Patent US5877943A successfully refreshed from Google Patents.
US5877943A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Clustering adapter for spherical shaped devices
Assignee: Ball Semiconductor Inc
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Filing: 1998-03-26
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Granted: 1999-03-02
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Expires: 2018-03-26
Abstract
Abstract An apparatus and method for connecting and interconnecting spherical ICs. The apparatus includes an enclosure which is used to hold and secure one or more spherical ICs or to connect to a device such as a printed circuit board. The enclosure includes two groups of electrical contact points. These contact points may be solder bumps, pads, leads, or any other type of connector. One group of contact points on the enclosure aligns and connects with a corresponding set of contact points on the first spherical shaped IC and the other group of contact points on the enclosure aligns and connects with a corresponding set of contact points on the other device. The two groups of enclosure contact points are interconnected with each other through a circuit located inside the enclosure. As a result, alignment is no longer required by the contact points on the spherical shaped IC and the other device.
Inventors
- 👤 Ram Ramamurthi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:30
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/301; H10; H10D; H10D62/00; H10D62/10; H10D62/117; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/722
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
104 words
An apparatus for electrically connecting a first spherical shaped integrated circuit (IC) to another device, the apparatus comprising: an enclosure; a first group of electrical contact points attached to the enclosure for connecting with a second group of electrical contact points on the spherical shaped IC; a third group of electrical contact points attached to the enclosure for connecting with a fourth group of electrical contact points on the device, wherein the second group of electrical contact points are not aligned with the fourth group; means for electrically connecting the first group of electrical contact points with the third group of electrical contact points.
Claim 2
Independent Claim
104 words
An apparatus for electrically connecting a first spherical shaped integrated circuit (IC) to another device, the apparatus comprising: an enclosure; a first group of electrical contact points attached to the enclosure for connecting with a second group of electrical contact points on the spherical shaped IC; a third group of electrical contact points attached to the enclosure for connecting with a fourth group of electrical contact points on the device, wherein the second group of electrical contact points are not aligned with the fourth group; means for electrically connecting the first group of electrical contact points with the third group of electrical contact points.
Claim 3
Dependent Claim
20 words
The apparatus of claim 1 wherein the enclosure includes a retaining cup for holding and securing the spherical shaped IC.
Claim 4
Independent Claim
123 words
An apparatus for electrically connecting a first spherical shaped integrated circuit (IC) to another device, the apparatus comprising: an enclosure physically connected to the device; a first group of electrical contact points attached to the enclosure for connecting with a second group of electrical contact points on the spherical shaped IC; a third group of electrical contact points attached to the enclosure for connecting with a fourth group of electrical contact points on the device, wherein the second group of electrical contact points are not aligned with the fourth group; means for electrically connecting the first group of electrical contact points with the third group of electrical contact points wherein the device is either a second spherical shaped IC or a circuit board.
Claim 5
Independent Claim
123 words
An apparatus for electrically connecting a first spherical shaped integrated circuit (IC) to another device, the apparatus comprising: an enclosure physically connected to the device; a first group of electrical contact points attached to the enclosure for connecting with a second group of electrical contact points on the spherical shaped IC; a third group of electrical contact points attached to the enclosure for connecting with a fourth group of electrical contact points on the device, wherein the second group of electrical contact points are not aligned with the fourth group; means for electrically connecting the first group of electrical contact points with the third group of electrical contact points wherein the device is either a second spherical shaped IC or a circuit board.
Claim 6
Dependent Claim
20 words
The apparatus of claim 3 wherein each of the electrical connections between the attached electrical contact points utilize solder bumps.
Claim 7
Dependent Claim
20 words
The apparatus of claim 3 wherein the means for electrically connecting includes a plurality of conductors contained within the enclosure.
Claim 8
Dependent Claim
19 words
The apparatus of claim 3 wherein the means for electrically connecting includes a circuit board contained within the enclosure.
Claim 9
Dependent Claim
20 words
The apparatus of claim 6 wherein the circuit board includes a plurality of traces and one or more electrical structures.
Claim 10
Dependent Claim
25 words
The apparatus of claim 3 wherein the means for electrically connecting includes a circuit board and a plurality of conductors, all contained within the enclosure.
Claim 11
Dependent Claim
15 words
The apparatus of claim 8 wherein the circuit board includes at least one electrical device.
