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US5854100A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of forming a new bipolar/CMOS pixel for high resolution imagers

Assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Filing: 1997-11-17
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Granted: 1998-12-29
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Expires: 2017-11-17
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Abstract

Abstract An active pixel sensor cell that will convert a quantum of light energy to an electronic signal representing the amplitude of the quantum of light energy is disclosed. The active pixel sensor cell is immune to image blooming and has a reset operation to reduce image lag. An active pixel sensor has a photodiode, a bipolar transistor and a MOS transistor. The photodiode has a cathode connected to a power supply voltage source and an anode to the MOS transistor. The quantum of light energy will impinge upon the anode and generate electric charges within the photodiode. The MOS transistor will prevent the image blooming by disconnecting the anode of the photodiode from the base of the bipolar transistor and connecting the anode of the photodiode to MOS transistor to allow the electric charges in the photodiode to flow through the MOS transistor. The bipolar transistor will amplify the electrical charges to create the electronic signal. The active pixel sensor further includes a parasitic MOS transistor. The drain of the parasitic MOS transistor is the anode of the photodiode, the source is the anode of the photodiode of an adjacent active pixel sensors of a row of active pixel sensors within an array of active pixel sensors. When the parasitic MOS transistor is turned on by a reset circuit, it will reset the anode of the photodiode to the same level as that of other photodiodes in a row to reduce image lag on the active pixel sensor.

Inventors

  • 👤 Min-Hwa Chi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 01:14
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/40; H10D84/401; H10D84/403; H10D84/01; H10D84/0107; H10D84/0109; H10D84/02; H10D84/03; H10D84/038; H10F; H10F39/00; H10F39/10; H10F39/12; H10F39/18; H10F39/80; H10F39/803

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 227 words
A method to fabricate on a semiconductor substrate having an impurity of a first conductivity of type, an active pixel sensor that will receive a quantum of light energy and convert said quantum to an electronic signal, comprising the steps of: a) forming a well within said semiconductor substrate by masking areas of said semiconductor substrate and implanting an impurity second conductivity type into said semiconductor substrate; b) defining an area for said active pixel sensor by growing an field oxide external to said area; c) forming a photodiode within said well by masking said semiconductor substrate and implanting an impurity of the first conductivity type to form an anode of said photodiode, and whereby said well will be a cathode of said photodiode; d) forming a bipolar transistor by: masking said semiconductor substrate and implanting the impurity of the first conductivity type to form a base, masking said semiconductor substrate and implanting the impurity of the second conductivity type to form an emitter, and whereby said bipolar transistor has collector that is said well; and; e) forming a MOS transistor by: depositing a gate oxide in a channel region between the anode, which will be the drain of said MOS transistor, and the base, which will be source of said MOS transistor, and depositing a first polysilicon material to form a gate on said gate oxide.
Claim 2
Independent Claim 227 words
A method to fabricate on a semiconductor substrate having an impurity of a first conductivity of type, an active pixel sensor that will receive a quantum of light energy and convert said quantum to an electronic signal, comprising the steps of: a) forming a well within said semiconductor substrate by masking areas of said semiconductor substrate and implanting an impurity second conductivity type into said semiconductor substrate; b) defining an area for said active pixel sensor by growing an field oxide external to said area; c) forming a photodiode within said well by masking said semiconductor substrate and implanting an impurity of the first conductivity type to form an anode of said photodiode, and whereby said well will be a cathode of said photodiode; d) forming a bipolar transistor by: masking said semiconductor substrate and implanting the impurity of the first conductivity type to form a base, masking said semiconductor substrate and implanting the impurity of the second conductivity type to form an emitter, and whereby said bipolar transistor has collector that is said well; and; e) forming a MOS transistor by: depositing a gate oxide in a channel region between the anode, which will be the drain of said MOS transistor, and the base, which will be source of said MOS transistor, and depositing a first polysilicon material to form a gate on said gate oxide.
Claim 3
Dependent Claim 45 words
The method of claim 1 whereby said gate is connected to a sensor control circuit to selectively activate and deactivate said MOS transistor to allow charges formed by the quantum of light impinging on said anode to flow to the base of the bipolar transistor.
Claim 4
Dependent Claim 36 words
The method of claim 1 whereby said anode is sufficiently larger than the base of the bipolar transistor so that residual minority carriers in said base will be confined to said base to reduce image lag.
Claim 5
Dependent Claim 48 words
The method of claim 3 wherein said gate of said parasitic MOS transistor is connected to a reset circuit that will provide a reset signal that will activate said parasitic MOS transistor to reset a potential at said anode to prevent image lag on said active pixel sensor.
Claim 6
Dependent Claim 92 words
The method of claim 1 further comprising the step of forming a parasitic MOS transistor by: a) growing an insulating material to form a parasitic gate oxide for said parasitic MOS transistor; b) depositing a second polysilicon material upon said parasitic gate oxide to form a gate of said parasitic MOS transistor; and c) whereby a drain of said parasitic MOS transistor is the anode of the photodiode and a source of said parasitic MOS transistor is the anode of the photodiode of adjacent active pixel sensor formed on said semiconductor substrate.

References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-12-28 2002-06-29 2002-12-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-12-28 2006-06-29 2006-12-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-12-28 2010-06-29 2010-12-29 $7700.00 Window Closed / Lapsed

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