Interconnection structures and method of making same
Abstract
Abstract This invention relates to an interconnection structure comprising one or more insulating films and one or more layers of conductor electrode patterns, wherein at least one of the insulating films consists of a fluorene skeleton-containing epoxy acrylate resin, and to a method of making a multilayer interconnection structure including the steps of roughening the surface of an insulating resin layer and forming a conductor thereon by electroless plating, wherein the average roughness (Ra), maximum roughness (Ry) and conductor thickness (T) of the roughened surface of the insulating resin layer satisfy the following relations: 0.2≦Ra≦0.6 (unit: μm) (1) 0.02≦Ra/T≦0.2 (2) 0.05≦Ry/T≦0.5 (3) and catalyst nuclei for electroless plating are supplied by applying a solution of a metallic salt to the roughened surface of the insulating resin layer or dipping the substrate in a solution of a metallic salt, drying and heat-treating the substrate, and then subjecting it to displacement palladium plating.
Inventors
- 👤 Tadanori Shimoto
- 👤 Yoshitsugu Funada
- 👤 Koji Matsui
- 👤 Yuzo Shimada
- 👤 Kazuaki Utsumi
Bibliographic Details
Claims Analysis
Total Claims: 10References Cited (Backward Citations)
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