Epoxy resin molding material

Abstract

Abstract PURPOSE:To obtain an epoxy resin molding material improved in cracking resistance without increasing its coefficient of linear expansion, by adding a two-pack curable silicone rubber to an epoxy resin. CONSTITUTION:A two-pack curable silicone rubber (e.g., a condensed silicone rubber prepared by adding a trifunctional silane and a platinum compound to a diorganosiloxane having terminal functional groups) is added to an epoxy resin molding material prepared by adding additives such as a crosslinking agent, a cure accelerator, a mold release, a colorant, a coupling agent and a filler to an epoxy resin. This molding material is improved in cracking resistance without increasing its coefficient of linear expansion, and is used chiefly for a resin molding for sealing electrical and electronic components.

Inventors

• 👤 Yasuhiro Kyotani
• 👤 Hirohiko Kagawa

Bibliographic Details