US5834335A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Non-metallurgical connection between an integrated circuit and a circuit board or another integrated circuit
Assignee: Texas Instruments Inc
•
Filing: 1996-09-27
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Granted: 1998-11-10
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Expires: 2016-09-27
Abstract
Abstract A method is disclosed for making a non-metallurgical connection between an integrated circuit (16) and either a circuit board (12) or second integrated circuit. In one embodiment, an electrical connection is formed between terminals (28) of an integrated circuit (16) and pads (20) on a circuit board (12) without metallurgically connecting the terminals (28) and pads (20). The integrated circuit (16) can be in either packaged or die form. A clamping mechanism (18, 36) attached to the circuit board (12) clamps the integrated circuit (16) to the circuit board (12).
Inventors
- 👤 Milton L. Buschbom
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 02:42
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/66; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
83 words
A method for making a nonmetallurgical connection between an integrated circuit and a circuit board, comprising: forming a first pad on the circuit board having a large number of asperites; forming an electrical connection between a first terminal of the integrated circuit and the first pad on the circuit board without metallurgically connecting the first terminal and the first pad; and clamping the integrated circuit to the circuit board using a clamping mechanism, wherein the clamping mechanism is fastened to the circuit board.
Claim 2
Independent Claim
83 words
A method for making a nonmetallurgical connection between an integrated circuit and a circuit board, comprising: forming a first pad on the circuit board having a large number of asperites; forming an electrical connection between a first terminal of the integrated circuit and the first pad on the circuit board without metallurgically connecting the first terminal and the first pad; and clamping the integrated circuit to the circuit board using a clamping mechanism, wherein the clamping mechanism is fastened to the circuit board.
Claim 3
Dependent Claim
14 words
The method of claim 1 wherein the clamping mechanism comprises an external heat sink.
Claim 4
Dependent Claim
13 words
The method of claim 1 wherein the clamping mechanism comprises a plastic frame.
Claim 5
Dependent Claim
33 words
The method of claim 1, further comprising: positioning an interposer between the integrated circuit and the circuit board, the interposer comprising a first contact electrically connecting the first terminal and the first pad.
Claim 6
Dependent Claim
14 words
The method of claim 4, wherein the clamping mechanism comprises an external heat sink.
Claim 7
Dependent Claim
13 words
The method of claim 4, wherein the clamping mechanism comprises a plastic frame.
Claim 8
Dependent Claim
11 words
The method of claim 1, wherein the clamping mechanism is spring-loaded.
Claim 9
Independent Claim
90 words
A method for making a nonmetallurgical connection between a first integrated circuit and a second integrated circuit, comprising: forming a first pad on the second integrated circuit having a large number of asperites; forming an electrical connection between a first terminal of the integrated circuit and the first pad on the second integrated circuit without metallurgically connecting the first terminal and the first pad; and clamping the first integrated circuit to the second integrated circuit using a clamping mechanism, wherein the clamping mechanism is fastened to the second integrated circuit.
Claim 10
Independent Claim
90 words
A method for making a nonmetallurgical connection between a first integrated circuit and a second integrated circuit, comprising: forming a first pad on the second integrated circuit having a large number of asperites; forming an electrical connection between a first terminal of the integrated circuit and the first pad on the second integrated circuit without metallurgically connecting the first terminal and the first pad; and clamping the first integrated circuit to the second integrated circuit using a clamping mechanism, wherein the clamping mechanism is fastened to the second integrated circuit.
Claim 11
Dependent Claim
35 words
The method of claim 8, further comprising: positioning an interposer between the first integrated circuit and the second integrated circuit, the interposer comprising a first contact electrically connecting the first terminal and the first pad.
Claim 12
Dependent Claim
14 words
The method of claim 8 wherein the clamping mechanism comprises an external heat sink.
Claim 13
Dependent Claim
43 words
The method of claim 1 wherein: the step of forming a first pad on the circuit board having a large number of asperites consists of disposing a particulate material having a large number of very sharp and hard points on said first pad.
Claim 14
Dependent Claim
12 words
The method of claim 11 wherein: the particular material includes diamond particles.
Claim 15
Dependent Claim
11 words
The method of claim 11 wherein: the particular material includes carbides.
Claim 16
Dependent Claim
11 words
The method of claim 11 wherein: the particular material includes oxides.
Claim 17
Dependent Claim
11 words
The method of claim 11 wherein: the particular material includes abrasive.
Claim 18
Dependent Claim
43 words
The method of claim 8 wherein: the step of forming a first pad on the circuit board having a large number of asperites consists of disposing a particulate material having a large number of very sharp and hard points on said first pad.
Claim 19
Dependent Claim
12 words
The method of claim 16 wherein: the particular material includes diamond particles.
Claim 20
Dependent Claim
11 words
The method of claim 16 wherein: the particular material includes carbides.
Claim 21
Dependent Claim
11 words
The method of claim 16 wherein: the particular material includes oxides.
Claim 22
Dependent Claim
6 words
The method of claim 16 wherein:
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-09 | 2002-05-11 | 2002-11-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-09 | 2006-05-11 | 2006-11-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-09 | 2010-05-11 | 2010-11-10 | $7700.00 | Window Closed / Lapsed |