Patent US5859442A successfully refreshed from Google Patents.
US5859442A
Expired / Lapsed
US
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Circuit and method for configuring a redundant bond pad for probing a semiconductor
Assignee: Micron Technology Inc
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Filing: 1996-12-03
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Granted: 1999-01-12
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Expires: 2016-12-03
Abstract
Abstract An integrated device includes a redundant bond pad for accessing internal circuitry in the event that the main bond pad for that circuitry is difficult to access with testing equipment. Signals from the redundant bond pad are biased to ground during normal operations of the integrated device. In order to test the relevant internal circuitry, a voltage is applied to a Test Mode Enable bond pad, overcoming the bias that grounds the redundant bond pad. In addition, the signal from the Test Mode Enable bond pad serves to ground any transmission from the main bond pad. As a result, the redundant bond pad may be used to test the relevant internal circuitry given its accessible location in relation to the testing equipment.
Inventors
- 👤 Troy A. Manning
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 16:16
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/317; G01R31/3181; G01R31/319; G01R31/31903; G01R31/31905; G06; G06F; G06F11/00; G06F11/22; G06F11/26; G06F11/273; G06F11/2733; G01R31/2851; G01R31/2884
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
106 words
An integrated circuit comprising: at least one test circuit; at least one main bond pad coupled to said test circuit; at least one probe bond pad corresponding to said main bond pad and coupled to said test circuit; a test signal conduit coupled to said test circuit; at least one main circuit coupled to said test circuit; wherein said test circuit is configured to propagate signals between said main bond pad and said main circuit, and said test circuit is further configured to selectively propagate signals between said probe bond pad and said main circuit in response to a signal carried by said test signal conduit.
Claim 2
Dependent Claim
106 words
An integrated circuit comprising: at least one test circuit; at least one main bond pad coupled to said test circuit; at least one probe bond pad corresponding to said main bond pad and coupled to said test circuit; a test signal conduit coupled to said test circuit; at least one main circuit coupled to said test circuit; wherein said test circuit is configured to propagate signals between said main bond pad and said main circuit, and said test circuit is further configured to selectively propagate signals between said probe bond pad and said main circuit in response to a signal carried by said test signal conduit.
Claim 3
Dependent Claim
22 words
The integrated circuit of claim 1, wherein said test signal conduit is configured to carry a test vector to said test circuit.
Claim 4
Dependent Claim
16 words
The integrated circuit of claim 1, wherein said test signal conduit is a test-mode-enable bond pad.
Claim 5
Dependent Claim
125 words
An integrated device comprising: a first bond pad in selective electrical connection with a first conductive path; a second bond pad in selective electrical connection with a second conductive path; and a selection circuit coupled to said first and second conductive paths, wherein said selection circuit operable to receive an enable signal that has a first value during a first operational mode of said integrated device and a second value during a second operational mode of said integrated device, and wherein said selection circuit is operable to couple said first bond pad to said first conductive path in response to said first value; said selection circuit further operable to couple said second bond pad to said second conductive path in response to said second value.
Claim 6
Dependent Claim
125 words
An integrated device comprising: a first bond pad in selective electrical connection with a first conductive path; a second bond pad in selective electrical connection with a second conductive path; and a selection circuit coupled to said first and second conductive paths, wherein said selection circuit operable to receive an enable signal that has a first value during a first operational mode of said integrated device and a second value during a second operational mode of said integrated device, and wherein said selection circuit is operable to couple said first bond pad to said first conductive path in response to said first value; said selection circuit further operable to couple said second bond pad to said second conductive path in response to said second value.
Claim 7
Dependent Claim
29 words
The device in claim 4, wherein said selection circuit is further operable to decouple said first bond pad from said first conductive path in response to said second value.
Claim 8
Dependent Claim
20 words
The device in claim 5, further comprising a buffer interposed between said second bond pad and said second conductive path.
Claim 9
Dependent Claim
18 words
The device in claim 6, wherein said first and second bond pads are configured to receive input signals.
Claim 10
Dependent Claim
120 words
A semiconductor wafer comprising: a plurality of semiconductor dies, each die having a first area and a second area, each die comprising: a first bond pad in said first area; a second bond pad in said second area; a test signal conductive path; a circuit; and a testing device coupled to said first bond pad, said second bond pad, said test signal conductive path, and said circuit, wherein said testing device is operable to allow transmission of signals between said circuit and said first bond pad, and said testing device is further operable to establish the transmission of signals between said circuit and said second bond pad upon a test signal sent by way of said test signal conductive path.
Claim 11
Dependent Claim
120 words
A semiconductor wafer comprising: a plurality of semiconductor dies, each die having a first area and a second area, each die comprising: a first bond pad in said first area; a second bond pad in said second area; a test signal conductive path; a circuit; and a testing device coupled to said first bond pad, said second bond pad, said test signal conductive path, and said circuit, wherein said testing device is operable to allow transmission of signals between said circuit and said first bond pad, and said testing device is further operable to establish the transmission of signals between said circuit and said second bond pad upon a test signal sent by way of said test signal conductive path.
Claim 12
Dependent Claim
106 words
A switching device for an operations circuit comprising: a first conductive path coupled to said operations circuit; a second conductive path coupled to said operations circuit; a first bond pad coupled to said first conductive path; a second bond pad coupled to said second conductive path; a selection circuit coupled to a third bond pad, said first conductive path, and to said second conductive path, wherein said selection circuit is configured to allow grounding of said second conductive path during a first mode of operation of said operations circuit and grounding of said first conductive path during a second mode of operation of said operations circuit.
