US5821665A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Surface acoustic wave device and method of manufacture
Assignee: Skyworks Filter Solutions Japan Co Ltd
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Filing: 1996-05-08
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Granted: 1998-10-13
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Expires: 2016-05-08
Abstract
Abstract A compact, low height, low cost, and high reliability surface acoustic wave device, and its method of manufacture. The surface acoustic wave device consists of a substrate, a comb-electrode disposed on the main surface of the substrate, plural electrode pads disposed around the comb-electrode, protecting means covering the comb-electrode through a closed space produced by combining the comb-electrode and the electrode pads with the substrate by using substantially covalent bonding force acting between conductive bumps formed on the electrode bumps, a conductive adhesive layer disposed at least on the top of the conductive bumps, and a package adhered on the conductive bumps by means of the conductive adhesive, and insulation adhesive filled into the package contacting the conductive adhesive, the conductive bumps and the protective means.
Inventors
- 👤 Keiji Onishi
- 👤 Shun-ichi Seki
- 👤 Yutaka Taguchi
- 👤 Kazuo Eda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 18:09
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/10; H03H9/1064; H03H9/1071; H03H9/02535; H03H9/02818; H03H9/02937; H03H9/058; H03H9/059; H03H9/1092; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/20; H10W72/221; H10W72/222; H10W72/225; H10W72/251; H10W72/252; H10W72/253; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; Y; Y10; Y10T; Y10T29/00; Y10T29/42
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
152 words
A surface acoustic wave device comprising: a comb-electrode formed on a main surface of a substrate, plural electrode pads disposed on the periphery of said comb-electrode, protection means covering said comb-electrode through a space formed by a substantially covalent bonding established between said protection means and said substrate in an area of said substrate between said comb-electrode and said plural electrode pads, conductive bumps formed on the tops of said plural electrode pads, said conductive bumps consisting of a base bonded to said electrode pad and a protrusion formed on said base, wherein a height of said base is higher than a height of said protection means, a conductive adhesive layer disposed at least on the tops of said conductive bumps, a package adhered on said conductive bumps by means of said conductive adhesive, and insulating adhesive contacting with said conductive adhesive, said conductive bumps, and said protection means, filling said package.
Claim 2
Dependent Claim
152 words
A surface acoustic wave device comprising: a comb-electrode formed on a main surface of a substrate, plural electrode pads disposed on the periphery of said comb-electrode, protection means covering said comb-electrode through a space formed by a substantially covalent bonding established between said protection means and said substrate in an area of said substrate between said comb-electrode and said plural electrode pads, conductive bumps formed on the tops of said plural electrode pads, said conductive bumps consisting of a base bonded to said electrode pad and a protrusion formed on said base, wherein a height of said base is higher than a height of said protection means, a conductive adhesive layer disposed at least on the tops of said conductive bumps, a package adhered on said conductive bumps by means of said conductive adhesive, and insulating adhesive contacting with said conductive adhesive, said conductive bumps, and said protection means, filling said package.
Claim 3
Dependent Claim
25 words
A surface acoustic wave device according to claim 1, wherein an indentation is provided in said protecting means at a region facing said comb-electrode region.
Claim 4
Dependent Claim
26 words
A surface acoustic wave device according to claim 1, wherein said protecting means consists of a single crystal being the same as that of said substrate.
Claim 5
Dependent Claim
19 words
A surface acoustic wave device according to claim 1, wherein an insulating protection layer is formed on said comb-electrode.
Claim 6
Dependent Claim
25 words
A surface acoustic wave device according to claim 1, wherein said insulating protection means consists of an inorganic material of either silicon or silicon oxide.
