Patent US5869886A successfully refreshed from Google Patents.
US5869886A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flip chip semiconductor mounting structure with electrically conductive resin
Assignee: NEC Corp
•
Filing: 1997-03-24
•
Granted: 1999-02-09
•
Expires: 2017-03-24
Abstract
Abstract A semiconductor chip is flip chip bonded on a substrate wherein the semiconductor chip has a first surface on which bumps are provided. An insulating sealing resin is provided in a space defined between the semiconductor chip and the substrate and also around the semiconductor chip. An electrically conductive resin is provided which extends over a least a part of a second surface of the semiconductor chip, a part of the sealing resin and a ground pattern provided over the substrate.
Inventors
- 👤 Kenichi Tokuno
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 23:07
CPC Classifications
H; H10; H10W; H10W42/00; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W70/00; H10W70/099; H10W70/60; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/07331; H10W72/30; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856; H10W72/874; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
214 words
A flip chip mounting structure comprising: a semiconductor chip having a first surface on which a plurality of bumps are provided, and a second surface; a substrate having a bonding surface on which mounting pads are provided to facilitate said bumps being bonded with said mounting pads to bond said semiconductor chip to said substrate; an insulation sealing material provided in a space defined between said first surface of said semiconductor chip and said bonding surface of said substrate; a conductive pattern selectively provided over at least a part of said substrate positioned around said semiconductor chip, said conductive pattern being electrically connected to a ground potential; an electrically conductive resin extending over at least a part of said second surface of said semiconductor chip, a part of said insulation sealing material, a part of said substrate, and a part of said conductive pattern, said conductive resin electrically connecting said semiconductor chip to said conductive pattern so as to keep said semiconductor chip at said ground potential with stability; and a solder resist film provided on said bonding surface of said substrate, said solder resist film being disposed so as not to contact said bumps and so as to leave exposed at least a portion of the conductive pattern adjacent to said semiconductor chip.
Claim 2
Dependent Claim
214 words
A flip chip mounting structure comprising: a semiconductor chip having a first surface on which a plurality of bumps are provided, and a second surface; a substrate having a bonding surface on which mounting pads are provided to facilitate said bumps being bonded with said mounting pads to bond said semiconductor chip to said substrate; an insulation sealing material provided in a space defined between said first surface of said semiconductor chip and said bonding surface of said substrate; a conductive pattern selectively provided over at least a part of said substrate positioned around said semiconductor chip, said conductive pattern being electrically connected to a ground potential; an electrically conductive resin extending over at least a part of said second surface of said semiconductor chip, a part of said insulation sealing material, a part of said substrate, and a part of said conductive pattern, said conductive resin electrically connecting said semiconductor chip to said conductive pattern so as to keep said semiconductor chip at said ground potential with stability; and a solder resist film provided on said bonding surface of said substrate, said solder resist film being disposed so as not to contact said bumps and so as to leave exposed at least a portion of the conductive pattern adjacent to said semiconductor chip.
Claim 3
Dependent Claim
20 words
The flip chip mounting structure as claimed in claim 1, wherein said electrically conductive resin is a silver epoxy resin.
Claim 4
Dependent Claim
20 words
The flip chip mounting structure as claimed in claim 1, wherein said electrically conductive resin is a copper epoxy resin.
Claim 5
Dependent Claim
21 words
The flip chip mounting structure as claimed in claim 1, wherein said electrically conductive resin is a silver palladium epoxy resin.
Claim 6
Dependent Claim
20 words
The flip chip mounting structure as claimed in claim 1, wherein said electrically conductive resin is a palladium epoxy resin.
Claim 7
Dependent Claim
35 words
The flip chip mounting structure as claimed in claim 1, further comprising a metal film provided on said second surface of said semiconductor chip so that said electrically conductive resin extends over said metal film.
Claim 8
Dependent Claim
16 words
The flip chip mounting structure as claimed in claim 6, wherein said metal film comprises gold.
Claim 9
Dependent Claim
206 words
A flip chip mounting structure comprising: a semiconductor chip having a first surface on which a plurality of bumps are provided, and a second surface; a substrate having a bonding surface on which mounting pads are provided to facilitate said bumps being bonded with said mounting pads to bond said semiconductor chip to said substrate; an insulation sealing material provided in a space defined between said first surface of said semiconductor chip and said bonding surface of said substrate; a conductive pattern selectively provided over at least a part of said substrate positioned around said semiconductor chip, said conductive pattern being electrically connected to a ground potential; an electrically conductive resin extending between at least a part of said second surface of said semiconductor chip, a part of said substrate, and a part of said conductive pattern, said conductive resin electrically connecting said semiconductor chip to said conductive pattern so as to keep said semiconductor chip at said ground potential stability; and a solder resist film provided on said bonding surface of said substrate, said solder resist film being disposed so as not to contact said bumps and so as to leave exposed at least a portion of the conductive pattern adjacent to said semiconductor chip.
