Resin composition for sealing semiconductor

Abstract

Abstract PURPOSE:To obtain the subject resin composition with low stress excellent in thermal shock and solder heat resistance by blending a modified epoxy resin with a bismaleimide compound, phenol-aralkyl resin and/or resol-aralkyl resin and inorganic filler. CONSTITUTION:(A) A modified epoxy resin containing uniformly dispersed silicone polymer with <=1mum particle size prepared by additional reaction of an addition reaction type silicon polymer in the presence of a graft polymer between an epoxy resin and a vinyl polymer or by polymerization of a vinyl- modified silicone with another arbitrary monomer, (B) a bismaleimide of the formula (R is >=2C divalent organic group), (C) a phenol-aralkyl resin and/or resol-aralkyl resin and (D) an inorganic filler are blended as the main components in such a ratio that (B) is 30-80wt.% of the total composition, (C) 10-500 pts.wt. based on 100 pts.wt. (B), (A) 0.1-10 equivalent ratio based on (C) and (D) 100-600 pts.wt. based on 100 pts.wt. composition, thus obtaining the subject resin composition for sealing semiconductors.

Inventors

• 👤 Koichi Machida
• 👤 町田　貢一
• 👤 Mikio Kitahara
• 👤 北原　幹夫
• 👤 Takayuki Kubo
• 👤 久保　隆幸
• 👤 Motoyuki Torikai
• 👤 基之 鳥飼
• 👤 Kotaro Asahina
• 👤 浩太郎 朝比奈

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