Curable liquid-form composition, cured product of the same, and electronic part

Claim 2

A curable liquid-form composition, comprising: A) a curable, non-crosslinked liquid-form organopolysiloxane composition; and B) a curable liquid-form organic resin composition; wherein said curable liquid-form organic resin composition is contained in said curable liquid-form organopolysiloxane composition as liquid particles and wherein said curable liquid-form organopolysiloxane composition is curable via a hydroxilylation reaction.

Claim 3

The curable liquid-form composition claimed in claim 1, wherein the curable liquid-form organic resin composition comprises 0.01 to 80 wt % of said curable liquid-form composition.

Claim 4

The curable liquid-form composition claimed in claim 1, wherein the mean particle size of the liquid particles is less than or equal to 1 mm.

Claim 5

The curable liquid-form composition claimed in claim 1, wherein the heat-curable liquid-form organic resin composition comprises (i) 100 parts by weight of a liquid-form epoxy resin having at least two epoxy groups per molecule, (ii) 0.1 to 200 parts by weight of a silanol-terminated diorganosiloxane oligomer; and (iii) a curing catalyst, in an amount sufficient to cure the heat-curable liquid-form epoxy resin composition.

Claim 6

The curable liquid-form composition claimed in claim 4, wherein at least 10 mol % of the silicon-bonded organic groups in component (ii) are phenyl groups.

Claim 7

The curable liquid-form composition claimed in claim 1, wherein at least one of the curable liquid-form organopolysiloxane composition and the curable liquid-form organic resin composition contain a polysiloxane having the average unit formula: (R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.d wherein R 1 is an epoxy group-containing monovalent organic group; R 2 is individually selected from monovalent hydrocarbon groups; R 3 is a hydrogen atom or an alkyl group having 4 or fewer carbon atoms; a, b and d are respective positive numbers; and c is 0 or a positive number.

Claim 8

The curable liquid-form composition claimed in claim 6, wherein the polysiloxane is prepared by subjecting I) an epoxy-group-containing trialkoxysilane having the general formula R.sup.1 Si(OR.sup.4).sub.3 wherein R 1 is an epoxy-group containing a monovalent organic group, and R 4 is an alkyl group having 4 or fewer carbon atoms, and II) a compound selected from the group consisting of a) diorganosiloxanes having the general formula: ##STR9## wherein each R 2 is individually selected from the group consisting of substituted or unsubstituted monovalent hydrocarbon groups; and m is an integer having a value of at least 3; and b) linear diorganosiloxanes having the general formula: ##STR10## wherein each R 2 is individually selected from the group consisting of substituted or unsubstituted monovalent hydrocarbon groups; each R 5 is individually selected from the group consisting of a hydroxy group, alkoxy groups with 4 or fewer carbon atoms, and substituted or unsubstituted monovalent hydrocarbon groups, and n is an integer having a value of at least 1; to equilibrium polymerization in the presence of a polymerization catalyst selected from the group consisting of acidic and alkaline polymerization catalysts.

Claim 9

A cured product comprising (i) fine particles of a cured organic resin; and (ii) a cured organopolysiloxane; wherein said fine particles of said cured organic resin are contained in a matrix of said cured organopolysiloxane and wherein said cured organopolysiloxane is prepared by curing the curable liquid-form composition of claim 1.

Claim 10

An electronic part comprising: 1) an electronic device; and 2) the cured product of claim 8; wherein said electronic device is sealed with said cured product.