Patent US5869893A successfully refreshed from Google Patents.
US5869893A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device having a trapezoidal joint chip
Assignee: Seiko Instruments Inc
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Filing: 1997-03-12
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Granted: 1999-02-09
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Expires: 2017-03-12
Abstract
Abstract A semiconductor device comprises at least two semiconductor elements connected together at a connecting region of the semiconductor elements. At least one joint chip is adhered to the connection region of the semiconductor elements for connecting the semiconductor elements together. The joint chip has a trapezoidal cross-section defining a first surface and a second surface wider than the first surface. The second surface of the joint chip is adhered to the connection region of the semiconductor elements.
Inventors
- 👤 Osamu Koseki
- 👤 Takichi Ishii
- 👤 Masaaki Mandai
- 👤 Tomoyuki Yoshino
- 👤 Hitoshi Takeuchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 09:38
CPC Classifications
H; H10; H10W; H10W90/00; H10W70/00; H10W70/099; H10W70/60; H10W70/611; H10W70/614; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/90; H10W72/941; H10W72/9413; H10W90/10; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/754; H10W99/00; Y; Y10; Y10S; Y10S438/00; Y10S438/94
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
48 words
A semiconductor device comprising: a plurality of semiconductor elements; and a joint chip for joining together respective ones of the semiconductor elements, the joint chip having a trapezoidal cross-section defining a wide plane and a narrow plane, and the narrow plane not being connected to the semiconductor elements.
Claim 2
Dependent Claim
48 words
A semiconductor device comprising: a plurality of semiconductor elements; and a joint chip for joining together respective ones of the semiconductor elements, the joint chip having a trapezoidal cross-section defining a wide plane and a narrow plane, and the narrow plane not being connected to the semiconductor elements.
Claim 3
Dependent Claim
23 words
A semiconductor device as claimed in claim 1; further comprising an insulating film formed of a polymer material disposed over the joint chip.
Claim 4
Dependent Claim
16 words
A semiconductor device as claimed in claim 1; wherein the joint chip is formed of glass.
Claim 5
Dependent Claim
16 words
A semiconductor device as claimed in claim 1; wherein the joint chip is formed of silicon.
Claim 6
Dependent Claim
22 words
A semiconductor device as claimed in claim 1; further comprising an epoxy-based adhesive for adhering the joint chip to the semiconductor elements.
Claim 7
Dependent Claim
47 words
A semiconductor device comprising: at least two semiconductor elements connected together at a connecting region of the semiconductor elements; and at least one joint chip adhered to the connecting region of the semiconductor elements for connecting the semiconductor elements together, the joint chip having a trapezoidal cross-section.
Claim 8
Dependent Claim
47 words
A semiconductor device comprising: at least two semiconductor elements connected together at a connecting region of the semiconductor elements; and at least one joint chip adhered to the connecting region of the semiconductor elements for connecting the semiconductor elements together, the joint chip having a trapezoidal cross-section.
Claim 9
Dependent Claim
38 words
A semiconductor device as claimed in claim 6; wherein the joint chip has a first surface and a second surface wider than the first surface, the second surface being adhered to the connecting region of the semiconductor elements.
Claim 10
Dependent Claim
27 words
A semiconductor device as claimed in claim 6; further comprising an insulating film formed of a polymer material disposed over the connecting region of the semiconductor elements.
Claim 11
Dependent Claim
16 words
A semiconductor device as claimed in claim 6; wherein the joint chip is formed of glass.
Claim 12
Dependent Claim
16 words
A semiconductor device as claimed in claim 6; wherein the joint chip is formed of silicon.
Claim 13
Dependent Claim
22 words
A semiconductor device as claimed in claim 6; further comprising an epoxy-based adhesive for adhering the joint chip to the semiconductor elements.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-02-08 | 2002-08-10 | 2003-02-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-02-08 | 2006-08-10 | 2007-02-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-02-08 | 2010-08-10 | 2011-02-09 | $7700.00 | Window Closed / Lapsed |