Claim 12
Dependent Claim
20 words
The apparatus of claim 3 wherein the enclosure includes a retaining cup for holding and securing the spherical shaped IC.
Claim 13
Independent Claim
140 words
A method for electrically connecting a first spherical shaped integrated circuit (IC) to another device, the method comprising: supporting the first spherical shaped IC with an enclosure; electrically contacting predetermined solder bumps on the first spherical shaped IC and the device with solder pads connected to the enclosure; electrically connecting a first solder pad electrically contacting a first predetermined solder bump on the first spherical shaped IC with a second solder pad electrically contacting a first predetermined solder bump on the device; electrically connecting a third solder pad electrically contacting a second predetermined solder bump on the first spherical shaped IC with a fourth solder pad electrically contacting a second predetermined solder bump on the device; wherein the first predetermined solder bump on the first spherical shaped IC is physically aligned with the second predetermined solder bump on the device.
Claim 14
Independent Claim
140 words
A method for electrically connecting a first spherical shaped integrated circuit (IC) to another device, the method comprising: supporting the first spherical shaped IC with an enclosure; electrically contacting predetermined solder bumps on the first spherical shaped IC and the device with solder pads connected to the enclosure; electrically connecting a first solder pad electrically contacting a first predetermined solder bump on the first spherical shaped IC with a second solder pad electrically contacting a first predetermined solder bump on the device; electrically connecting a third solder pad electrically contacting a second predetermined solder bump on the first spherical shaped IC with a fourth solder pad electrically contacting a second predetermined solder bump on the device; wherein the first predetermined solder bump on the first spherical shaped IC is physically aligned with the second predetermined solder bump on the device.
Claim 15
Dependent Claim
21 words
The method of claim 11 further comprising: electrically connecting one or more electrical structures between the first and second solder pads.
Claim 16
Dependent Claim
25 words
The method of claim 11 wherein the steps for electrically connecting utilize a circuit board and a plurality of conductors, all contained within the enclosure.
Claim 17
Dependent Claim
28 words
The method of claim 11 further comprising: thermally connecting the predetermined solder bumps on the first spherical shaped IC and the device with the electrically corresponding solder pads.
Claim 18
Dependent Claim
12 words
The method of claim 11 wherein the device is a circuit board.
Claim 19
Dependent Claim
14 words
The method of claim 11 wherein the device is a second spherical shaped IC.
Claim 20
Dependent Claim
11 words
The method of claim 11 wherein the device is a chip.
Claim 21
Dependent Claim
94 words
An adapter for electrically connecting two spherical shaped integrated circuit (ICs) comprising: an enclosure including two retaining cups for holding and securing the two spherical shaped ICs, respectively; a first group of electrical contact points attached to the enclosure for connecting with electrical contact points on the first spherical shaped IC; a second group of electrical contact points attached to the enclosure for connecting with electrical contact points on the second spherical shaped IC; a circuit for electrically connecting the first group of electrical contact points with the second group of electrical contact points.
Claim 22
Dependent Claim
94 words
An adapter for electrically connecting two spherical shaped integrated circuit (ICs) comprising: an enclosure including two retaining cups for holding and securing the two spherical shaped ICs, respectively; a first group of electrical contact points attached to the enclosure for connecting with electrical contact points on the first spherical shaped IC; a second group of electrical contact points attached to the enclosure for connecting with electrical contact points on the second spherical shaped IC; a circuit for electrically connecting the first group of electrical contact points with the second group of electrical contact points.
Claim 23
Dependent Claim
20 words
The adapter of claim 18 further connecting the two spherical shaped ICs to a circuit board contained within the enclosure.
Claim 24
Dependent Claim
20 words
The apparatus of claim 19 wherein the circuit board includes a plurality of traces and one or more electrical structures.
Claim 25
Dependent Claim
20 words
The adapter of claim 18 wherein the second group of electrical contact points are not aligned with the first group.
Claim 26
Dependent Claim
20 words
The apparatus of claim 18 wherein the circuit for electrically connecting includes a plurality of conductors contained within the enclosure.
Claim 27
Dependent Claim
19 words
The apparatus of claim 18 wherein the circuit for electrically connecting includes a circuit board contained within the enclosure.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-03-01 | 2002-08-31 | 2003-03-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-03-01 | 2006-08-31 | 2007-03-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-03-01 | 2010-08-31 | 2011-03-02 | $7700.00 | Window Closed / Lapsed |