Claim 13
Dependent Claim
106 words
A switching device for an operations circuit comprising: a first conductive path coupled to said operations circuit; a second conductive path coupled to said operations circuit; a first bond pad coupled to said first conductive path; a second bond pad coupled to said second conductive path; a selection circuit coupled to a third bond pad, said first conductive path, and to said second conductive path, wherein said selection circuit is configured to allow grounding of said second conductive path during a first mode of operation of said operations circuit and grounding of said first conductive path during a second mode of operation of said operations circuit.
Claim 14
Dependent Claim
41 words
The device in claim 9, wherein said selection circuit is further configured to prevent grounding of said second conductive path during said second mode of operation and to prevent grounding of said first conductive path during said first mode of operation.
Claim 15
Dependent Claim
18 words
The device in claim 10, further comprising a control logic signal conduit coupled to said second conductive path.
Claim 16
Dependent Claim
18 words
The device in claim 10, further comprising a control logic signal conduit directly coupled to said operations circuit.
Claim 17
Dependent Claim
17 words
The device in claim 12, wherein said second bond pad is coupled directly to said operations circuit.
Claim 18
Dependent Claim
49 words
A switching assembly for an operations circuit, comprising: an output node coupled to said operations circuit; a primary input selectively coupled to said output node; a test input selectively coupled to said output node of said assembly; and a selection mechanism electrically interposed between said inputs and said output.
Claim 19
Dependent Claim
49 words
A switching assembly for an operations circuit, comprising: an output node coupled to said operations circuit; a primary input selectively coupled to said output node; a test input selectively coupled to said output node of said assembly; and a selection mechanism electrically interposed between said inputs and said output.
Claim 20
Dependent Claim
51 words
The switching assembly in claim 14, further comprising: a test-mode-enable input coupled to said selection mechanism and configured to carry a test signal to said selection mechanism, wherein said selection mechanism is configured to allow electrical communication between said test input and said operations circuit in response to said test signal.
Claim 21
Dependent Claim
32 words
The switching assembly of claim 15, wherein said selection mechanism is further configured to prevent electrical communication between said test input and said operations circuit in the absence of said test signal.
Claim 22
Dependent Claim
88 words
A testing circuit for an operations circuit comprising: a main output terminal coupled to a main input terminal; a first electrically grounding device interposed between said main output terminal and said main input terminal; a test output terminal coupled to a test input terminal; a second electrically grounding device interposed between said test output terminal and said test input terminal; and a test-mode-enable input terminal coupled to said first and second electrically grounding devices, wherein said test-mode-enable input terminal is configured to selectively drive said electrically grounding devices.
Claim 23
Dependent Claim
88 words
A testing circuit for an operations circuit comprising: a main output terminal coupled to a main input terminal; a first electrically grounding device interposed between said main output terminal and said main input terminal; a test output terminal coupled to a test input terminal; a second electrically grounding device interposed between said test output terminal and said test input terminal; and a test-mode-enable input terminal coupled to said first and second electrically grounding devices, wherein said test-mode-enable input terminal is configured to selectively drive said electrically grounding devices.
Claim 24
Dependent Claim
47 words
The testing circuit of claim 17, wherein: said first electrically grounding device is a first n-channel transistor having a first gate, wherein said first electrically grounding device is configured for ESD protection; and said second electrically grounding device is a second n-channel transistor having a second gate.
Claim 25
Dependent Claim
53 words
The testing circuit of claim 18, further comprising: an inverter having an inverter output coupled to said second gate and an inverter input coupled to said test-mode-enable input terminal; and a conducting path interposed between said inverter input and said test-mode-enable input terminal, wherein said conducting path is connected to said first gate.
Claim 26
Dependent Claim
43 words
The testing circuit of claim 19, further comprising: a third electrically grounding device interposed between said test-mode-enable input terminal and said conducting path, wherein said third electrically grounding device is biased to generally prevent the transmission of signals from said test-mode-enable input terminal.
Claim 27
Dependent Claim
17 words
The testing circuit of claim 20, wherein said third electrically grounding device is a long L device.
Claim 28
Dependent Claim
78 words
A testing apparatus for an operations circuit coupled to a primary pad, said testing apparatus comprising: a mode-enable path coupled to said operations circuit, wherein said mode-enable path has a trip point and is configured to transmit a forcing voltage; and a redundant pad coupled to said mode-enable path and to said operations circuit, wherein said redundant pad is configured to emulate said primary pad in response to a transmission of said forcing voltage through said mode-enable path.
Claim 29
Dependent Claim
78 words
A testing apparatus for an operations circuit coupled to a primary pad, said testing apparatus comprising: a mode-enable path coupled to said operations circuit, wherein said mode-enable path has a trip point and is configured to transmit a forcing voltage; and a redundant pad coupled to said mode-enable path and to said operations circuit, wherein said redundant pad is configured to emulate said primary pad in response to a transmission of said forcing voltage through said mode-enable path.
Claim 30
Dependent Claim
34 words
The testing apparatus of claim 22, wherein said operations circuit has an enabling function, and said redundant pad is configured to control said enabling function in response to said transmission of said forcing voltage.
Claim 31
Dependent Claim
27 words
The testing apparatus in claim 23, further comprising a mode-enable pad coupled to said mode-enable path, wherein said mode-enable pad is configured to receive said forcing voltage.
Claim 32
Dependent Claim
14 words
The testing apparatus in claim 24, wherein said operations circuit is an input buffer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-01-11 | 2002-07-13 | 2003-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-01-11 | 2006-07-13 | 2007-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-01-11 | 2010-07-13 | 2011-01-12 | $7700.00 | Window Closed / Lapsed |