Patent US5843808A successfully refreshed from Google Patents.
US5843808A
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Structure and method for automated assembly of a tab grid array package
Assignee: UTAC Headquarters Pte Ltd
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Filing: 1996-01-11
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Granted: 1998-12-01
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Expires: 2016-01-11
Abstract
Abstract A TAB Grid Array (TGA) package allows automated assembly using established manufacturing equipment similar to those used in the production of plastic ball grid Array (PBGA) package assembly. The TGA package are formed, using as starting material, a metal strip having the same critical dimensions and tooling holes as those used for a PBGA package. In this invention, the stiffener is designed to serve as a carrier throughout the assembly of the TGA package. The wire bonded TGA cavity package, including the solder balls, is first fully assembled prior to the attachment of the semiconductor die. Subsequently, the semiconductor die is attached to the stiffener, wires are bonded between the semiconductor die and the tape frame, and the entire assembly is encapsulated. The process of the present invention provides a high device assembly yield usually not achievable by the PBGA packages. The choice of high temperature tape and epoxy allows the use of high temperature solder balls which provide for higher package-to-motherboard assembly reliability. Further, the high electrical performance of the TGA package is achieved by using a two-metal layer tape. In one embodiment, the first layer is used for signal connections, the second layer is used for routing the power signal and the stiffener is used for routing the ground signal.
Inventors
- 👤 Marcos Karnezos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:15
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/67; H10W70/688; H10W72/00; B; B29; B29C; B29C43/00; B29C43/32; B29C43/58; B29C2043/5825; H10W70/654; H10W70/655; H10W70/68; H10W70/682; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/731; H10W90/736; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
214 words
A method for forming a TGA package, comprising the steps of: forming a plurality of stiffeners on a carrier strip, each stiffener having a cavity formed on one side of said strip; singulating a plurality of tape frames from a tape, each tape frame including (i) a first plurality of conductive wire bonding pads, (ii) a plurality of solder ball bonding pads for attaching solder balls and (iii) a plurality of conductive traces each for routing a signal from one of said first plurality of wire bonding pads to a corresponding solder ball bonding pad; attaching each of said tape frame to one of said plurality of stiffeners via a tape adhesive; attaching a plurality of solder balls to said tape at said plurality of conductive bond pads using a reflow procedure; attaching a semiconductor die to said cavity of said stiffener using a die attach epoxy, said semiconductor die having formed thereon a second plurality of wire bonding pads; using a plurality of bond wires, coupling selected ones of said second plurality of wire bonding pads on said semiconductor die to corresponding ones of said first plurality of wire bonding pads; encapsulating said semiconductor die and said bond wires with a resin encapsulation; and singulating each of said stiffeners from said carrier strip.
Claim 2
Independent Claim
214 words
A method for forming a TGA package, comprising the steps of: forming a plurality of stiffeners on a carrier strip, each stiffener having a cavity formed on one side of said strip; singulating a plurality of tape frames from a tape, each tape frame including (i) a first plurality of conductive wire bonding pads, (ii) a plurality of solder ball bonding pads for attaching solder balls and (iii) a plurality of conductive traces each for routing a signal from one of said first plurality of wire bonding pads to a corresponding solder ball bonding pad; attaching each of said tape frame to one of said plurality of stiffeners via a tape adhesive; attaching a plurality of solder balls to said tape at said plurality of conductive bond pads using a reflow procedure; attaching a semiconductor die to said cavity of said stiffener using a die attach epoxy, said semiconductor die having formed thereon a second plurality of wire bonding pads; using a plurality of bond wires, coupling selected ones of said second plurality of wire bonding pads on said semiconductor die to corresponding ones of said first plurality of wire bonding pads; encapsulating said semiconductor die and said bond wires with a resin encapsulation; and singulating each of said stiffeners from said carrier strip.
Claim 3
Dependent Claim
25 words
A method as in claim 1, wherein said step of singulated tape frames removes from a reel or panel that has these tape frames tiled.
Claim 4
Dependent Claim
36 words
A method as in claim 1, wherein said step of attaching said tape frames to said stiffeners applies a thermoset epoxy as a tape adhesive, said thermoset epoxy being capable of withstanding temperatures above 300 C.
Claim 5
Dependent Claim
36 words
A method as in claim 1, wherein said step of attaching said tape frames to said stiffeners applies a thermoplastic epoxy as a tape adhesive, said thermoset epoxy being capable of withstanding temperatures above 300 C.
Claim 6
Dependent Claim
41 words
A method as in claim 1, wherein said step of attaching said solder balls to said tape is performed with solder balls selected from a group of solder balls selected from a selected from tin/lead alloy (63/37%) or tin/lead/silver alloy (62/36/2%).
Claim 7
Dependent Claim
27 words
A method as in claim 1, wherein said step of attaching said solder balls to said tape is performed with solder balls comprising a tin/lead alloy (10/90%).
Claim 8
Dependent Claim
24 words
A method as in claim 1, wherein said step of attaching solder balls to said tape precede said step of attaching said semiconductor die.
Claim 9
Dependent Claim
27 words
A method as in claim 1, further comprising the step of providing an elastomeric layer, said elastomeric layer attached between said tape and said stiffener using adhesive.
Claim 10
Dependent Claim
30 words
A method as in claim 8, wherein said elastomeric layer is selected from a group including a silicone type elastomer, a viton type elastomer or a silicone type thick adhesive.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-30 | 2002-06-01 | 2002-12-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-30 | 2006-06-01 | 2006-12-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-30 | 2010-06-01 | 2010-12-01 | $7700.00 | Window Closed / Lapsed |