US5846336A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus and method for conditioning a planarizing substrate used in mechanical and chemical-mechanical planarization of semiconductor wafers
Assignee: Micron Technology Inc
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Filing: 1997-05-14
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Granted: 1998-12-08
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Expires: 2017-05-14
Abstract
Abstract An apparatus for chemically conditioning a surface of a planarizing substrate while a semiconductor wafer is planarized on the substrate. The conditioning apparatus has a conditioning solution dispenser that deposits a conditioning solution onto the substrate, and a conditioning solution barrier that removes the conditioning solution from the substrate to prevent the conditioning solution from contacting the wafer or diluting the planarizing solution. The conditioning solution dispenser is positioned over the planarizing substrate down-stream from the wafer with respect to the path along which the substrate travels. The conditioning solution barrier is positioned down-stream from the conditioning solution dispenser and upstream from the wafer to remove the conditioning solution from the surface of the substrate. The conditioning solution barrier accordingly cleans the surface of the substrate so that planarizing solution may be dispensed onto a surface relatively free from other fluids or particles.
Inventors
- 👤 John Skrovan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:02
CPC Classifications
B; B24; B24B; B24B53/00; B24B53/017
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
153 words
A method for conditioning a surface of a planarizing substrate in situ and in real-time during planarization of a wafer on the substrate, comprising: removing waste matter from the surface of the planarizing substrate with a chemical conditioning solution in a conditioning region along a substrate path of travel by moving the substrate along the substrate path of travel, dispensing the conditioning solution onto the surface of the substrate at a location down-stream from the wafer with respect to the substrate path of travel, and permitting the conditioning solution to remain on the substrate and remove waste matter from the substrate for conditioning the planarizing substrate through chemical action without prior mechanical abrasion of the planarizing substrate; and impeding the chemical conditioning solution from entering a planarizing region with respect to the substrate where the wafer is planarized to inhibit the chemical conditioning solution from contacting the wafer during planarization of the wafer.
Claim 2
Independent Claim
153 words
A method for conditioning a surface of a planarizing substrate in situ and in real-time during planarization of a wafer on the substrate, comprising: removing waste matter from the surface of the planarizing substrate with a chemical conditioning solution in a conditioning region along a substrate path of travel by moving the substrate along the substrate path of travel, dispensing the conditioning solution onto the surface of the substrate at a location down-stream from the wafer with respect to the substrate path of travel, and permitting the conditioning solution to remain on the substrate and remove waste matter from the substrate for conditioning the planarizing substrate through chemical action without prior mechanical abrasion of the planarizing substrate; and impeding the chemical conditioning solution from entering a planarizing region with respect to the substrate where the wafer is planarized to inhibit the chemical conditioning solution from contacting the wafer during planarization of the wafer.
Claim 3
Dependent Claim
32 words
The method of claim 1 wherein impeding the conditioning solution from entering the planarizing region comprises wiping the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 4
Dependent Claim
37 words
The method of claim 1 wherein impeding the conditioning solution from entering the planarizing region comprises spraying the surface of the substrate with a fluid stream directed along an axis transverse to the substrate path of travel.
Claim 5
Dependent Claim
32 words
The method of claim 1 wherein impeding the conditioning solution from entering the planarizing region comprises vacuuming the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 6
Dependent Claim
32 words
The method of claim 1 wherein impeding the conditioning solution from entering the planarizing region comprises brushing the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 7
Independent Claim
161 words
A method for conditioning a surface of a planarizing substrate in situ and in real-time during planarization of a wafer on the substrate comprising: dispensing a planarizing solution within a planarizing region along a path of travel of the substrate where the wafer is planarized and a conditioning solution within a conditioning region along the substrate path of travel where the wafer is not planarized, the conditioning solution dissolving waste material accumulated on the substrate, wherein dispensing conditioning solution onto the substrate comprises permitting the conditioning solution to remain on the substrate and remove waste matter from the substrate for conditioning the planarizing substrate through chemical action without prior mechanical abrasion of the planarizing substrate; and removing the conditioning solution and dissolved waste material from the substrate prior to the planarizing region with respect to the substrate path of travel to clean the surface of the substrate of conditioning solution and inhibit the conditioning solution from contacting the wafer during planarization.
