Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
57 words
A semiconductor device comprising: a silicon wafer; a buried oxide film formed on said silicon wafer; a semiconductor active region formed on said buried oxide film; an element isolating region contiguous with said active region formed on said buried oxide film; and a nitrogen-containing region at the interface between said active region and said element isolating region.
Claim 2
Dependent Claim
57 words
A semiconductor device comprising: a silicon wafer; a buried oxide film formed on said silicon wafer; a semiconductor active region formed on said buried oxide film; an element isolating region contiguous with said active region formed on said buried oxide film; and a nitrogen-containing region at the interface between said active region and said element isolating region.
Claim 3
Dependent Claim
56 words
A semiconductor device comprising: a silicon wafer; a semiconductor active region formed on a major surface of said silicon wafer; an element isolating region contiguous with said semiconductor active region formed on said major surface of said silicon wafer; and a nitrogen-containing region at the interface between said semiconductor active region and said element isolating region.
Claim 4
Dependent Claim
56 words
A semiconductor device comprising: a silicon wafer; a semiconductor active region formed on a major surface of said silicon wafer; an element isolating region contiguous with said semiconductor active region formed on said major surface of said silicon wafer; and a nitrogen-containing region at the interface between said semiconductor active region and said element isolating region.
Claim 5
Dependent Claim
25 words
The semiconductor device according to claim 1, wherein the thickness of the element isolating region is substantially equal to the thickness of the active region.
Claim 6
Dependent Claim
26 words
The semiconductor device according to claim 2, wherein the thickness of the element isolating region is substantially equal to the thickness of the semiconductor active region.
Claim 7
Dependent Claim
24 words
The semiconductor device according to claim 1, wherein said element isolating region and said active region are formed laterally in substantially the same level.
Claim 8
Dependent Claim
24 words
The semiconductor device according to claim 2, wherein said element isolating region and said active region are formed laterally in substantially the same level.
Claim 9
Dependent Claim
24 words
The semiconductor device according to claim 1, further comprising a nitrogen-containing region at the interface between the active region and said buried oxide film.
Claim 10
Dependent Claim
88 words
A semiconductor device comprising: a silicon wafer; a buried oxide film formed on said silicon wafer; a semiconductor active region formed on said buried oxide film; an element isolating region contiguous with said active region formed on said buried oxide film; and a nitrogen-containing region at the interface between said active region and said element isolating region and/or at the interface between said active region and said buried oxide film; wherein the thickness of the element isolating region is substantially equal to the thickness of the active region.
Claim 11
Dependent Claim
88 words
A semiconductor device comprising: a silicon wafer; a buried oxide film formed on said silicon wafer; a semiconductor active region formed on said buried oxide film; an element isolating region contiguous with said active region formed on said buried oxide film; and a nitrogen-containing region at the interface between said active region and said element isolating region and/or at the interface between said active region and said buried oxide film; wherein the thickness of the element isolating region is substantially equal to the thickness of the active region.