cited
US4628990A Cited
JPH04186752A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-05-18 2001-11-17 2002-05-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-05-18 2005-11-17 2006-05-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-05-18 2009-11-17 2010-05-19 $7700.00 Window Closed / Lapsed

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