Semiconductor device having a thin film capacitor and a resistance measuring element

Claim 2

A semiconductor device having a thin film capacitor and a resistance measuring element formed on a substrate, said semiconductor device comprising: an interlayer insulation film formed on said substrate, said interlayer insulation film having a plurality of contact holes formed therein to reach said substrate; a thin film capacitor comprising a bottom electrode, a dielectric film, and a top electrode laminated on one of said contact holes, said bottom electrode comprising at least two layers; a resistance measuring element comprising a first electrode, said dielectric film, and a second electrode laminated on another of said plurality of contact holes, said first and second electrodes formed of the same layers as those forming said bottom electrode and said top electrode respectively, and a topmost layer of said first electrode and said second electrode being in contact with each other through an opening in said dielectric film.

Claim 3

The semiconductor device as claimed in claim 1, wherein a width of said first electrode in a direction parallel to said substrate is smaller than that of said bottom electrode.

Claim 4

The semiconductor device as claimed in claim 1 further comprising a plurality of said resistance measuring elements having first electrodes differently sized from said bottom electrode.

Claim 5

The semiconductor device as claimed in claim 1, wherein said resistance measuring element is formed on a scribing area.

Claim 6

A semiconductor device having a thin film capacitor and a resistance measuring element formed on a substrate, said semiconductor device comprising: an interlayer insulation film formed on said substrate, said interlayer insulation film having a plurality of contact holes formed therein to reach said substrate; a thin film capacitor comprising a bottom electrode, a dielectric film, and a top electrode laminated on one of said contact holes, said bottom electrode comprising at least two layer; a resistance measuring element comprising a first electrode, said dielectric film, and a second electrode laminated on another of said plurality of contact holes, said first and second electrodes formed of the same layers as those forming said bottom electrode and said top electrode respectively, said first electrode having a same width and thickness as that of said bottom electrode, and a topmost layer of said first electrode and said second electrode being in contact with each other through an opening in said dielectric film.

Claim 7

A semiconductor device having a thin film capacitor and a resistance measuring element formed on a substrate, said semiconductor device comprising: an interlayer insulation film formed on said substrate, said interlayer insulation film having a plurality of contact holes formed therein to reach said substrate; a thin film capacitor comprising a bottom electrode, a dielectric film, and a top electrode laminated on one of said contact holes, said bottom electrode comprising at least two layer; a resistance measuring element comprising a first electrode, said dielectric film, and a second electrode laminated on another of said plurality of contact holes, said first and second electrodes formed of the same layers as those forming said bottom electrode and said top electrode respectively, said first electrode having a same width and thickness as that of said bottom electrode, and a topmost layer of said first electrode and said second electrode being in contact with each other through an opening in said dielectric film.

Claim 8

The semiconductor device as claimed in claim 5, wherein said resistance measuring element is formed on a scribing area.

Claim 9

A semiconductor device having a thin film capacitor and a resistance measuring element formed on a substrate, said semiconductor device comprising: an interlayer insulation film formed on said substrate, said interlayer insulation film having a plurality of contact holes formed therein to reach said substrate; a thin film capacitor comprising a bottom electrode, a dielectric film, and a top electrode laminated on one of said contact holes, said bottom electrode comprising at least two layers; a resistance measuring element comprising a first electrode, said dielectric film, and a second electrode laminated on another of said plurality of contact holes, said first and second electrodes formed of the same layers and having a same width as those forming said bottom electrode and said top electrode respectively, and a topmost layer of said first electrode and said second electrode being in contact with each other through an opening in said dielectric film.

Claim 10

A semiconductor device having a thin film capacitor and a resistance measuring element formed on a substrate, said semiconductor device comprising: an interlayer insulation film formed on said substrate, said interlayer insulation film having a plurality of contact holes formed therein to reach said substrate; a thin film capacitor comprising a bottom electrode, a dielectric film, and a top electrode laminated on one of said contact holes, said bottom electrode comprising at least two layers; a resistance measuring element comprising a first electrode, said dielectric film, and a second electrode laminated on another of said plurality of contact holes, said first and second electrodes formed of the same layers and having a same width as those forming said bottom electrode and said top electrode respectively, and a topmost layer of said first electrode and said second electrode being in contact with each other through an opening in said dielectric film.

