Patent US5841191A successfully refreshed from Google Patents.
US5841191A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ball grid array package employing raised metal contact rings
Assignee: Bell Semiconductor LLC
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Filing: 1997-04-21
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Granted: 1998-11-24
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Expires: 2017-04-21
Abstract
Abstract A ball grid array package in which one or more conductive rings are positioned on a surface of the package substrate along with solder bond contacts on the surface of the substrate to facilitate the interconnection of wire bonds to an integrated circuit chip on the surface of the substrate. The use of rings allows for better distribution of power to the chip since a plurality of wires can be connected between the chip and the conductive rings for power distribution. The rings create a different shelf for the power and ground bonds on the substrate, and by providing a vertical separation between the surfaces of the rings and bonding pads on the surface of the substrate more bonds in the package can be accommodated.
Inventors
- 👤 Chok J. Chia
- 👤 Qwai H. Low
- 👤 Maniam Alagaratnam
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:34
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/5473; H10W72/551; H10W72/552; H10W72/5525; H10W74/00
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
109 words
An integrated circuit package comprising: a substrate having a top surface, a bottom surface, a metal layer interconnect pattern, and a plurality of bonding pads on the top surface contacting the interconnect pattern, at least one conductive ring mounted on the top surface of the substrate and having a bonding surface raised above the top surface, an integrated circuit chip mounted on the top surface of the substrate, the chip having a plurality of bonding pads, and a plurality of wire bonds interconnecting bonding pads on the integrated circuit chip to bonding pads on the top surface of the substrate and to the bonding surface of the conductive ring.
Claim 2
Dependent Claim
109 words
An integrated circuit package comprising: a substrate having a top surface, a bottom surface, a metal layer interconnect pattern, and a plurality of bonding pads on the top surface contacting the interconnect pattern, at least one conductive ring mounted on the top surface of the substrate and having a bonding surface raised above the top surface, an integrated circuit chip mounted on the top surface of the substrate, the chip having a plurality of bonding pads, and a plurality of wire bonds interconnecting bonding pads on the integrated circuit chip to bonding pads on the top surface of the substrate and to the bonding surface of the conductive ring.
Claim 3
Dependent Claim
31 words
The integrated circuit package as defined by claim 1 wherein the conductive ring provides a supply voltage with a plurality of wire bonds connecting the ring to the integrated circuit chip.
Claim 4
Dependent Claim
31 words
The integrated circuit package as defined by claim 2 and including two concentric conductive rings on the top surface for supplying two voltage levels (VDD, VSS) to the integrated circuit chip.
Claim 5
Dependent Claim
23 words
The integrated circuit package as defined by claim 3 wherein the metal layer interconnect pattern is on the top surface of the substrate.
Claim 6
Dependent Claim
39 words
The integrated circuit package as defined by claim 4 and further including a second metal layer interconnect pattern on the bottom surface of the substrate and interconnected with bonding pads on the top surface by vias through the substrate.
Claim 7
Dependent Claim
35 words
The integrated circuit package as defined by claim 5 and further including a plurality of solder ball pads on the bottom surface interconnected with bonding pads on the top surface by vias through the substrate.
Claim 8
Dependent Claim
31 words
The integrated circuit package as defined by claim 6 and further including a plurality of solder balls contacting the solder ball contacts for interconnecting the integrated circuit chip with a motherboard.
Claim 9
Dependent Claim
35 words
The integrated circuit package as defined by claim 3 and further including a plurality of solder ball pads on the bottom surface interconnecting with bonding pads on the top surface by vias through the substrate.
Claim 10
Dependent Claim
31 words
The integrated circuit package as defined by claim 8 and further including a plurality of solder balls contacting the solder ball contacts for interconnecting the integrated circuit chip with a motherboard.
Claim 11
Dependent Claim
38 words
The integrated circuit package as defined by claim 1 and further including a plurality of solder ball pads on the bottom surface of the substrate interconnected with bonding pads on the top surface by vias through the substrate.
Claim 12
Dependent Claim
30 words
The integrated circuit package as defined by claim 10 and further including a plurality of solder balls contacting solder ball contacts for interconnecting the integrated circuit chip with a motherboard.
Claim 13
Dependent Claim
39 words
The integrated circuit package as defined by claim 1 and further including a second metal layer interconnect pattern on the bottom surface of the substrate and interconnected with bonding pads on the top surface by vias through the substrate.
References Cited (Backward Citations)
US5681777A
Cited
US5592025A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-23 | 2002-05-25 | 2002-11-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-23 | 2006-05-25 | 2006-11-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-23 | 2010-05-25 | 2010-11-24 | $7700.00 | Window Closed / Lapsed |