Patent US5859763A successfully refreshed from Google Patents.
US5859763A
Expired / Lapsed
US
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Multi chip module cooling apparatus
Assignee: Electronics and Telecommunications Research Institute
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Filing: 1996-12-23
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Granted: 1999-01-12
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Expires: 2016-12-23
Abstract
Abstract The multi chip module cooling apparatus of the present invention includes a cold plate having a sealed housing formed with a first side member, a second side member and an interior space, and a metal block having a refrigerant vapor flow passage and a cooling water flow passage formed in opposite to the refrigerant vapor flow passage so as to condense the refrigerant vapor discharged from the housing by using a cooling water flowed in the cooling water passage. A pair of circulating tubes connect the cold plate and the block as a circulation loop shape, the circulating tubes are consisted of a refrigerant vapor flow tube for discharging a hot refrigerant vapor from the housing of the cold plate to the refrigerant vapor flow passage in the blocks and a refrigerant flow tube for supplying a refrigerant condensed in the block to the housing of the cold plate. Thermosyphon action due to boiling of the refrigerant in the vertical channel of the cold plate eliminate the significant temperature rise at the multi chip module, which occurs in the horizontal channel in the cold plate.
Inventors
- 👤 Sang Sig Nam
- 👤 Ho Young Kwak
- 👤 Jae Hee Kim
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 06:28
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W40/00; H10W40/40; H10W40/47; F; F28; F28D; F28D15/00; F28D15/02; F28D15/0266
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
281 words
A multi chip module cooling apparatus comprising: a cold plate cooling a multi chip module mounted thereon by means of a refrigerant contained therein, said cold plate including a sealed housing in which a refrigerant vapor outlet and a refrigerant inlet are formed at upper and lower ends, respectively, and a vertical baffle movably mounted in said housing and dividing said interior space of said housing; a condensing means for condensing a hot refrigerant vapor vaporized in said cold plate by means of a cooling water flowed therein, said condensing means formed of a metal block in which a refrigerant vapor flow means is formed in one side and a cooling water flow means is formed in opposite to said refrigerant vapor flow means; and a pair of circulating tubes connecting said cold plate and said condensing means as a circulation loop shape, said circulating tubes including a refrigerant vapor flow tube connecting said refrigerant vapor outlet of said cold plate with said refrigerant vapor flow means of said block for supplying a hot refrigerant vapor discharged through said refrigerant vapor outlet to said condensing means, and a refrigerant flow tube connecting said refrigerant vapor flow means of said block with said refrigerant inlet of said cold block for supplying a refrigerant condensed and cooled at said condensing means to said cold plate by means of gravity; wherein, a thermosyphonic action occurs in said interior space defined by said baffle within said sealed housing of said cold plate when said refrigerant absorbs heat from said multi chip module, by which said refrigerant is vaporized and flows into said refrigerant vapor flow means of said block through said refrigerant vapor flow tube.
Claim 2
Dependent Claim
281 words
A multi chip module cooling apparatus comprising: a cold plate cooling a multi chip module mounted thereon by means of a refrigerant contained therein, said cold plate including a sealed housing in which a refrigerant vapor outlet and a refrigerant inlet are formed at upper and lower ends, respectively, and a vertical baffle movably mounted in said housing and dividing said interior space of said housing; a condensing means for condensing a hot refrigerant vapor vaporized in said cold plate by means of a cooling water flowed therein, said condensing means formed of a metal block in which a refrigerant vapor flow means is formed in one side and a cooling water flow means is formed in opposite to said refrigerant vapor flow means; and a pair of circulating tubes connecting said cold plate and said condensing means as a circulation loop shape, said circulating tubes including a refrigerant vapor flow tube connecting said refrigerant vapor outlet of said cold plate with said refrigerant vapor flow means of said block for supplying a hot refrigerant vapor discharged through said refrigerant vapor outlet to said condensing means, and a refrigerant flow tube connecting said refrigerant vapor flow means of said block with said refrigerant inlet of said cold block for supplying a refrigerant condensed and cooled at said condensing means to said cold plate by means of gravity; wherein, a thermosyphonic action occurs in said interior space defined by said baffle within said sealed housing of said cold plate when said refrigerant absorbs heat from said multi chip module, by which said refrigerant is vaporized and flows into said refrigerant vapor flow means of said block through said refrigerant vapor flow tube.
Claim 3
Dependent Claim
130 words
The apparatus of claim 1, wherein said housing has a first and second side members, an interior space and a mounting means for mounting said multi chip module at said first side member, said interior space being divided into a first space and a second space by said baffle, wherein said refrigerant contained in said first space between said baffle and said first side member which faces with said multi chip module is vaporized and discharged through said refrigerant vapor outlet by means of said thermosyphonic action inside the vertical channel adjusted by said baffle, and said refrigerant contained said second space between said baffle and said second side member is supplied to said first space so that the dry-out phenomenon does not occur even in an excessive thermal load.
Claim 4
Dependent Claim
127 words
The apparatus of claim 1, wherein said refrigerant vapor flow means is a plurality of refrigerant vapor flow passages installed in one vertical plane through all the height of said block, wherein one end of one of said refrigerant vapor flow passages is connected to one end of adjacent refrigerant vapor flow passage through a connecting tube to form a single refrigerant flow passage, one end of refrigerant vapor flow passage positioned at the upper end is connected to said refrigerant vapor outlet of said cold plate and one end of refrigerant vapor flow passage positioned at the lower end is connected to said refrigerant inlet of said cold plate thereby connecting said cold plate and condensing means to each other to form a natural circulation loop.
Claim 5
Dependent Claim
107 words
The apparatus of claim 1, wherein said cooling water flow means is a plurality of cooling water flow passages installed in one vertical plane through all the height of said block, wherein one end of one of said cooling water flow passage is connected to one end of adjacent cooling water flow passage through a connecting tube to form a single cooling water flow passage, and one end of cooling water flow passage positioned at the upper end is connected to a cooling water storage portion, and one end of cooling water flow passage positioned at the lower end is connected to a cooling water supply portion.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-01-11 | 2002-07-13 | 2003-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-01-11 | 2006-07-13 | 2007-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-01-11 | 2010-07-13 | 2011-01-12 | $7700.00 | Window Closed / Lapsed |