Patent US5869883A successfully refreshed from Google Patents.
US5869883A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaging of semiconductor circuit in pre-molded plastic package
Assignee: PanTronix Corp
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Filing: 1997-09-26
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Granted: 1999-02-09
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Expires: 2017-09-26
Abstract
Abstract An inexpensive pre-molded package for electronic semiconductor circuit with increased thermal extraction capability, improved electrical performance, improved dielectric constant of sealing medium, optically transmissive sealing lid, and partially reduced electromagnetic radiation. In one embodiment, the pre-molded package includes electronic semiconductor circuit, a plurality of electrically conductive leads, a heat spreader, a plurality of electrically conductive bond wires, and a seal lid. Preferably, a surface of the heat spreader remains exposed to the exterior of the pre-molded package. In another embodiment, the pre-molded package includes a semiconductor circuit, a plurality of electrically conductive leads, a heat spreader, a plurality of electrically conductive bond wires, and an optically transmissive seal lid.
Inventors
- 👤 Larry H. Mehringer
- 👤 Charlie Oh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:06
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/01; H10W74/016; H10W76/00; H10W76/40; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 38
Claim 1
Independent Claim
166 words
A pre-molded package structure for electronic circuit components comprising: (a) a lead frame defining a semiconductor circuit location having terminal leads extending therefrom; (b) a pre-molded body of plastic material enclosing the lead frame semiconductor circuit location and defining a package having opposed sides and opposed edges with terminal leads extending from at least one of said opposed edges; (c) an electronic semiconductor circuit positioned in said semiconductor circuit location and in electrical communication with said terminal leads; and (d) a body of thermally conductive material partially contained within said pre-molded body of plastic, said body of thermally conductive material having first and second opposed major faces and a retaining flange extending inward and at least partially defining the edge surfaces thereof connected to said lead frame with said first major face in thermal contact with said electronic semiconductor circuit and said second major face substantially parallel with and adjacent one of said opposed sides of said package extending to the surface of the package body.
Claim 2
Dependent Claim
166 words
A pre-molded package structure for electronic circuit components comprising: (a) a lead frame defining a semiconductor circuit location having terminal leads extending therefrom; (b) a pre-molded body of plastic material enclosing the lead frame semiconductor circuit location and defining a package having opposed sides and opposed edges with terminal leads extending from at least one of said opposed edges; (c) an electronic semiconductor circuit positioned in said semiconductor circuit location and in electrical communication with said terminal leads; and (d) a body of thermally conductive material partially contained within said pre-molded body of plastic, said body of thermally conductive material having first and second opposed major faces and a retaining flange extending inward and at least partially defining the edge surfaces thereof connected to said lead frame with said first major face in thermal contact with said electronic semiconductor circuit and said second major face substantially parallel with and adjacent one of said opposed sides of said package extending to the surface of the package body.
Claim 3
Dependent Claim
57 words
A structure as defined in claim 1 wherein said lead frame includes a die paddle with a secured semiconductor circuit and said first major face of said thermally conductive body is secured to said die paddle with pressure sensitive foil, thermal grease filled with aluminum oxide, or the like and said thermally conductive body is barrier plated.
Claim 4
Dependent Claim
59 words
A structure as defined in claim 1 wherein said lead frame includes a die paddle with a secured semiconductor circuit and said first major face of said thermally conductive body is secured to said upper-face of semiconductor circuit with pressure sensitive foil, thermal grease filled with aluminum oxide, or the like and said thermally conductive body is barrier plated.
Claim 5
Dependent Claim
109 words
A structure as defined in claim 1 wherein said lead frame includes a die paddle with a secured semiconductor circuit and said first major face of said thermally conductive body is secured to said die paddle with pressure sensitive foil, thermal grease filled with aluminum oxide, or the like and said thermally conductive body is barrier plated; and said lead frame includes a die paddle with a secured semiconductor circuit and said first major face of said thermally conductive body is secured to said upper-face of semiconductor circuit with pressure sensitive foil, thermal grease filled with aluminum oxide, or the like and said thermally conductive body is barrier plated.
Claim 6
Dependent Claim
112 words
A structure as defined in claim 1 wherein said lead frame includes a die paddle with a secured rerouting board and said first major face of said thermally conductive body is secured to said die paddle with pressure sensitive foil, thermal grease filled with aluminum oxide, or the like and said thermally conductive body is barrier plated; and said lead frame includes a die paddle secured rerouting board with a secured semiconductor circuit and said first major face of said thermally conductive body is secured to said upper-face of semiconductor circuit with pressure sensitive foil, thermal grease filled with aluminum oxide, or the like and said thermally conductive body is barrier plated.
Claim 7
Dependent Claim
25 words
A structure as in claim 1, further comprising a barrier metal plated heat spreader composed of copper, oxygen-free high thermal conductivity copper or the like.
Claim 8
Dependent Claim
26 words
A structure as in claim 1, further comprising a pressure sensitive foil composed of copper, aluminum or the like to attach heat spreader to die paddle.