Claim 7
Dependent Claim
174 words
A surface acoustic wave device comprising: a comb electrode formed on the main surface of an insulating layer, electrode pads disposed on the periphery of said comb-electrode, an insulating layer formed to surround said comb-electrode at an area between said comb-electrode and said plural electrode pads, protection means covering said comb-electrode through a space formed by a substantially covalent bonding established between said protection means and said insulating layer in an area of said insulating layer between said comb-electrode and said plural electrode pads, conductive bumps formed on the tops of said electrode pads, said conductive bumps consisting of a base bonded to said electrode pad and a protrusion formed on said base, wherein a height of said base is higher than a height of said protection means, a conductive adhesive layer disposed at least on the tops of said conductive bumps, a package adhered on said conductive bumps by means of said conductive adhesive, and an insulating adhesive contacting with said conductive adhesive, said conductive bumps, and said protection means, filling said package.
Claim 8
Dependent Claim
174 words
A surface acoustic wave device comprising: a comb electrode formed on the main surface of an insulating layer, electrode pads disposed on the periphery of said comb-electrode, an insulating layer formed to surround said comb-electrode at an area between said comb-electrode and said plural electrode pads, protection means covering said comb-electrode through a space formed by a substantially covalent bonding established between said protection means and said insulating layer in an area of said insulating layer between said comb-electrode and said plural electrode pads, conductive bumps formed on the tops of said electrode pads, said conductive bumps consisting of a base bonded to said electrode pad and a protrusion formed on said base, wherein a height of said base is higher than a height of said protection means, a conductive adhesive layer disposed at least on the tops of said conductive bumps, a package adhered on said conductive bumps by means of said conductive adhesive, and an insulating adhesive contacting with said conductive adhesive, said conductive bumps, and said protection means, filling said package.
Claim 9
Dependent Claim
25 words
A surface acoustic wave device according to claim 6, wherein said insulation layer is made of an inorganic material of either silicon or silicon oxide.
Claim 10
Dependent Claim
24 words
A surface acoustic wave device according to claim 6, wherein an indentation is provided on said protecting means at an area facing said comb-electrode.
Claim 11
Dependent Claim
27 words
A surface acoustic wave device according to claim 6, wherein said protection means is made of a single crystal being the same as that of said substrate.
Claim 12
Dependent Claim
20 words
A surface acoustic wave device according to claim 6, wherein said protection means is made of either quartz or glass.
Claim 13
Dependent Claim
19 words
A surface acoustic wave device according to claim 6, wherein an insulating protection layer is formed on said comb-electrode.
Claim 14
Dependent Claim
25 words
A surface acoustic wave device according to claim 11, wherein said insulating protection layer is made of inorganic material of wither silicon or silicon oxide.
Claim 15
Dependent Claim
134 words
A surface acoustic wave device comprising: a comb-electrode formed on a main surface of a substrate, plural electrode pads disposed on the periphery of said comb-electrode, protection means covering said comb-electrode through a space formed by a substantially covalent bonding established between said protection means and said substrate in an area of said substrate between said comb-electrode and said plural electrode pads, conductive bumps formed on the tops of said plural electrode pads, wherein a height of said conductive bumps is higher than a height of said protection means, a conductive adhesive layer disposed at least on the tops of said conductive bumps, a package adhered on said conductive bumps by means of said conductive adhesive, and insulating adhesive contacting with said conductive adhesive, said conductive bumps, and said protection means, filling said package.
Claim 16
Dependent Claim
134 words
A surface acoustic wave device comprising: a comb-electrode formed on a main surface of a substrate, plural electrode pads disposed on the periphery of said comb-electrode, protection means covering said comb-electrode through a space formed by a substantially covalent bonding established between said protection means and said substrate in an area of said substrate between said comb-electrode and said plural electrode pads, conductive bumps formed on the tops of said plural electrode pads, wherein a height of said conductive bumps is higher than a height of said protection means, a conductive adhesive layer disposed at least on the tops of said conductive bumps, a package adhered on said conductive bumps by means of said conductive adhesive, and insulating adhesive contacting with said conductive adhesive, said conductive bumps, and said protection means, filling said package.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-10-12 | 2002-04-13 | 2002-10-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-10-12 | 2006-04-13 | 2006-10-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-10-12 | 2010-04-13 | 2010-10-13 | $7700.00 | Window Closed / Lapsed |