US5731631A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device with tape automated bonding element
Assignee: Renesas Electronics Corp
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Filing: 1996-07-30
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Granted: 1998-03-24
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Expires: 2016-07-30
Abstract
Abstract A semiconductor device having improved heat dissipation property and electrical characteristics and applicable to an integrated circuit having a multiplicity of electrodes, and a method of fabricating the semiconductor device are disclosed. A surface of a semiconductor chip (1) on which a bump (2) is formed is in face to face relation to a surface of a circuit substrate (3) on which a land (5) is formed. A polyimide tape (6) and a TAB lead (7) constitute a TAB tape. The bump (2) and the land (5) are electrically connected to each other through the flat TAB tape. The land (5) is electrically connected to an external connection electrode (4) through an interconnecting line within the circuit substrate (3). The TAB lead (7) extending from the bump (2) to the land (5) is reduced in length, and the signal through the TAB lead (7) accordingly has improved electrical characteristics. The use of the TAB tape permits the semiconductor device to be applied to the semiconductor chip (1) having the multiplicity of bumps (2).
Inventors
- 👤 Yomiyuki Yama
- 👤 Masao Kobayashi
- 👤 Jun Shibata
- 👤 Shinji Baba
- 👤 Masaki Watanabe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 08:23
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W74/00; H10W74/01; H10W70/00; H10W70/40; H10W70/453; H10W72/077; H10W72/20; H10W74/10; H10W74/111; H10W74/114; H10W74/121; H10W99/00; H10W70/60; H10W70/67; H10W70/68; H10W70/681; H10W72/072; H10W72/07251; H10W72/251; H10W72/701; H10W72/851; H10W72/853; H10W74/131; H10W74/142
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
179 words
A semiconductor device comprising: a chip having at least one first electrode formed on a first chip surface; a substrate having at least one second electrode formed on a first substrate surface; at least one tape automated bonding element comprising an insulating member and a continuous conductive flat strip having one end connected to said at least one first electrode and a second end connected to said at least one second electrode to establish a short flat electrical connection portion extending between said at least one first electrode and said at least one second electrode with both strip ends being trimable to fit the continuous conductive strip between the at least one first electrode and the at least one second electrode; said first chip surface being in face to face relation to said first substrate surface; and said at least one tape automated bonding element continuous flat strip being provided so as to occupy no more than a space between said first chip surface and said first substrate surface needed for clearance for the short flat electrical connection portion.
Claim 2
Dependent Claim
179 words
A semiconductor device comprising: a chip having at least one first electrode formed on a first chip surface; a substrate having at least one second electrode formed on a first substrate surface; at least one tape automated bonding element comprising an insulating member and a continuous conductive flat strip having one end connected to said at least one first electrode and a second end connected to said at least one second electrode to establish a short flat electrical connection portion extending between said at least one first electrode and said at least one second electrode with both strip ends being trimable to fit the continuous conductive strip between the at least one first electrode and the at least one second electrode; said first chip surface being in face to face relation to said first substrate surface; and said at least one tape automated bonding element continuous flat strip being provided so as to occupy no more than a space between said first chip surface and said first substrate surface needed for clearance for the short flat electrical connection portion.
Claim 3
Dependent Claim
21 words
The semiconductor device of claim 1, further comprising: a heat dissipator having a good heat dissipating property coupled to said chip.
Claim 4
Dependent Claim
59 words
The semiconductor device of claim 1, further comprising: an external electrode formed on a second surface of said substrate in a position removed from a position under the connection between said at least one second electrode and said second end of said continuous conductive flat strip, said external electrode being electrically connected to said at least one second electrode.
Claim 5
Dependent Claim
41 words
The semiconductor device of claim 1, further comprising: a conductive element connected to a ground and mounted adjacent to at least one end of the continuous conductive flat strip to cause the adjacent end to function as a micro strip line.
Claim 6
Dependent Claim
66 words
The semiconductor device of claim 1, further comprising: a signal line formed in said substrate and connected to said at least one second electrode; and a conductive element connected to a ground and mounted adjacent to both the at least one second electrode and the signal line so that said at least one second electrode and said signal line to will function as micro strip lines.