Claim 9
Dependent Claim
26 words
A structure as in claim 1, further comprising a pressure sensitive foil composed of copper, aluminum or the like to attach heat spreader to rerouting board.
Claim 10
Dependent Claim
32 words
A structure as in claim 1, further comprising a thermal grease composed of thermal grease and filled with aluminum oxide, aluminum nitride or the like, to attach heat spreader to die paddle.
Claim 11
Dependent Claim
32 words
A structure as in claim 1, further comprising a thermal grease composed of thermal grease and filled with aluminum oxide, aluminum nitride or the like, to attach heat spreader to rerouting board.
Claim 12
Dependent Claim
26 words
A structure as in claim 1, further comprising a pressure sensitive foil composed of copper, aluminum or the like to attach heat spreader to semiconductor circuit.
Claim 13
Dependent Claim
32 words
A structure as in claim 1, further comprising a thermal grease composed of thermal grease and filled with aluminum oxide, aluminum nitride or the like, to attach heat spreader to semiconductor circuit.
Claim 14
Dependent Claim
33 words
A structure as in claim 1, wherein at least one inwardly extending retaining flange is formed around the circumference of the exposed body section of the heat spreader to provide a mechanical interlock.
Claim 15
Dependent Claim
41 words
A structure as in claim 1, wherein the arrangement of heat spreader metal body increases the surface area of the heat spreader and provides for ejection molding without mold flash or molding compound on the heat spreader exposed improved surface area.
Claim 16
Dependent Claim
40 words
A structure as in claim 1, wherein at least one transmissive lens is formed in the seal lid to provide path for ultra violet, infrared, or optical rays to penetrate from the pre-molded package plastic body to the external environment.
Claim 17
Dependent Claim
165 words
A pre-molded package structure for electronic circuit components comprising: (a) a lead frame defining a semiconductor circuit location having terminal leads extending therefrom; (b) a pre-molded body of plastic material defining the lead frame semiconductor circuit location and defining a pre-molded package having opposed sides and opposed edges with terminal leads extending from at least one of said opposed edges; (c) an electronic semiconductor circuit positioned in said semiconductor circuit location and in electrical communication with said terminal leads; and (d) a body of thermally conductive material contained within said pre-molded body of plastic, said body of thermally conductive material having first and second opposed major faces and a retaining flange extending inward and at least partially defining the edge surfaces thereof connected to said lead frame with said first major face in thermal contact with said electronic semiconductor circuit and said second major face substantially parallel with and adjacent one of said opposed sides of said package but covered with a seal lid material.
Claim 18
Dependent Claim
165 words
A pre-molded package structure for electronic circuit components comprising: (a) a lead frame defining a semiconductor circuit location having terminal leads extending therefrom; (b) a pre-molded body of plastic material defining the lead frame semiconductor circuit location and defining a pre-molded package having opposed sides and opposed edges with terminal leads extending from at least one of said opposed edges; (c) an electronic semiconductor circuit positioned in said semiconductor circuit location and in electrical communication with said terminal leads; and (d) a body of thermally conductive material contained within said pre-molded body of plastic, said body of thermally conductive material having first and second opposed major faces and a retaining flange extending inward and at least partially defining the edge surfaces thereof connected to said lead frame with said first major face in thermal contact with said electronic semiconductor circuit and said second major face substantially parallel with and adjacent one of said opposed sides of said package but covered with a seal lid material.
Claim 19
Dependent Claim
55 words
A structure as defined in claim 16 wherein said lead frame includes a die paddle with a secured semiconductor circuit and said first major face of said thermally conductive body is secured to said die paddle with pressure sensitive foil, aluminum filled thermal grease, or the like and said thermally conductive body is barrier plated.
Claim 20
Dependent Claim
59 words
A structure as defined in claim 16 wherein said lead frame includes a die paddle with a secured semiconductor circuit and said first major face of said thermally conductive body is secured to said upper-face of semiconductor circuit with pressure sensitive foil, thermal grease filled with aluminum oxide, or the like and said thermally conductive body is barrier plated.
Claim 21
Dependent Claim
109 words
A structure as defined in claim 16 wherein said lead frame includes a die paddle with a secured semiconductor circuit and said first major face of said thermally conductive body is secured to said die paddle with pressure sensitive foil, thermal grease filled with aluminum oxide, or the like and said thermally conductive body is barrier plated; and said lead frame includes a die paddle with a secured semiconductor circuit and said first major face of said thermally conductive body is secured to said upper-face of semiconductor circuit with pressure sensitive foil, thermal grease filled with aluminum oxide, or the like and said thermally conductive body is barrier plated.
Claim 22
Dependent Claim
114 words
A structure as defined in claim 16 wherein said lead frame includes a die paddle with a secured rerouting board and said first major face of said thermally conductive body is secured to said die paddle with pressure sensitive foil, thermal grease filled with aluminum oxide or the like and said thermally conductive body is barrier plated; and said lead frame includes a die paddle secured rerouting board with a secured semiconductor circuit and said first major face of said thermally conductive body is secured to said upper-face of semiconductor circuit with no adhesive, pressure sensitive foil, thermal grease filled with aluminum oxide, or the like and said thermally conductive body is barrier plated.
