Cavity down HBGA package structure

Claim 1

A cavity-down HBGA integrated-circuit package for an integrated-circuit die, comprising: an integrated-circuit die having a pair of opposing surfaces, one of which is a die-mounting surface and the other surface of which has wire-bonding pads formed thereupon; a die-carrier/heat spreader which has a die-cavity formed through its lower surface, wherein the die-cavity is defined by a top interior surface and interior side walls, wherein the die-mounting surface of the integrated-circuit die is attached to the top interior surface of the die-cavity, and wherein the die-carrier/heat spreader further includes a lower surface outside of and surrounding the cavity; a first portion of an insulated tape layer which extends over the lower outside surface of the die-carrier/heat spreader outside of the die-cavity; the insulated tape layer also having second portions which are located inside the die-cavity of the die-carrier/heat sink and which second portions have wire-bonding sites formed thereupon; a plurality of bonding-wire loops, each of which is looped between and bonded to one of the wire-bonding pads formed on the integrated-circuit die and a respective one of the wire-bonding sites formed on the insulated tape layer within the die-cavity to form bonding-wire loops; wherein a number of conductive traces are formed on the insulated tape layer to connect the wire-bonding sites located inside of the die-cavity to respective selective solderable areas formed on the insulated layer outside of the die-cavity; wherein the selective solderable areas on the insulated layer and outside of the die-cavity are arranged in a grid pattern on the bottom side of a die-down HBGA package; a plurality of solder balls attached to respective selective solderable areas formed on the insulated layer outside of the die-cavity; and sealing means for covering and sealing the integrated-circuit die, the bonding wires, said sealing means having a lower outside surface formed therein and adapted to be spaced apart from a surface to which an HBGA package is mounted.