US5844319A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microelectronic assembly with collar surrounding integrated circuit component on a substrate
Assignee: North Star Innovations Inc
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Filing: 1997-03-03
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Granted: 1998-12-01
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Expires: 2017-03-03
Abstract
Abstract A microelectronic assembly (10) includes an integrated circuit component (14) attached to a polymeric substrate (12) by a plurality of unencapsulated solder bump interconnections (16). A collar (18) is affixed to the polymeric substrate (12) about the integrated circuit component (14) and is formed of an inorganic material having a coefficient of thermal expansion less than that of the substrate (12). The collar (18) constrains thermal expansion of the polymeric substrate (12) in the die attach region (22), thereby lessening any deleterious effects caused by a mismatch in the thermal expansion of the polymeric substrate (12) and the integrated circuit component (14).
Inventors
- 👤 Danniel Roman Gamota
- 👤 George Amos Carson
- 👤 Sean Xin Wu
- 👤 Brian J. Bullock
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:43
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0271; H05K2201/00; H05K2201/06; H05K2201/068; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/20; H05K2201/2009; H05K2201/2018; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
134 words
A microelectronic assembly comprising: a polymeric substrate comprising a plurality of substrate bond pads, a die attach region, and a surrounding region about the die attach region; an integrated circuit component overlying the polymeric substrate and spaced apart therefrom by a gap, said integrated circuit component comprising an active face facing the polymeric substrate and a plurality of component bond pads disposed at the active face; a plurality of unencapsulated solder bump interconnections extending across the gap, each solder bump interconnection connecting a substrate bond pad and a component bond pad; and a collar bonded to the polymeric substrate about a perimeter of the integrated circuit component, said collar formed of an inorganic material having a coefficient of thermal expansion less than the polymeric substrate to constrain thermal expansion of the die attach region.
Claim 2
Dependent Claim
134 words
A microelectronic assembly comprising: a polymeric substrate comprising a plurality of substrate bond pads, a die attach region, and a surrounding region about the die attach region; an integrated circuit component overlying the polymeric substrate and spaced apart therefrom by a gap, said integrated circuit component comprising an active face facing the polymeric substrate and a plurality of component bond pads disposed at the active face; a plurality of unencapsulated solder bump interconnections extending across the gap, each solder bump interconnection connecting a substrate bond pad and a component bond pad; and a collar bonded to the polymeric substrate about a perimeter of the integrated circuit component, said collar formed of an inorganic material having a coefficient of thermal expansion less than the polymeric substrate to constrain thermal expansion of the die attach region.
Claim 3
Dependent Claim
17 words
A microelectronic assembly in accordance with claim 1, wherein the collar is formed of a ceramic material.
Claim 4
Dependent Claim
18 words
A microelectronic assembly in accordance with claim 1, wherein the collar is adhesively bonded to the polymeric substrate.
Claim 5
Dependent Claim
55 words
A microelectronic assembly in accordance with claim 1, wherein the integrated circuit component further comprises a non-active face opposite the active face and spaced apart from the polymeric substrate by a first height, and wherein the collar comprises a top surface spaced from the polymeric substrate by a second height greater than the first height.
Claim 6
Dependent Claim
153 words
A microelectronic assembly comprising: a printed circuit board comprising a plurality of substrate bond pads, a die attach region, and a surrounding region about the die attach region; an integrated circuit component overlying the printed circuit board and spaced apart therefrom by a gap, said integrated circuit component comprising an active face facing the printed circuit board and a plurality of component bond pads disposed at the active face; a plurality of unencapsulated solder bump interconnections extending across the gap, each solder bump interconnection connecting a substrate bond pad and a component bond pad; and a collar bonded to the printed circuit board about the integrated circuit component and spaced apart from the integrated circuit component by an air gap, said collar formed of a ceramic material having a coefficient of thermal expansion less than 7 ppm/°C. and affixed to the printed circuit board to constrain thermal expansion in the die attach region.
Claim 7
Dependent Claim
153 words
A microelectronic assembly comprising: a printed circuit board comprising a plurality of substrate bond pads, a die attach region, and a surrounding region about the die attach region; an integrated circuit component overlying the printed circuit board and spaced apart therefrom by a gap, said integrated circuit component comprising an active face facing the printed circuit board and a plurality of component bond pads disposed at the active face; a plurality of unencapsulated solder bump interconnections extending across the gap, each solder bump interconnection connecting a substrate bond pad and a component bond pad; and a collar bonded to the printed circuit board about the integrated circuit component and spaced apart from the integrated circuit component by an air gap, said collar formed of a ceramic material having a coefficient of thermal expansion less than 7 ppm/°C. and affixed to the printed circuit board to constrain thermal expansion in the die attach region.
Claim 8
Dependent Claim
15 words
A microelectronic assembly in accordance with claim 5, wherein the collar is formed of alumina.
Claim 9
Dependent Claim
15 words
A microelectronic assembly in accordance with claim 5, wherein the collar is formed of silica.
Claim 10
Dependent Claim
24 words
A microelectronic assembly in accordance with claim 5, wherein the collar is spaced apart from the integrated circuit component by less than 500 microns.
Claim 11
Dependent Claim
24 words
A microelectronic assembly in accordance with claim 5, wherein the collar is spaced apart from the integrated circuit component by less than 250 microns.
Claim 12
Dependent Claim
19 words
A microelectronic assembly in accordance with claim 5, wherein the printed circuit board is formed of a glass-epoxy laminate.
Claim 13
Dependent Claim
164 words
A microelectronic assembly comprising: a printed circuit board comprising a plurality of substrate bond pads, a die attach region, and a surrounding region about the die attach region; an integrated circuit component overlying the printed circuit board and spaced apart therefrom by a gap, said integrated circuit component comprising an active face facing the printed circuit board and a plurality of component bond pads disposed at the active face, said integrated circuit component being generally rectangular; a plurality of unencapsulated solder bump interconnections extending across the gap, each solder bump interconnection connecting a substrate bond pad and a component bond pad; and a collar bonded to the printed circuit board about the integrated circuit component and spaced apart from the integrated circuit component by an air gap, said collar being generally rectangular and formed of a ceramic material having a coefficient of thermal expansion less than 7 ppm/°C. and affixed to the printed circuit board to constrain thermal expansion in the die attach region.
Claim 14
Dependent Claim
164 words
A microelectronic assembly comprising: a printed circuit board comprising a plurality of substrate bond pads, a die attach region, and a surrounding region about the die attach region; an integrated circuit component overlying the printed circuit board and spaced apart therefrom by a gap, said integrated circuit component comprising an active face facing the printed circuit board and a plurality of component bond pads disposed at the active face, said integrated circuit component being generally rectangular; a plurality of unencapsulated solder bump interconnections extending across the gap, each solder bump interconnection connecting a substrate bond pad and a component bond pad; and a collar bonded to the printed circuit board about the integrated circuit component and spaced apart from the integrated circuit component by an air gap, said collar being generally rectangular and formed of a ceramic material having a coefficient of thermal expansion less than 7 ppm/°C. and affixed to the printed circuit board to constrain thermal expansion in the die attach region.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-30 | 2002-06-01 | 2002-12-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-30 | 2006-06-01 | 2006-12-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-30 | 2010-06-01 | 2010-12-01 | $7700.00 | Window Closed / Lapsed |