Claim 10
Dependent Claim
206 words
A flip chip mounting structure comprising: a semiconductor chip having a first surface on which a plurality of bumps are provided, and a second surface; a substrate having a bonding surface on which mounting pads are provided to facilitate said bumps being bonded with said mounting pads to bond said semiconductor chip to said substrate; an insulation sealing material provided in a space defined between said first surface of said semiconductor chip and said bonding surface of said substrate; a conductive pattern selectively provided over at least a part of said substrate positioned around said semiconductor chip, said conductive pattern being electrically connected to a ground potential; an electrically conductive resin extending between at least a part of said second surface of said semiconductor chip, a part of said substrate, and a part of said conductive pattern, said conductive resin electrically connecting said semiconductor chip to said conductive pattern so as to keep said semiconductor chip at said ground potential stability; and a solder resist film provided on said bonding surface of said substrate, said solder resist film being disposed so as not to contact said bumps and so as to leave exposed at least a portion of the conductive pattern adjacent to said semiconductor chip.
Claim 11
Dependent Claim
20 words
The flip chip mounting structure as claimed in claim 8, wherein said electrically conductive resin is a silver epoxy resin.
Claim 12
Dependent Claim
20 words
The flip chip mounting structure as claimed in claim 8, wherein said electrically conductive resin is a copper epoxy resin.
Claim 13
Dependent Claim
21 words
The flip chip mounting structure as claimed in claim 8, wherein said electrically conductive resin is a silver palladium epoxy resin.
Claim 14
Dependent Claim
20 words
The flip chip mounting structure as claimed in claim 8, wherein said electrically conductive resin is a palladium epoxy resin.
Claim 15
Dependent Claim
35 words
The flip chip mounting structure as claimed in claim 8, further comprising a metal film provided on said second surface of said semiconductor chip so that said electrically conductive resin extends over said metal film.
Claim 16
Dependent Claim
16 words
The flip chip mounting structure as claimed in claim 13, wherein said metal film comprises gold.
Claim 17
Dependent Claim
138 words
A flip chip mounting structure comprising: a semiconductor chip having a first surface on which a plurality of bumps are provided, and a second surface; a substrate having a bonding surface on which mounting pads are provided to facilitate said bumps being bonded with said mounting pads to bond said semiconductor chip to said substrate; a conductive pattern selectively provided over at least a part of said substrate positioned around said semiconductor chip, said conductive pattern being electrically connected to a ground potential; an electrically conductive resin extending between at least a part of said second surface of said semiconductor chip, a part of said substrate, and a part of said conductive pattern, said conductive resin electrically connecting said semiconductor chip to said conductive pattern so as to keep said semiconductor chip at said ground potential with stability.
Claim 18
Dependent Claim
138 words
A flip chip mounting structure comprising: a semiconductor chip having a first surface on which a plurality of bumps are provided, and a second surface; a substrate having a bonding surface on which mounting pads are provided to facilitate said bumps being bonded with said mounting pads to bond said semiconductor chip to said substrate; a conductive pattern selectively provided over at least a part of said substrate positioned around said semiconductor chip, said conductive pattern being electrically connected to a ground potential; an electrically conductive resin extending between at least a part of said second surface of said semiconductor chip, a part of said substrate, and a part of said conductive pattern, said conductive resin electrically connecting said semiconductor chip to said conductive pattern so as to keep said semiconductor chip at said ground potential with stability.
Claim 19
Dependent Claim
20 words
The flip chip mounting structure as claimed in claim 15, wherein said electrically conductive resin is a silver epoxy resin.
Claim 20
Dependent Claim
20 words
The flip chip mounting structure as claimed in claim 15, wherein said electrically conductive resin is a copper epoxy resin.
Claim 21
Dependent Claim
21 words
The flip chip mounting structure as claimed in claim 15, wherein said electrically conductive resin is a silver palladium epoxy resin.
Claim 22
Dependent Claim
20 words
The flip chip mounting structure as claimed in claim 15, wherein said electrically conductive resin is a palladium epoxy resin.
Claim 23
Dependent Claim
35 words
The flip chip mounting structure as claimed in claim 15, further comprising a metal film provided on said second surface of said semiconductor chip so that said electrically conductive resin extends over said metal film.
Claim 24
Dependent Claim
16 words
The flip chip mounting structure as claimed in claim 20, wherein said metal film comprises gold.
Claim 25
Dependent Claim
36 words
The flip chip mounting structure as claimed in claim 15, further comprising an insulation sealing material provided in a space defined between said first surface of said semiconductor chip and said bonding surface of said substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-02-08 | 2002-08-10 | 2003-02-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-02-08 | 2006-08-10 | 2007-02-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-02-08 | 2010-08-10 | 2011-02-09 | $7700.00 | Window Closed / Lapsed |