Miniature electronic component

Abstract

Abstract PURPOSE:To enable the high mounting density and contrive not to have the restrictions of substrate material by a method wherein a lead connected to the upper surface of a ceramic package is passed along its side and then bent inward of the package in the lower part. CONSTITUTION:The leads 5 are connected to the upper surface of the ceramic package body 1, passed along the side of the body 1, and extend to the lower part of the body 1. Besides, the tip of the lead is bent inward. In this case, the effective length l of the lead 5 can be taken large sufficiently. Such a construction enables to obtain a mounting density close to that of leadless connection and further to impose no restrictions on the choice of the material for the mounted substrate.

Inventors

• 👤 Kanji Otsuka
• 👤 寛治 大塚
• 👤 Hajime Murakami
• 👤 元 村上

Bibliographic Details