US5349155A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Insulating material for wiring substrate and method of producing multi-layered wiring substrate
Assignee: Fujitsu Ltd
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Filing: 1993-01-15
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Granted: 1994-09-20
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Expires: 2013-01-15
Abstract
Abstract This invention relates to an insulating material for a wiring substrate and to a method of producing a multi-layered wiring substrate, and is directed to put into practical application a multi-layered wiring substrate suitable for processing high speed signals. The production method of the multi-layered wiring substrate of this invention uses an insulating material prepared by allowing voids of a porous perfluorocarbon polymer film to be impregnated with a thermosetting resin containing a benzocyclobutene ring, and thermally setting the resin, and comprises laminating alternately a wiring layer and an insulating layer made of the insulating material for the wiring substrate on a rigid support substrate.
Inventors
- 👤 Yasuo Yamagishi
- 👤 Tamotsu Owada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 06:34
CPC Classifications
B; B23; B23K; B23K26/00; B23K26/02; B23K26/06; B23K26/062; B23K26/0622; B23K26/0624; B23K26/064; B23K26/066; B23K26/36; B23K26/38; B23K26/382; B23K26/389; B23K26/40; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/67; H10W70/68; H10W70/685; B23K2101/00; B23K2101/36; B23K2101/42; B23K2103/00; B23K2103/16; B23K2103/30; B23K2103/42; B23K2103/50; B23K2103/52
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
49 words
A method of producing a multi-layered wiring substrate comprising alternately laminating a wiring layer and an insulating layer made of insulating material on a rigid support substrate, said insulating material being a porous perfluorocarbon polymer film having void portion impregnated with a thermally set resin having a benzocyclobutene ring.
Claim 2
Independent Claim
49 words
A method of producing a multi-layered wiring substrate comprising alternately laminating a wiring layer and an insulating layer made of insulating material on a rigid support substrate, said insulating material being a porous perfluorocarbon polymer film having void portion impregnated with a thermally set resin having a benzocyclobutene ring.
Claim 3
Dependent Claim
28 words
A method of producing a multi-layer circuit substrate according to claim 1, further including forming via holes for connecting said layers by ablation utilizing an excimer laser beam.
Claim 4
Independent Claim
82 words
A method of forming holes of a wiring substrate for forming via holes in an insulating film of a multi-layered wiring substrate by utilizing ablation by an excimer laser beam, wherein said insulating film is prepared by allowing a porous perfluorocarbon polymer film to be impregnated with a thermosetting resin containing an aromatic ring or hetero ring, and said excimer laser beam has a wavelength of not smaller than 190 nm and an emission time per pulse of at least 1 ns.
Claim 5
Independent Claim
82 words
A method of forming holes of a wiring substrate for forming via holes in an insulating film of a multi-layered wiring substrate by utilizing ablation by an excimer laser beam, wherein said insulating film is prepared by allowing a porous perfluorocarbon polymer film to be impregnated with a thermosetting resin containing an aromatic ring or hetero ring, and said excimer laser beam has a wavelength of not smaller than 190 nm and an emission time per pulse of at least 1 ns.
Claim 6
Dependent Claim
26 words
A method of forming via holes of a wiring substrate according to claim 3, wherein said thermosetting resin contains a benzocyclobutene ring in a structure thereof.
Claim 7
Dependent Claim
25 words
A method of forming via holes of a wiring substrate according to claim 3, wherein said excimer laser beam is a KrF or XeCl laser.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-09-19 | 1998-03-21 | 1998-09-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-09-19 | 2002-03-21 | 2002-09-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-09-19 | 2006-03-21 | 2006-09-20 | $7700.00 | Window Closed / Lapsed |