Semiconductor package having semiconductor element, mounting structure of semiconductor package mounted on circuit board, and method of assembling semiconductor package

Claim 2

A semiconductor package comprising: a semiconductor element having a first face, a second face opposite said first face, and a side face extending between said first and said second faces, an electrode provided on said first face; a conductive lead having a first end and a second end opposite each other, said first end being conductively connected to said electrode, said second end being nonconductively connected to said second surface, said lead extending to said side face, wherein said lead has a bent part between said first and said second ends thereof, said bent part serving as a terminal part for being connected to a circuit board when said semiconductor package is mounted on said circuit board; and a stick-form elastic member between said side face and said bent part, said bent part being bent as to wrap said elastic member inwardly.

Claim 3

A semiconductor package as claimed in claim 1, wherein said lead comprises a flexible material.

Claim 4

A semiconductor package as claimed in claim 1, further comprising an insulating film member interposed between said second face and said second end for nonconductively connecting said second end to said second face.

Claim 5

A semiconductor package as claimed in claim 1, further comprising a resin member provided on said first face for covering said first end and said electrode.

Claim 6

A semiconductor package as claimed in claim 1, further comprising an insulating additional film member opposite said first face wherein a predetermined space is between said additional film member and said first face and said additional film member is held by said first end.

Claim 7

A semiconductor package as claimed in claim 1, further comprising: an additional electrode on said first face; and an additional conductive lead having a first end and a second end opposite each other, the first end of said additional conductive lead being conductively connected to said additional electrode, the second end of said additional conductive lead being nonconductively connected to said additional electrode, said lead extending to said side face.

Claim 8

A semiconductor package as claimed in claim 3, wherein said film member is adhered to said second face.

Claim 9

A semiconductor package as claimed in claim 3, wherein said film member extends from said second face along said lead opposite said side face.

Claim 10

A semiconductor package as claimed in claim 4, wherein said resin member extends to protect all of said first face.

Claim 11

A semiconductor package comprising: a semiconductor element having a first face, a second face opposite said first face, and a side face extending between said first and said second faces, an electrode provided on said first face; a conductive lead having a first end and a second end opposite each other, said first end being conductively connected to said electrode, said second end being nonconductively connected to said second surface, said lead extending to said side face; and an insulating additional film member opposite said first face, wherein a predetermined space is between said additional film member and said first face and said additional film member is held by said first end, wherein said first end has a lead groove part, said insulating additional film member having an end part inserted into said lead groove part to thereby be held to said first end.

Claim 12

A semiconductor package comprising: a semiconductor element having a first face, a second face opposite said first face, and a side face extending between said first and said second faces, an electrode provided on said first face; a conductive lead having a first end and a second end opposite each other, said first end being conductively connected to said electrode, said second end being nonconductively connected to said second surface, said lead extending to said side face; and an insulating additional film member opposite said first face, wherein a predetermined space is between said additional film member and said first face and said additional film member is held by said first end, wherein said first end has a lead groove part, said insulating additional film member having an end part inserted into said lead groove part to thereby be held to said first end.

Claim 13

A mounting structure for use in mounting a semiconductor package on a circuit board, said semiconductor package including a semiconductor element having a first face, a second face opposite said first face, and a side face extending between said first and said second faces, an electrode provided on said first face, and a conductive lead having a first end and a second end opposite each other, said first end being conductively connected to said electrode, said second end being nonconductively connected to said second surface, said lead extending to said side face, wherein said lead has a bent part between said first and said second ends thereof, said bent part serving as a terminal part for being connected to said circuit board when said semiconductor package is mounted on said circuit board, said circuit board having a principal board surface, said mounting structure comprising: a wiring pattern formed on said principal board surface; a connector coupled to said circuit board for connecting said semiconductor package with said wiring pattern; and a stick-form elastic member between said side face and said bent part, said bent part being bent as to wrap said elastic member inwardly.

Claim 14

A mounting structure for use in mounting a semiconductor package on a circuit board, said semiconductor package including a semiconductor element having a first face, a second face opposite said first face, and a side face extending between said first and said second faces, an electrode provided on said first face, and a conductive lead having a first end and a second end opposite each other, said first end being conductively connected to said electrode, said second end being nonconductively connected to said second surface, said lead extending to said side face, wherein said lead has a bent part between said first and said second ends thereof, said bent part serving as a terminal part for being connected to said circuit board when said semiconductor package is mounted on said circuit board, said circuit board having a principal board surface, said mounting structure comprising: a wiring pattern formed on said principal board surface; a connector coupled to said circuit board for connecting said semiconductor package with said wiring pattern; and a stick-form elastic member between said side face and said bent part, said bent part being bent as to wrap said elastic member inwardly.

Claim 15

A mounting structure for use in mounting a semiconductor package on a circuit board, said semiconductor package including a semiconductor element having a first face, a second face opposite said first face, and a side face extending between said first and said second faces, an electrode provided on said first face, and a conductive lead having a first and a second end opposite each other, said first end being conductively connected to said electrode, said second end being nonconductively connected to said second surface, said lead extending to said side face, said circuit board having a principal board surface, said mounting structure comprising: a wiring pattern formed on said principal board surface; and a connector coupled to said circuit board for connecting said semiconductor package with said wiring pattern, wherein said connector comprises: a groove-defining surface connected to said principal board surface for defining an accommodation groove part which has a dimension of an adequate size for placing said semiconductor package; and a pattern electrode formed on said groove-defining surface and connected to said wiring pattern, said lead being brought into contact with said pattern electrode when said semiconductor package is placed in said accommodation groove part.

Claim 16

A mounting structure for use in mounting a semiconductor package on a circuit board, said semiconductor package including a semiconductor element having a first face, a second face opposite said first face, and a side face extending between said first and said second faces, an electrode provided on said first face, and a conductive lead having a first and a second end opposite each other, said first end being conductively connected to said electrode, said second end being nonconductively connected to said second surface, said lead extending to said side face, said circuit board having a principal board surface, said mounting structure comprising: a wiring pattern formed on said principal board surface; and a connector coupled to said circuit board for connecting said semiconductor package with said wiring pattern, wherein said connector comprises: a groove-defining surface connected to said principal board surface for defining an accommodation groove part which has a dimension of an adequate size for placing said semiconductor package; and a pattern electrode formed on said groove-defining surface and connected to said wiring pattern, said lead being brought into contact with said pattern electrode when said semiconductor package is placed in said accommodation groove part.

Claim 17

A mounting structure as claimed in claim 12, wherein said accommodation groove part is made in said circuit board.

Claim 18

A mounting structure as claimed in claim 12, wherein said accommodation groove part in formed on said principal board surface.

Claim 19

A mounting structure as claimed claim 12, further comprising a lead connected to said connector for sealing said accommodation groove part.

Claim 20

A mounting structure as claimed in claim 12, wherein said connector further comprises an additional pattern electrode formed on said groove-defining surface and connected to said wiring pattern, said additional pattern electrode being placed in a position which is different from that of said pattern electrode in a direction perpendicular to said principal board surface, the lead being brought into contact with said additional pattern electrode when said semiconductor package is placed in said accommodation groove part.

Claim 21

A mounting structure as claimed in claim 15, further comprising an additional member placed between said lid and said semiconductor element for holding said semiconductor package in said accommodation groove part.