Claim 7
Dependent Claim
67 words
The semiconductor device of claim 1, further comprising: a signal line formed in said substrate and connected to said at least one second electrode; and a conductive element connected to a ground and mounted in a common plane with said at least one second electrode and said signal line so that said at least one second electrode and said signal line will function as coplanar strip lines.
Claim 8
Dependent Claim
22 words
The semiconductor device of claim 4, wherein said conductive element is included as a conductive layer of said tape automated bonding element.
Claim 9
Dependent Claim
21 words
The semiconductor device of claim 4, wherein said conductive element is formed as a conductive layer on said first substrate surface.
Claim 10
Dependent Claim
80 words
The semiconductor device of claim 1, further comprising: a signal line formed in said substrate or on said first substrate surface and connected to said at least one second electrode; and a conductive layer formed on the first substrate surface between said tape automated bonding element and said signal line, said conductive layer being connected to a ground and causing said at least one second electrode and said signal line to function as micro strip lines or coplanar strip lines.
Claim 11
Dependent Claim
63 words
The semiconductor device of claim 1, further comprising: a cavity formed in said first substrate surface under said chip and excavated from said first substrate surface; at least one third electrode formed in said cavity; and at least one fourth electrode formed on said first chip surface, said at least one third electrode being electrically connected to said at least one fourth electrode.
Claim 12
Dependent Claim
71 words
The semiconductor device of claim 1, further comprising: at least one third electrode formed on said first substrate surface under said chip; at least one fourth electrode formed on said first chip surface; and an electrically conductive resin between said at least one third electrode and said at least one fourth electrode for establishing an electrical connection between said at least one third electrode and said at least one fourth electrode.
Claim 13
Dependent Claim
48 words
The semiconductor of claim 1, further comprising: at least one third electrode formed on said first substrate surface under said chip, a second tape automated bonding element including a further conductive portion establishing an electrical connection between an additional first electrode and said at least one third electrode.
Claim 14
Dependent Claim
116 words
The semiconductor device of claim 12, wherein said at least one first electrode includes an electrode portion formed outside said chip, wherein said at least one second electrode is formed on said first substrate surface in a position other than a position under said chip, said electrode portion formed outside said chip and said at least one second electrode are electrically connected to each other by said short flat electrical connection portion, wherein said additional first electrode includes an electrode portion formed inside said chip, and said electrode portion formed inside said chip and said at least one third electrode are electrically connected to each other by said second tape automated bonding element further conductive portion.
Claim 15
Dependent Claim
40 words
The semiconductor device of claim 1, further comprising: a resin provided in contact with only said chip and said at least one tape automated bonding element for fixing said chip and said at least one tape automated bonding element together.
Claim 16
Dependent Claim
45 words
The semiconductor device of claim 1, further comprising: a through opening extending from said first substrate surface to a second substrate surface, said through opening being under said chip; and a resin filling at least a space between said first substrate surface and said chip.
Claim 17
Dependent Claim
95 words
A semiconductor device comprising: a substrate having a through opening from a first substrate surface to a reverse substrate surface; a chip mounted in said through opening and having at least one tape automated bonding element having an insulating portion and a conductive strip portion establishing an electrical connection between at least one first electrode on the chip and at least one second electrode on the first substrate surface; and a system circuit board supporting the substrate with said chip mounted in said through opening contacting the system circuit board through a thermal coupling element.
Claim 18
Dependent Claim
95 words
A semiconductor device comprising: a substrate having a through opening from a first substrate surface to a reverse substrate surface; a chip mounted in said through opening and having at least one tape automated bonding element having an insulating portion and a conductive strip portion establishing an electrical connection between at least one first electrode on the chip and at least one second electrode on the first substrate surface; and a system circuit board supporting the substrate with said chip mounted in said through opening contacting the system circuit board through a thermal coupling element.
Claim 19
Dependent Claim
55 words
The semiconductor device of claim 16, the thermal coupling element further comprising: a thermally conductive material or at least one thermally conductive member in contact with at least a portion of a surface of said chip, wherein said at least a portion of the surface of said chip is a portion having a high temperature.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-23 | 2001-09-22 | 2002-03-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-23 | 2005-09-22 | 2006-03-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-23 | 2009-09-22 | 2010-03-24 | $7700.00 | Window Closed / Lapsed |