EP0622897A2
Expired / Lapsed
EP
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Surface acoustic wave device and method of manufacturing the same
Assignee: Panasonic Holdings Corp
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Filing: 1994-04-27
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Granted: —
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Expires: 2014-04-27
Abstract
Abstract A surface acoustic wave device is manufactured by directly or indirectly bonding a lid to a substrate having a surface acoustic wave element to seal the element under the lid. The lid is made of at least one material selected from the group comprising lithium niobate, lithium tantalete, lithium borate, glass and quartz. The substrate is made of at least one material selected from the group comprising quartz, lithium niobate, lithium tantalete and lithium borate. <IMAGE>
Inventors
- 👤 Akihiro Kanaboshi
- 👤 Masato Sugimoto
- 👤 Yutaka Taguchi
- 👤 Kazuo Eda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 19:03
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/10; H03H9/1064; H03H9/1092
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
53 words
A surface acoustic wave device, comprising a substrate having a surface acoustic wave element and a lid, wherein said substrate and said lid are bonded to each other by an inorganic covalent bond formed from the same material as said substrate and said lid, thus substantially sealing said surface acoustic wave element therebetween.
Claim 2
Dependent Claim
29 words
A surface acoustic wave device according to claim 1, wherein the gap between the substrate and the lid is substantially airtight and filled with silicon or a silicon compound.
Claim 3
Dependent Claim
33 words
A surface acoustic wave device according to claim 1 or 2, wherein the substrate is at least one material selected from the group consisting of quartz, lithium niobate, lithium tantalete and lithium borate.
Claim 4
Dependent Claim
19 words
A surface acoustic wave device according to claim 2, wherein the silicon compound is silicon oxide or silicon nitride.
Claim 5
Dependent Claim
35 words
A surface acoustic wave device according to any of claims 1 to 4, wherein the coefficient of thermal expansion of the lid is substantially the same as the coefficient of thermal expansion of the substrate.
Claim 6
Dependent Claim
34 words
A surface acoustic wave device according to any of claims 1 to 5, wherein a metal film is formed on one of the surface of the lid and the back side of the substrate.
Claim 7
Dependent Claim
38 words
A surface acoustic wave device according to any of claims 1 to 6, wherein the lid is made of at least one material selected from the group consisting of quartz, glass, lithium niobate, lithium tantalete and lithium borate.
Claim 8
Dependent Claim
39 words
A surface acoustic wave device according to any of claims 1 to 7, wherein sections where gaps between lead electrodes of the surface acoustic wave element and the lid are filled with a glass having a low boiling point.
Claim 9
Independent Claim
43 words
A method of manufacturing a surface acoustic wave device, comprising the steps of cleaning the surfaces of a substrate and a lid, and adding voltage to interfaces between said lid and said substrate, thus bonding said lid to said substrate by anodic bonding.
Claim 10
Independent Claim
77 words
A method of manufacturing a surface acoustic wave device, comprising the steps of: cleaning the surfaces of a substrate and a lid; treating the surfaces of said substrate and said lid to become hydrophilic; contacting said treated surfaces; and treating said contacted surfaces with heat, thus directly bonding said lid to said substrate, said lid being made of at least one material selected from the group consisting of lithium niobate, lithium tantalete, lithium borate, glass and quartz.
Claim 11
Dependent Claim
22 words
A method according to claim 9 or 10, wherein the surface of the lid is made of silicon or a silicon compound.
Claim 12
Independent Claim
24 words
A method according to any of claims 9 to 11, wherein the surface of the substrate is made of silicon or a silicon compound.
Claim 13
Independent Claim
19 words
A method according to any of claims 9 to 12, wherein the back surface of the substrate is roughened.
Claim 14
Independent Claim
28 words
A method according to any of claims 9 to 13, wherein gaps between lead electrodes and the lid are filled with a glass having a low melting point.
Claim 15
Independent Claim
34 words
A method according to any of claims 9 to 14, wherein voltage is applied to interfaces between the lid and the substrate while they are heated, thus anodically bonding said lid to said substrate.
Claim 16
Dependent Claim
20 words
A method according to claim 15, wherein the temperature of heating the substrate and the lid is higher than 100°C.
Claim 17
Dependent Claim
20 words
A method according to claim 15, wherein the temperature of heating the substrate and the lid is higher than 200°C.
References Cited (Backward Citations)
No citation records indexed.
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