US5883435A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Personalization structure for semiconductor devices
Assignee: International Business Machines Corp
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Filing: 1996-07-25
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Granted: 1999-03-16
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Expires: 2016-07-25
Abstract
Abstract The preferred embodiment of the present invention provides a structure and method for personalizing a semiconductor device in the context of a bump array connection to packaging, substrates and such. The preferred embodiment method uses a plurality of conduction lines on said semiconductor device, including a plurality of landing lines and personalization lines. Vias are opened to the plurality of landing lines and selectively opened to a portion of the personalization lines. Connections are made between the opened personalization lines with bumps deposited as part of the bump array.
Inventors
- 👤 Robert Michael Geffken
- 👤 William Thomas Motsiff
- 👤 Ronald R. Uttecht
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 08:20
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/49; H10W72/00; H10W72/01; H10W72/019; H10W72/20; H10W72/251; H10W72/50; H10W72/551; H10W72/552; H10W72/5524; H10W72/90; H10W72/921; H10W72/923; H10W72/931; H10W72/934; H10W72/936; H10W72/941; H10W72/9415; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
188 words
A personalization structure for personalizing a semiconductor device comprising: a) a plurality of conduction lines connecting to said semiconductor device, said plurality of conduction lines including a plurality of landing lines and including a plurality of personalization line sets, wherein each personalization line set comprises at least two personalization lines in relatively close proximity to each other, wherein said at least two personalization lines are each connected to said semiconductor device such that a connection between at least two personalization lines personalizes said device; b) an insulator layer formed over said plurality of conduction lines; c) a plurality of vias opened through said insulator layer to said plurality of landing lines; d) at least one via opened through said insulator layer to at least one of said plurality of said personalization line sets; and e) an array of connection bumps over said plurality of conduction lines; said array of connection bumps including at least one connection bump forming an connection to said at least one of said plurality of landing lines and at least one connection bump forming a connection between one of said sets of personalization lines.
Claim 2
Dependent Claim
188 words
A personalization structure for personalizing a semiconductor device comprising: a) a plurality of conduction lines connecting to said semiconductor device, said plurality of conduction lines including a plurality of landing lines and including a plurality of personalization line sets, wherein each personalization line set comprises at least two personalization lines in relatively close proximity to each other, wherein said at least two personalization lines are each connected to said semiconductor device such that a connection between at least two personalization lines personalizes said device; b) an insulator layer formed over said plurality of conduction lines; c) a plurality of vias opened through said insulator layer to said plurality of landing lines; d) at least one via opened through said insulator layer to at least one of said plurality of said personalization line sets; and e) an array of connection bumps over said plurality of conduction lines; said array of connection bumps including at least one connection bump forming an connection to said at least one of said plurality of landing lines and at least one connection bump forming a connection between one of said sets of personalization lines.
Claim 3
Dependent Claim
31 words
The personalization structure of claim 1 wherein said insulator layer comprises an insulator layer capable of having vias opened in said insulator layer by laser ablation without damaging said semiconductor device.
Claim 4
Dependent Claim
12 words
The personalization structure of claim 2 wherein said insulator layer comprises polyimide.
Claim 5
Dependent Claim
29 words
The personalization structure of claim 1 wherein said at least one via opened to at least one of said plurality of personalization line sets is opened using laser ablation.
Claim 6
Dependent Claim
26 words
The personalization structure of claim 1 further comprising an array of transition layers formed between said array of connection bumps and said plurality of conduction lines.
Claim 7
Dependent Claim
22 words
The personalization structure of claim 1 wherein said array of device connection bumps comprise an array of controlled collapse chip connection bumps.
Claim 8
Dependent Claim
16 words
The personalization structure of claim 1 further comprising transition layers atop said plurality of conduction lines.
Claim 9
Dependent Claim
60 words
The personalization structure of claim 1 further comprising contacts deposited above each of said landing lines and each of said personalization lines and wherein said plurality of vias opened to said plurality of landing lines and said at least one via opened to said at least one of said plurality of personalization line sets comprise vias opened to said contacts.
Claim 10
Dependent Claim
12 words
The personalization structure of claim 1 wherein said conduction lines comprise copper.
Claim 11
Dependent Claim
12 words
The personalization structure of claim 1 wherein said conduction lines comprise aluminum.
Claim 12
Dependent Claim
21 words
The personalization structure of claim 1 wherein said conduction lines are formed as part of interconnect wiring for the semiconductor device.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-03-15 | 2002-09-14 | 2003-03-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-03-15 | 2006-09-14 | 2007-03-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-03-15 | 2010-09-14 | 2011-03-16 | $7700.00 | Window Closed / Lapsed |