Claim 8
Independent Claim
161 words
A method for conditioning a surface of a planarizing substrate in situ and in real-time during planarization of a wafer on the substrate comprising: dispensing a planarizing solution within a planarizing region along a path of travel of the substrate where the wafer is planarized and a conditioning solution within a conditioning region along the substrate path of travel where the wafer is not planarized, the conditioning solution dissolving waste material accumulated on the substrate, wherein dispensing conditioning solution onto the substrate comprises permitting the conditioning solution to remain on the substrate and remove waste matter from the substrate for conditioning the planarizing substrate through chemical action without prior mechanical abrasion of the planarizing substrate; and removing the conditioning solution and dissolved waste material from the substrate prior to the planarizing region with respect to the substrate path of travel to clean the surface of the substrate of conditioning solution and inhibit the conditioning solution from contacting the wafer during planarization.
Claim 9
Dependent Claim
30 words
The method of claim 6 wherein removing the conditioning solution from the substrate comprises wiping the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 10
Dependent Claim
35 words
The method of claim 6 wherein removing the conditioning solution from the substrate comprises spraying the surface of the substrate with a fluid stream directed along an axis transverse to the substrate path of travel.
Claim 11
Dependent Claim
30 words
The method of claim 6 wherein removing the conditioning solution from the substrate comprises brushing the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 12
Independent Claim
138 words
A method for conditioning a surface of a planarizing substrate in situ and in real-time during planarization of a wafer on the substrate, comprising: dispensing a planarizing solution within a planarizing region along a path of travel of the substrate where the wafer is planarized and a conditioning solution within a conditioning region along the substrate path of travel where the wafer is not planarized, the conditioning solution dissolving waste material accumulated on the substrate; and removing the conditioning solution and dissolved waste material from the substrate prior to the planarizing region with respect to the substrate path of travel to clean the surface of the substrate of conditioning solution and inhibit the conditioning solution from contacting the wafer during planarization by vacuuming the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 13
Independent Claim
138 words
A method for conditioning a surface of a planarizing substrate in situ and in real-time during planarization of a wafer on the substrate, comprising: dispensing a planarizing solution within a planarizing region along a path of travel of the substrate where the wafer is planarized and a conditioning solution within a conditioning region along the substrate path of travel where the wafer is not planarized, the conditioning solution dissolving waste material accumulated on the substrate; and removing the conditioning solution and dissolved waste material from the substrate prior to the planarizing region with respect to the substrate path of travel to clean the surface of the substrate of conditioning solution and inhibit the conditioning solution from contacting the wafer during planarization by vacuuming the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 14
Independent Claim
150 words
A method for planarizing a wafer, comprising: moving a planarizing substrate along a substrate path of travel; pressing a wafer against a surface of the planarizing substrate in a planarizing region with respect to the substrate path of travel to remove material from the wafer; removing waste matter from the surface of the planarizing substrate with a chemical conditioning solution in a conditioning region with respect to the substrate by dispensing the conditioning solution onto the surface of the planarizing substrate at a location down-stream from the wafer with respect to the substrate path of travel and permitting the conditioning solution to remain on the substrate and remove waste matter from the substrate for conditioning the planarizing substrate through chemical action without prior mechanical abrasion of the planarizing substrate; and impeding the chemical conditioning solution from entering the planarizing region to inhibit the chemical conditioning solution from contacting the wafer.
Claim 15
Independent Claim
150 words
A method for planarizing a wafer, comprising: moving a planarizing substrate along a substrate path of travel; pressing a wafer against a surface of the planarizing substrate in a planarizing region with respect to the substrate path of travel to remove material from the wafer; removing waste matter from the surface of the planarizing substrate with a chemical conditioning solution in a conditioning region with respect to the substrate by dispensing the conditioning solution onto the surface of the planarizing substrate at a location down-stream from the wafer with respect to the substrate path of travel and permitting the conditioning solution to remain on the substrate and remove waste matter from the substrate for conditioning the planarizing substrate through chemical action without prior mechanical abrasion of the planarizing substrate; and impeding the chemical conditioning solution from entering the planarizing region to inhibit the chemical conditioning solution from contacting the wafer.
Claim 16
Dependent Claim
32 words
The method of claim 11 wherein impeding the conditioning solution from entering the planarizing region comprises wiping the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 17
Dependent Claim
37 words
The method of claim 11 wherein impeding the conditioning solution from entering the planarizing region comprises spraying the surface of the substrate with a fluid stream directed along an axis transverse to the substrate path of travel.
