US5863814A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic package with compressible heatsink structure
Assignee: GlobalFoundries Inc
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Filing: 1997-07-01
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Granted: 1999-01-26
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Expires: 2017-07-01
Abstract
Abstract An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.
Inventors
- 👤 David James Alcoe
- 👤 Sanjeev Balwant Sathe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 05:23
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/257; H10W40/22; H10W40/226; H10W40/228; H10W40/60; H10W40/641; H10W40/70; H10W40/77; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/00; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089; Y10T156/1092; Y10T156/1093
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
127 words
A method of making an electronic package assembly comprising the steps of: providing a circuitized substrate having a plurality of conductors on a first surface thereof; positioning an electronic device on said circuitized substrate and electrically coupling said device to said plurality of conductors; thermally coupling a heatsink to said electronic device in a separable manner; positioning a plurality of compressible, thermally conductive members substantially between said electronic device and said heatsink to form a thermal connection therebetween; and providing compressive force between said heatsink and said electronic device and onto said compressible, thermally conductive members so as to compress and permanently deform said compressible, thermally conductive members to provide a separable connection between said heatsink and said electronic device to thereby define an electronic package assembly.
Claim 2
Independent Claim
127 words
A method of making an electronic package assembly comprising the steps of: providing a circuitized substrate having a plurality of conductors on a first surface thereof; positioning an electronic device on said circuitized substrate and electrically coupling said device to said plurality of conductors; thermally coupling a heatsink to said electronic device in a separable manner; positioning a plurality of compressible, thermally conductive members substantially between said electronic device and said heatsink to form a thermal connection therebetween; and providing compressive force between said heatsink and said electronic device and onto said compressible, thermally conductive members so as to compress and permanently deform said compressible, thermally conductive members to provide a separable connection between said heatsink and said electronic device to thereby define an electronic package assembly.
Claim 3
Dependent Claim
26 words
The method of claim 1 wherein said electrical coupling of said device to said plurality of conductors is accomplished using a plurality of electrically conductive members.
Claim 4
Dependent Claim
53 words
The method of claim 1 wherein said positioning of said plurality of compressible, thermally conductive members between said electronic device and said heatsink comprises initially positioning said compressible, thermally conductive members on said heatsink and thereafter positioning said heatsink and said compressible, thermally conductive members on said electronic device in thermal connection therewith.
Claim 5
Dependent Claim
24 words
The method of claim 1 wherein said providing of said compressive force comprises engaging said electronic device and said heatsink with a retention spring.
Claim 6
Dependent Claim
30 words
The method of claim 1 further including positioning said heatsink and said electronic device within a heated environment having a predetermined temperature range during said providing of said compressive force.
Claim 7
Dependent Claim
27 words
The method of claim 5 wherein said predetermined range of temperatures of said heated environment is less than the melting point of said compressible, thermally conductive members.
Claim 8
Dependent Claim
20 words
The method of claim 6 wherein said compressive force is applied at said predetermined temperatures for a predetermined time period.
Claim 9
Dependent Claim
19 words
The method of claim 7 wherein said predetermined time period is for about one minute to about ten minutes.
Claim 10
Independent Claim
97 words
A method of making an electronic package comprising the steps of: providing an electronic device; thermally coupling a heatsink to said electronic device in a separable manner; positioning a plurality of compressible, thermally conductive members substantially between said electronic device and said heatsink to form a thermal connection therebetween; and providing compressive force between said heatsink and said electronic device and onto said compressible, thermally conductive members so as to compress and permanently deform said compressible, thermally conductive members to provide a separable connection between said heatsink and said electronic device to thereby define an electronic package.
Claim 11
Independent Claim
97 words
A method of making an electronic package comprising the steps of: providing an electronic device; thermally coupling a heatsink to said electronic device in a separable manner; positioning a plurality of compressible, thermally conductive members substantially between said electronic device and said heatsink to form a thermal connection therebetween; and providing compressive force between said heatsink and said electronic device and onto said compressible, thermally conductive members so as to compress and permanently deform said compressible, thermally conductive members to provide a separable connection between said heatsink and said electronic device to thereby define an electronic package.
Claim 12
Dependent Claim
53 words
The method of claim 9 wherein said positioning of said plurality of compressible, thermally conductive members between said electronic device and said heatsink comprises initially positioning said compressible, thermally conductive members on said heatsink and thereafter positioning said heatsink and said compressible, thermally conductive members on said electronic device in thermal connection therewith.
Claim 13
Dependent Claim
24 words
The method of claim 10 wherein said providing of said compressive force comprises engaging said electronic device and said heatsink with a retention spring.
Claim 14
Dependent Claim
24 words
The method of claim 11 wherein said compressive force is applied between said heatsink and said electronic device within a predetermined range of temperatures.
Claim 15
Dependent Claim
23 words
The method of claim 12 wherein said predetermined range of temperatures is less than the melting point of said compressible, thermally conductive members.
Claim 16
Dependent Claim
22 words
The method of claim 13 wherein said compressive force is applied during said range of predetermined temperatures for a predetermined time period.
Claim 17
Dependent Claim
19 words
The method of claim 14 wherein said predetermined time period is for about one minute to about ten minutes.
References Cited (Backward Citations)
US4034468A
Cited
US4254431A
Cited
US4770242A
Cited
US4825284A
Cited
US4993482A
Cited
US5088007A
Cited
US5444300A
Cited
US5474458A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-01-25 | 2002-07-27 | 2003-01-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-01-25 | 2006-07-27 | 2007-01-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-01-25 | 2010-07-27 | 2011-01-26 | $7700.00 | Window Closed / Lapsed |