Patent US5814877A successfully refreshed from Google Patents.
US5814877A
Expired / Lapsed
US
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Single layer leadframe design with groundplane capability
Assignee: GlobalFoundries Inc
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Filing: 1996-03-04
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Granted: 1998-09-29
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Expires: 2016-03-04
Abstract
Abstract A method of making an electronic package. The method includes the step providing a leadframe of a single layer of material. The leadframe includes a semiconductor chip support, a plurality of signal leads, and a common ground portion substantially surrounding the chip support portion. A semiconductor chip having a plurality of signal sites and a plurality of ground sites is positioned on the semiconductor chip support of the leadframe. Selected ones of the signal sites of the semiconductor chip are selectively electrically connected to respective ones of the signal leads of the lead frame and selective ones of the ground sites of the semiconductor chip are selectively electrically connected to the common ground portion of the leadframe. Each of the signal leads of the leadframe are electrically isolated from each other and from the common ground portion of the leadframe.
Inventors
- 👤 Steven Joel Diffenderfer
- 👤 Hussain Shaukatullah
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 10:13
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/421; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
57 words
A leadframe, comprising: a single layer of an electrically conducting material; a semiconductor chip support; a common ground portion surrounding said semiconductor chip support and electrically connected thereto; a plurality of signal leads electrically isolated from each other and from said common ground portion; and a plurality of ground leads electrically connected to said common ground portion.
Claim 2
Dependent Claim
57 words
A leadframe, comprising: a single layer of an electrically conducting material; a semiconductor chip support; a common ground portion surrounding said semiconductor chip support and electrically connected thereto; a plurality of signal leads electrically isolated from each other and from said common ground portion; and a plurality of ground leads electrically connected to said common ground portion.
Claim 3
Dependent Claim
44 words
A leadframe according to claim 1, further comprising tie bars for connecting said common ground portion to said semiconductor chip support, said tie bars both supporting said semiconductor chip support and providing electrical connection between said common ground portion and said semiconductor chip portion.
Claim 4
Dependent Claim
26 words
A leadframe according to claim 1, wherein said leadframe is formed of a metal selected from the group consisting of copper, copper alloys, and nickel-iron alloys.
Claim 5
Dependent Claim
20 words
A leadframe according to claim 1, wherein said ground, leads, and support are formed by stamping them in said leadframe.
Claim 6
Dependent Claim
20 words
A leadframe according to claim 1, wherein said ground, leads, and support are formed by etching them in said leadframe.
Claim 7
Dependent Claim
26 words
An electronic package according to claim 1, further comprising a slug attached to the semiconductor chip support on a surface opposite where said chip is attached.
Claim 8
Dependent Claim
124 words
An electronic package, comprising: a leadframe, comprising a single layer of an electrically conducting material, a semiconductor chip support, a common ground portion surrounding said semiconductor chip support and electrically connected thereto, a plurality of signal leads electrically isolated from each other and from said common ground portion, and a plurality of ground leads electrically connected to said common ground portion; a semiconductor chip including a plurality of signal sites and a plurality of ground sites, said semiconductor chip being mounted on said semiconductor chip support of said leadframe; and a plurality of electrical connections between selected ones of said signal sites to respective ones of said signal leads and between selected ones of said ground sites to respective ones of said ground leads.
Claim 9
Dependent Claim
124 words
An electronic package, comprising: a leadframe, comprising a single layer of an electrically conducting material, a semiconductor chip support, a common ground portion surrounding said semiconductor chip support and electrically connected thereto, a plurality of signal leads electrically isolated from each other and from said common ground portion, and a plurality of ground leads electrically connected to said common ground portion; a semiconductor chip including a plurality of signal sites and a plurality of ground sites, said semiconductor chip being mounted on said semiconductor chip support of said leadframe; and a plurality of electrical connections between selected ones of said signal sites to respective ones of said signal leads and between selected ones of said ground sites to respective ones of said ground leads.
Claim 10
Dependent Claim
48 words
An electronic package according to claim 7, wherein said leadframe further comprises tie bars for connecting said common ground portion to said semiconductor chip support, said tie bars both supporting said semiconductor chip support and providing electrical connection between said common ground portion and said semiconductor chip portion.
Claim 11
Dependent Claim
37 words
An electronic package according to claim 7, further comprising: a protective enclosure substantially about said semiconductor chip, said semiconductor chip support, said common ground portion of said leadframe, and at least a portion of said signal leads.
Claim 12
Dependent Claim
27 words
An electronic package according to claim 7, wherein said leadframe is formed of a metal selected from the group consisting of copper, copper alloys, and nickel-iron alloys.
Claim 13
Dependent Claim
21 words
An electronic package according to claim 7, wherein said ground, leads, and support are formed by stamping them in said leadframe.
Claim 14
Dependent Claim
20 words
An electronic package according to claim 7, wherein said ground, leads, and support are formed by etching themin said leadframe.
Claim 15
Dependent Claim
31 words
An electronic package according to claim 7, wherein said chip is positioned with a method selected from the group consisting of adhesive, and solder, gold/silicon eutectic, and other metallurgical bonding techniques.
Claim 16
Dependent Claim
45 words
An electronic package according to claim 7, wherein said selected ones of said signal sites are electrically connected to respective ones of said signal leads and selective ones of said ground sites are electrically connected to said common ground portion of said leadframe by wire-bonding.
Claim 17
Dependent Claim
42 words
An electronic package according to claim 9, wherein said protective enclosure comprises a first base part and a cover part and said leadframe is positioned on said base part and said cover part is applied over said base part and said leadframe.
Claim 18
Dependent Claim
28 words
An electronic package according to claim 9, wherein said protective enclosure is made of at least one material selected from the group consisting of metal, ceramic, and plastic.
Claim 19
Dependent Claim
21 words
An electronic package according to claim 7, wherein said leadframe and said semiconductor chip are encapsulated within an electrically insulating material.
Claim 20
Dependent Claim
26 words
An electronic package according to claim 7, further comprising a slug attached to the die bond pad on a surface opposite where said chip is attached.
Claim 21
Dependent Claim
19 words
An electronic package according to claim 9, wherein said protective enclosure comprises an encapsulation of an electrically insulating material.
Claim 22
Dependent Claim
83 words
A leadframe, comprising: a single layer of an electrically conducting material; a semiconductor chip support; a common ground portion surrounding said semiconductor chip support and electrically connected thereto; a plurality of structural supports attached to said common ground portion and extending from said common ground portion toward and away from said semiconductor chip support; a plurality of signal leads electrically isolated from each other and from said common ground portion; and a plurality of ground leads electrically connected to said common ground portion.
Claim 23
Dependent Claim
83 words
A leadframe, comprising: a single layer of an electrically conducting material; a semiconductor chip support; a common ground portion surrounding said semiconductor chip support and electrically connected thereto; a plurality of structural supports attached to said common ground portion and extending from said common ground portion toward and away from said semiconductor chip support; a plurality of signal leads electrically isolated from each other and from said common ground portion; and a plurality of ground leads electrically connected to said common ground portion.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-09-28 | 2002-03-30 | 2002-09-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-09-28 | 2006-03-30 | 2006-09-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-09-28 | 2010-03-30 | 2010-09-29 | $7700.00 | Window Closed / Lapsed |