Claim 18
Dependent Claim
32 words
The method of claim 11 wherein impeding the conditioning solution from entering the planarizing region comprises brushing the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 19
Independent Claim
107 words
A method for planarizing a wafer, comprising: moving a planarizing substrate along a substrate path of travel; pressing a wafer against a surface of the planarizing substrate in a planarizing region with respect to the substrate path of travel to remove material from the wafer; removing waste matter from the surface of the planarizing substrate with a chemical conditioning solution in a conditioning region with respect to the substrate; and impeding the chemical conditioning solution from entering the planarizing region to inhibit the chemical conditioning solution from contacting the wafer by vacuuming the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 20
Independent Claim
107 words
A method for planarizing a wafer, comprising: moving a planarizing substrate along a substrate path of travel; pressing a wafer against a surface of the planarizing substrate in a planarizing region with respect to the substrate path of travel to remove material from the wafer; removing waste matter from the surface of the planarizing substrate with a chemical conditioning solution in a conditioning region with respect to the substrate; and impeding the chemical conditioning solution from entering the planarizing region to inhibit the chemical conditioning solution from contacting the wafer by vacuuming the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 21
Independent Claim
167 words
A method for planarizing a wafer, comprising: moving a planarizing substrate along a substrate path of travel; pressing a wafer against a surface of the planarizing substrate in a planarizing region with respect to the substrate path of travel to remove material from the wafer; dispensing a planarizing solution within the planarizing region to coat the surface of the substrate under the wafer with planarizing solution; depositing a conditioning solution within a conditioning region with respect to the substrate path of travel where the wafer is not planarized, the conditioning solution dissolving waste material accumulated on the substrate by permitting the conditioning solution to remain on the substrate and remove waste matter from the substrate for conditioning the planarizing substrate through chemical action without prior mechanical abrasion of the planarizing substrate; and removing the conditioning solution and dissolved waste material from the substrate prior to the planarizing region to clean the surface of the substrate of conditioning solution and inhibit the conditioning solution from contacting the wafer.
Claim 22
Independent Claim
167 words
A method for planarizing a wafer, comprising: moving a planarizing substrate along a substrate path of travel; pressing a wafer against a surface of the planarizing substrate in a planarizing region with respect to the substrate path of travel to remove material from the wafer; dispensing a planarizing solution within the planarizing region to coat the surface of the substrate under the wafer with planarizing solution; depositing a conditioning solution within a conditioning region with respect to the substrate path of travel where the wafer is not planarized, the conditioning solution dissolving waste material accumulated on the substrate by permitting the conditioning solution to remain on the substrate and remove waste matter from the substrate for conditioning the planarizing substrate through chemical action without prior mechanical abrasion of the planarizing substrate; and removing the conditioning solution and dissolved waste material from the substrate prior to the planarizing region to clean the surface of the substrate of conditioning solution and inhibit the conditioning solution from contacting the wafer.
Claim 23
Dependent Claim
30 words
The method of claim 16 wherein removing the conditioning solution from the substrate comprises wiping the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 24
Dependent Claim
35 words
The method of claim 16 wherein removing the conditioning solution from the substrate comprises spraying the surface of the substrate with a fluid stream directed along an axis transverse to the substrate path of travel.
Claim 25
Dependent Claim
30 words
The method of claim 16 wherein removing the conditioning solution from the substrate comprises brushing the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 26
Independent Claim
151 words
A method for planarizing a wafer, comprising: moving a planarizing substrate along a substrate path of travel; pressing a wafer against a surface of the planarizing substrate in a planarizing region with respect to the substrate path of travel to remove material from the wafer; dispensing a planarizing solution within the planarizing region to coat the surface of the substrate under the wafer with planarizing solution; depositing a conditioning solution within a conditioning region with respect to the substrate path of travel where the wafer is not planarized, the conditioning solution dissolving waste material accumulated on the substrate; and removing the conditioning solution and dissolved waste material from the substrate prior to the planarizing region to clean the surface of the substrate of conditioning solution and inhibit the conditioning solution from contacting the wafer by vacuuming the surface of the substrate along an axis transverse to the substrate path of travel.
Claim 27
Independent Claim
151 words
A method for planarizing a wafer, comprising: moving a planarizing substrate along a substrate path of travel; pressing a wafer against a surface of the planarizing substrate in a planarizing region with respect to the substrate path of travel to remove material from the wafer; dispensing a planarizing solution within the planarizing region to coat the surface of the substrate under the wafer with planarizing solution; depositing a conditioning solution within a conditioning region with respect to the substrate path of travel where the wafer is not planarized, the conditioning solution dissolving waste material accumulated on the substrate; and removing the conditioning solution and dissolved waste material from the substrate prior to the planarizing region to clean the surface of the substrate of conditioning solution and inhibit the conditioning solution from contacting the wafer by vacuuming the surface of the substrate along an axis transverse to the substrate path of travel.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-12-07 | 2002-06-08 | 2002-12-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-12-07 | 2006-06-08 | 2006-12-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-12-07 | 2010-06-08 | 2010-12-08 | $7700.00 | Window Closed / Lapsed |