Abstract A method for fabricating an integrated circuit capacitor having a dielectric layer comprising BST with excess B-site material, such as titanium, added. A polyoxyalkylated metal liquid precursor solution is prepared comprising a stock solution of BST of greater then 99.999% purity blended with excess B-site material such as titanium such that the titanium is in the range of 0-100 mol %. A xylene exchange is then performed to adjust the viscosity of the solution for spin-on application to a substrate. The precursor is spun on a first electrode, dried at 400 DEG C. for 2 minutes, then annealed at 650 DEG C. to 800 DEG C. for about an hour to form a layer of BST with excess titanium. A second electrode is deposited, patterned, and annealed at between 650 DEG C. to 800 DEG C. for about 30 minutes. The resultant capacitor exhibits an enlarged dielectric constant with only a small increase in leakage current.
An integrated circuit comprising: a substrate, a thin film of barium strontium titanate formed on said substrate, said thin film including excess B-site material in an amount ranging from 0.01 mol % to 100 mol % more than is required to satisfy a formula ABO 3 wherein A is total A-site material, B is total B-site material, and O is oxygen; and wiring layers operably configured to include said thin film of barium strontium titanate as a portion of an integrated circuit, said thin film having a thickness of less than 1600 Å.
Claim 2
Dependent Claim
93 words
An integrated circuit comprising: a substrate, a thin film of barium strontium titanate formed on said substrate, said thin film including excess B-site material in an amount ranging from 0.01 mol % to 100 mol % more than is required to satisfy a formula ABO 3 wherein A is total A-site material, B is total B-site material, and O is oxygen; and wiring layers operably configured to include said thin film of barium strontium titanate as a portion of an integrated circuit, said thin film having a thickness of less than 1600 Å.
Claim 3
Dependent Claim
20 words
The integrated circuit of claim 1 wherein said thin film has a thickness ranging from 700 Å to 1510 Å.