Claim 23
Dependent Claim
25 words
A structure as in claim 16, further comprising a barrier metal plated heat spreader composed of copper, oxygen-free high thermal conductivity copper, or the like.
Claim 24
Dependent Claim
26 words
A structure as in claim 16, further comprising a pressure sensitive foil composed of copper, aluminum, or the like to attach heat spreader to die paddle.
Claim 25
Dependent Claim
26 words
A structure as in claim 16, further comprising a pressure sensitive foil composed of copper, aluminum, or the like to attach heat spreader to rerouting board.
Claim 26
Dependent Claim
32 words
A structure as in claim 16, further comprising a thermal grease composed of thermal grease and filled with aluminum oxide, aluminum nitride, or the like to attach heat spreader to die paddle.
Claim 27
Dependent Claim
32 words
A structure as in claim 16, further comprising a thermal grease composed of thermal grease and filled with aluminum oxide, aluminum nitride, or the like to attach heat spreader to rerouting board.
Claim 28
Dependent Claim
26 words
A structure as in claim 16, further comprising a pressure sensitive foil composed of copper, aluminum, or the like to attach heat spreader to semiconductor circuit.
Claim 29
Dependent Claim
32 words
A structure as in claim 16, further comprising a thermal grease composed of thermal grease and filled with aluminum oxide, aluminum nitride, or the like to attach heat spreader to semiconductor circuit.
Claim 30
Dependent Claim
33 words
A structure as in claim 16, wherein at least one inwardly extending retaining flange is formed around the circumference of the molded body section of the heat spreader to provide a mechanical interlock.
Claim 31
Dependent Claim
40 words
A structure as in claim 16, wherein at least one transmissive lens is formed in the seal lid to provide path for ultra violet, infrared, or optical rays to penetrate from the pre-molded package plastic body to the external environment.
Claim 32
Dependent Claim
152 words
A pre-molded package structure for electronic circuit components comprising: (a) a lead frame defining a semiconductor circuit location having terminal leads extending therefrom; (b) a pre-cast die attach cavity spacer attached to the lead frame providing semiconductor circuit location and defining a package having opposed sides and opposed edges with terminal leads extending from at least one of said opposed edges; and (c) wherein at least one body of thermally conductive material partially contained within said pre-molded body of plastic, said body of thermally conductive material having first and second opposed major faces and a retaining flange extending inward and at least partially defining the edge surfaces thereof connected to said lead frame with said first major face in thermal contact with said electronic semiconductor circuit and said second major face substantially parallel with and adjacent one of said opposed sides of said package extending to the surface of the package body.
Claim 33
Dependent Claim
152 words
A pre-molded package structure for electronic circuit components comprising: (a) a lead frame defining a semiconductor circuit location having terminal leads extending therefrom; (b) a pre-cast die attach cavity spacer attached to the lead frame providing semiconductor circuit location and defining a package having opposed sides and opposed edges with terminal leads extending from at least one of said opposed edges; and (c) wherein at least one body of thermally conductive material partially contained within said pre-molded body of plastic, said body of thermally conductive material having first and second opposed major faces and a retaining flange extending inward and at least partially defining the edge surfaces thereof connected to said lead frame with said first major face in thermal contact with said electronic semiconductor circuit and said second major face substantially parallel with and adjacent one of said opposed sides of said package extending to the surface of the package body.
Claim 34
Dependent Claim
17 words
A structure as in claim 30, wherein a routing board is used to interconnect the semiconductor circuit.
Claim 35
Dependent Claim
31 words
A structure as in claim 30, wherein lead frame and die paddle or rerouting board support pin holes provide thermal transfer paths to lead frame and die paddle or rerouting board.
Claim 36
Dependent Claim
40 words
A structure as in claim 30, wherein at least one transmissive lens is formed in the seal lid to provide path for ultra violet, infrared, or optical rays to penetrate from the pre-molded package plastic body to the external environment.
Claim 37
Dependent Claim
64 words
A structure for pre-molding electronic circuit packages components comprising: (a) a lead frame defining a semiconductor circuit location having terminal leads extending therefrom; and (b) an ejection or transfer mold with lead frame support pins providing the lead frame and die paddle or rerouting board mechanical support to prevent mold flash or bleed on or into the interconnection surface, die attach, or pre-mold cavity.
Claim 38
Dependent Claim
64 words
A structure for pre-molding electronic circuit packages components comprising: (a) a lead frame defining a semiconductor circuit location having terminal leads extending therefrom; and (b) an ejection or transfer mold with lead frame support pins providing the lead frame and die paddle or rerouting board mechanical support to prevent mold flash or bleed on or into the interconnection surface, die attach, or pre-mold cavity.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-02-08 | 2002-08-10 | 2003-02-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-02-08 | 2006-08-10 | 2007-02-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-02-08 | 2010-08-10 | 2011-02-09 | $7700.00 | Window Closed / Lapsed |