Claim 11

The semiconductor device as claimed in claim 7, wherein said resistance measuring element is formed on a scribing area.

Claim 12

A semiconductor device comprising: a substrate having a first portion and a second portion; an insulating film formed on said substrate, said insulating film having a first contact hole and a second contact hole; a first conductive film formed on said insulating film to electrically connect with said first portion through said first contact hole; a second conductive film formed on said insulating film to electrically connect with said second portion through said second contact hole, said second conductive film formed from a same material as said first conductive film; a third conductive film formed on said first conductive film; a fourth conductive film formed on said second conductive film, said fourth conductive film being formed from a same material to said third conductive film, said third and fourth conductive films being formed from a different material from said first and second conductive films; a first dielectric film covering said first and third conductive films; a second dielectric film covering said second and fourth conductive films, said second dielectric having an opening; a fifth conductive film covering said first dielectric film, said first and third conductive films constituting a bottom electrode of a capacitor and said fifth conductive film constituting a top electrode of said capacitor; and a sixth conductive film covering said second dielectric film, said sixth conductive film contacting said fourth conductive film through said opening.

Claim 13

A semiconductor device comprising: a substrate having a first portion and a second portion; an insulating film formed on said substrate, said insulating film having a first contact hole and a second contact hole; a first conductive film formed on said insulating film to electrically connect with said first portion through said first contact hole; a second conductive film formed on said insulating film to electrically connect with said second portion through said second contact hole, said second conductive film formed from a same material as said first conductive film; a third conductive film formed on said first conductive film; a fourth conductive film formed on said second conductive film, said fourth conductive film being formed from a same material to said third conductive film, said third and fourth conductive films being formed from a different material from said first and second conductive films; a first dielectric film covering said first and third conductive films; a second dielectric film covering said second and fourth conductive films, said second dielectric having an opening; a fifth conductive film covering said first dielectric film, said first and third conductive films constituting a bottom electrode of a capacitor and said fifth conductive film constituting a top electrode of said capacitor; and a sixth conductive film covering said second dielectric film, said sixth conductive film contacting said fourth conductive film through said opening.

Claim 14

The device as claimed in claim 9, wherein said first and second dielectric films are a high permittivity film.

Claim 15

The device as claimed in claim 10, wherein said first and second conductive films have silicification temperature higher than the film forming temperature of said high permittivity film.

Claim 16

The device as claimed in claim 11, wherein said first and second conductive films are formed by material selected from at least one of metals, nitride films of metal, films containing nitrogen, and silicide films.

Claim 17

The device as claimed in claim 10, wherein said high permittivity film has a chemical formula of ABCO 3 , wherein A is at least one substance selected from a group consisting of Ba, Sr, Pb, Ca, La, Li, and K, B is at least one substance selected from a group consisting of Zr, Ti, Nb, Mg, Mn, Fe, Zn, and W.

Claim 18

The device as claimed in claim 10, wherein said high permittivity film has a chemical formula of (Bi 2 O 2 ) (A m-1 B m O 3m+1 ) (m=1, 2, 3, 4, and 5) wherein A is at least one substance selected from a group consisting of Ba, Sr, Pb, Ca, K and B is at least one substance selected from a group consisting of Nb, Ta, Ti, and W.

Claim 19

The device as claimed in claim 10, wherein said third and fourth conductive films are a film which maintains the conductance even in the oxidizing atmosphere during deposition of said high permittivity film.

Claim 20

The device as claimed in claim 15, wherein said film which maintains the conductance is formed by a material selected from the group consisting of Ru, Pd, Re, Os, Ir, and Rh, oxide thereof, silicide compound thereof.

Claim 21

The device as claimed in claim 16, wherein said film which maintains the conductance is formed by a material selected from the group consisting of RuO 2 and RuO.

Claim 22

The device as claimed in claim 9, wherein said first and third conductive films have the same width as said second and fourth conductive films respectively.

Claim 23

The device as claimed in claim 9, wherein said second portion of said substrate is located at a scribing area.