Patent US5911897A successfully refreshed from Google Patents.
US5911897A
Expired / Lapsed
US
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Temperature control for high power burn-in for integrated circuits
Assignee: Micro Control Co
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Filing: 1997-01-13
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Granted: 1999-06-15
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Expires: 2017-01-13
Abstract
Abstract A temperature control system for high power burn-in of integrated circuit chips which includes an individual heat sink at each of the integrated circuit chips to dissipate heat generated by the integrated circuit. A heater for each chip is provided and is temperature controlled so that heat may be added by the heater as a function of the heat generated by the integrated circuit chip. A temperature sensor is provided in close thermal contact with the integrated circuit chip to sense the temperature of the integrated circuit chip. A closed loop temperature controller is used to vary the amount of current provided to the heater to maintain a desired range of temperature. Thermal contact between the temperature sensor and the integrated circuit chips is insured by utilizing a spring to urge the sensor toward the integrated circuit chip.
Inventors
- 👤 Harold E. Hamilton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 15:23
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2855; G01R31/2872; G01R31/2874; G05; G05D; G05D23/00; G05D23/19; G05D23/1906; H; H10; H10W; H10W40/00; G01R1/00; G01R1/02
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
152 words
A system for controlling the temperature of an integrated circuit chip during a burn-in test for an integrated circuit on the chip, including a circuit chip mounted on a burn-in board, a thermal control assembly including a heat conducting base a heater supported in heat conducting relationship to the base, and a heat sink for a dissipating heat supported in thermal conducting relationship to the heater and holding the heater in position against the base, the base having a bore therethrough; a temperature sensor housing of low thermal conductivity mounted in the bore of the base, the temperature sensor housing having a bore therein; a single temperature sensor mounted in the bore of the temperature sensor housing and in thermal contact with the integrated circuit chip; and a controller connected to the single temperature sensor to regulate the heat dissipated by the heater in response to signals from the single temperature sensor.
Claim 2
Independent Claim
152 words
A system for controlling the temperature of an integrated circuit chip during a burn-in test for an integrated circuit on the chip, including a circuit chip mounted on a burn-in board, a thermal control assembly including a heat conducting base a heater supported in heat conducting relationship to the base, and a heat sink for a dissipating heat supported in thermal conducting relationship to the heater and holding the heater in position against the base, the base having a bore therethrough; a temperature sensor housing of low thermal conductivity mounted in the bore of the base, the temperature sensor housing having a bore therein; a single temperature sensor mounted in the bore of the temperature sensor housing and in thermal contact with the integrated circuit chip; and a controller connected to the single temperature sensor to regulate the heat dissipated by the heater in response to signals from the single temperature sensor.
Claim 3
Dependent Claim
38 words
The system of claim 1, and a spring member to urge the temperature sensor housing in a direction to move the temperature sensor against the integrated circuit chip thermal control assembly is mounted on the integrated circuit chip.
Claim 4
Dependent Claim
52 words
The system of claim 1, wherein the integrated circuit chip is mountable in a socket on a burn-in board, and fasteners extending through the heat sink, heater and base for urging the thermal control assembly against the integrated circuit chip in a socket by fastening the fasteners relative to the burn-in board.
Claim 5
Dependent Claim
26 words
The system of claim 1, wherein the thermal control assembly includes a layer of conductive thermal foam positioned between the integrated circuit chip and the base.
Claim 6
Dependent Claim
34 words
The system of claim 1 wherein the controller comprises an amplifier controlling current to the heater as a function of differentials in voltage between a voltage signal from the temperature sensor and a reference.
Claim 7
Independent Claim
164 words
A system for controlling the temperature of an integrated circuit chip during a burn-in test for an integrated circuit on the chip, including a circuit chip mounted on a burn-in board, a thermal control assembly including a heat conducting base, a boss in a center portion of the base plate, a heater supported in heat conducting relationship to the base on a side thereof opposite the boss for heating the integrated circuit chip, and a heat sink for a dissipating heat supported in thermal conducting relationship to the heater and holding the heater against the base, and a single temperature sensor mounted relative to the base plate and engaging a circuit chip on a board, and a compartment having an input connected to receive a temperature dependent voltage signal from the temperature sensor and having an output providing current to the heater area compared function of the difference between the temperature dependent voltage and a reference voltage at a second input of the comparator.
Claim 8
Independent Claim
164 words
A system for controlling the temperature of an integrated circuit chip during a burn-in test for an integrated circuit on the chip, including a circuit chip mounted on a burn-in board, a thermal control assembly including a heat conducting base, a boss in a center portion of the base plate, a heater supported in heat conducting relationship to the base on a side thereof opposite the boss for heating the integrated circuit chip, and a heat sink for a dissipating heat supported in thermal conducting relationship to the heater and holding the heater against the base, and a single temperature sensor mounted relative to the base plate and engaging a circuit chip on a board, and a compartment having an input connected to receive a temperature dependent voltage signal from the temperature sensor and having an output providing current to the heater area compared function of the difference between the temperature dependent voltage and a reference voltage at a second input of the comparator.
Claim 9
Independent Claim
182 words
A system for controlling the temperature of an integrated circuit chip during a burn-in test for an integrated circuit on the chip, including a circuit chip mounted on a burn-in board, a heat conducting base plate, including a heat conducting boss in center portions thereof, a heater supported in heat conducting relationship to the base plate on a side thereof opposite the boss for heating the integrated circuit chip, a heat sink for dissipating heat supported in thermal conducting relationship to the heater and clamped to hold the heater against the base plate, a bore through the base plate and boss having a through bore, a temperature sensor housing mounted in the bore, said temperature sensor housing having a second bore therein, and a temperature sensor mounted in the second bore and extending to be held in thermal contact with the integrated circuit chip, and a controller to regulate the heat dissipated by the heater in response to signals from the single temperature sensor as a function of the differential between a voltage signal from the temperature sensor and a reference voltage.
Claim 10
Independent Claim
182 words
A system for controlling the temperature of an integrated circuit chip during a burn-in test for an integrated circuit on the chip, including a circuit chip mounted on a burn-in board, a heat conducting base plate, including a heat conducting boss in center portions thereof, a heater supported in heat conducting relationship to the base plate on a side thereof opposite the boss for heating the integrated circuit chip, a heat sink for dissipating heat supported in thermal conducting relationship to the heater and clamped to hold the heater against the base plate, a bore through the base plate and boss having a through bore, a temperature sensor housing mounted in the bore, said temperature sensor housing having a second bore therein, and a temperature sensor mounted in the second bore and extending to be held in thermal contact with the integrated circuit chip, and a controller to regulate the heat dissipated by the heater in response to signals from the single temperature sensor as a function of the differential between a voltage signal from the temperature sensor and a reference voltage.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-06-14 | 2002-12-14 | 2003-06-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-06-14 | 2006-12-14 | 2007-06-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-06-14 | 2010-12-14 | 2011-06-15 | $7700.00 | Window Closed / Lapsed |