Encapsulated, board-mountable power supply and method of manufacture therefor

Claim 2

A power supply, comprising: a circuit board containing conductors interconnecting electrical components of said power supply, one of said conductors forming windings and a core disposed through apertures of said circuit board proximate said windings, said windings and said core forming a power magnetic device; a thermally-conductive case having an integral electrically insulating layer, said thermally-conductive case forming a reservoir to receive said circuit board therein; a power semiconductor device having a body connected in thermal communication with said thermally-conductive case and terminals coupled to said conductors of said circuit board; an encapsulant, located within said reservoir, said encapsulant ensconcing said power semiconductor device, said power magnetic device and said electrical components; and electrical leads extending from said power supply that allow said power supply to be coupled to a printed wiring board.

Claim 3

The power supply as recited in claim 1 wherein said thermally-conductive case further comprises an integral electrically conductive circuit layer, portions of said circuit layer capable of being removed to form electrically conductive traces therein.

Claim 4

The power supply as recited in claim 1 wherein said electrical leads comprise posts extending from said circuit board.

Claim 5

The power supply as recited in claim 1 wherein said power semiconductor device is soldered to said thermally-conductive case.

Claim 6

The power supply as recited in claim 1 wherein said encapsulant substantially fills said reservoir.

Claim 7

The power supply as recited in claim 1 wherein said thermally-conductive case further comprises an integral electrically conductive circuit layer, portions of said circuit layer capable of being removed to form electrically conductive traces therein, said traces coupled to a conductor of said circuit board and forming said electrical leads.

Claim 8

A power supply, comprising: a circuit board containing conductors interconnecting electrical components of said power supply, one of said conductors forming windings and a core disposed through apertures of said circuit board proximate said windings, said windings and said core forming a power magnetic device; a metal case having an integral electrically insulating middle layer and an integral electrically conductive inner circuit layer, portions of said inner circuit layer capable of being removed to form electrically conductive aces therein, said metal case forming a five-sided reservoir to receive said circuit board therein; a power semiconductor device having a body connected in thermal communication with said metal case and terminals coupled to said conductors of said circuit board; an encapsulant, located within said reservoir, said encapsulant ensconcing said power semiconductor device, said power magnetic device and said electrical components; and electrical leads extending from said power supply that allow said power supply to be coupled to a printed wiring board.

Claim 9

A power supply, comprising: a circuit board containing conductors interconnecting electrical components of said power supply, one of said conductors forming windings and a core disposed through apertures of said circuit board proximate said windings, said windings and said core forming a power magnetic device; a metal case having an integral electrically insulating middle layer and an integral electrically conductive inner circuit layer, portions of said inner circuit layer capable of being removed to form electrically conductive aces therein, said metal case forming a five-sided reservoir to receive said circuit board therein; a power semiconductor device having a body connected in thermal communication with said metal case and terminals coupled to said conductors of said circuit board; an encapsulant, located within said reservoir, said encapsulant ensconcing said power semiconductor device, said power magnetic device and said electrical components; and electrical leads extending from said power supply that allow said power supply to be coupled to a printed wiring board.

Claim 10

The power supply as recited in claim 7 wherein said traces are coupled to a conductor of said circuit board and form said electrical leads.

Claim 11

The power supply as recited in claim 7 wherein said electrical leads comprise posts extending from said circuit board.

Claim 12

The power supply as recited in claim 7 wherein said power semiconductor device is a power switch.

Claim 13

The power supply as recited in claim 7 wherein said encapsulant substantially fills said reservoir.

Claim 14

The power supply as recited in claim 7 wherein said electrical components comprise a transformer, output filter circuit and control circuitry.

Claim 17

The method as recited in claim 13 wherein said thermally-conductive case further comprises an integral electrically conductive circuit layer, the step of providing further comprising the step of removing a portion of said circuit layer to form electrically conductive traces therein.

Claim 18

The method as recited in claim 13 further comprising the step of mounting posts to said circuit board to form said electrical leads.

Claim 19

The method as recited in claim 13 wherein said step of placing said body comprises the step of soldering said power semiconductor device to said thermally-conductive case.

Claim 20

The method as recited in claim 13 wherein said step of placing said encapsulant comprises the step of substantially filling said reservoir with said encapsulant.

Claim 21

The method as recited in claim 13 further comprising the step of forming said thermally-conductive case from a substantially planar thermally-conductive material, a periphery of said planar thermally-conductive material being folded inward to form said reservoir of said thermally-conductive case.