Patent US5813870A successfully refreshed from Google Patents.
US5813870A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Selectively filled adhesives for semiconductor chip interconnection and encapsulation
Assignee: International Business Machines Corp
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Filing: 1996-07-12
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Granted: 1998-09-29
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Expires: 2016-07-12
Abstract
Abstract Dielectric adhesive film patterned with clusters of electrically conductive filaments that extend through the film thickness for providing electrical interconnection and encapsulation. The dielectric adhesive material is reworkable. The clusters are formed by selectively electroplating a noble metal at a high current density.
Inventors
- 👤 Michael Anthony Gaynes
- 👤 Jaynal Abedin Molla
- 👤 Steven Paul Ostrander
- 👤 Judith Marie Roldan
- 👤 George John Saxenmeyer
- 👤 George Frederick Walker
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:22
CPC Classifications
H; H01; H01R; H01R4/00; H01R4/58; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7424; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/01212; H10W72/071; H10W72/072
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
56 words
An interconnection and encapsulation structure comprising: a dielectric adhesive film having opposed first and second surfaces and a plurality of through-holes extending from said first surface to said second surface; each of said through-holes being filled with a cluster or electrically conductive filaments which are substantially dendritic in form extending beyond said first and second surfaces.
Claim 2
Dependent Claim
56 words
An interconnection and encapsulation structure comprising: a dielectric adhesive film having opposed first and second surfaces and a plurality of through-holes extending from said first surface to said second surface; each of said through-holes being filled with a cluster or electrically conductive filaments which are substantially dendritic in form extending beyond said first and second surfaces.
Claim 3
Dependent Claim
14 words
The structure of claim 1 wherein the dielectric adhesive film comprises a thermoplastic material.
Claim 4
Dependent Claim
12 words
The structure of claim 2 wherein the thermoplastic material is polyimide siloxane.
Claim 5
Dependent Claim
11 words
The structure of claim 2 wherein the thermoplastic material is polysulfone.
Claim 6
Dependent Claim
78 words
An interconnection and encapsulation structure comprising: a first substrate having a plurality of first contact locations; a second substrate having a plurality of second contact locations; a dielectric adhesive film having a plurality of interconnect cluster means comprising a plurality of electrically conductive filaments which are substantially dendritic in form extending through said film, said film being sandwiched between said first and second substrate, said plurality of interconnect cluster means electrically connecting said first and second contact locations.
Claim 7
Dependent Claim
78 words
An interconnection and encapsulation structure comprising: a first substrate having a plurality of first contact locations; a second substrate having a plurality of second contact locations; a dielectric adhesive film having a plurality of interconnect cluster means comprising a plurality of electrically conductive filaments which are substantially dendritic in form extending through said film, said film being sandwiched between said first and second substrate, said plurality of interconnect cluster means electrically connecting said first and second contact locations.
Claim 8
Dependent Claim
19 words
The structure of claim 5 wherein said film encapsulates electrical circuit components at said first and second contact locations.
Claim 9
Dependent Claim
21 words
The structure of claim 6 wherein said electrical circuit components includes means for forming an electrical connection to an electrical circuit.
Claim 10
Dependent Claim
26 words
The structure of claim 5 wherein said plurality of electrically conductive filaments extend through a corresponding plurality of through-holes at pre-selected locations in said dielectric adhesive.
Claim 11
Dependent Claim
14 words
The structure of claim 5 wherein the dielectric adhesive film comprises a thermoplastic material.
Claim 12
Dependent Claim
12 words
The structure of claim 9 wherein the thermoplastic material is polyimide siloxane.
Claim 13
Dependent Claim
11 words
The structure of claim 9 wherein the thermoplastic material is polysulfone.
Claim 14
Dependent Claim
25 words
The structure of claim 1 wherein the dielectric adhesive film contains dispersed dielectric fillers to preselect the thermal conductivity and thermal expansion of said film.
Claim 15
Dependent Claim
41 words
An interconnection structure comprising: a dielectric adhesive film having opposed first and second surfaces and a plurality of through-holes extending from said first surface to said second surface; each of said through-holes being filled with a cluster of electrically conductive filaments.
Claim 16
Dependent Claim
41 words
An interconnection structure comprising: a dielectric adhesive film having opposed first and second surfaces and a plurality of through-holes extending from said first surface to said second surface; each of said through-holes being filled with a cluster of electrically conductive filaments.
Claim 17
Dependent Claim
15 words
The structure of claim 13 wherein the dielectric adhesive film comprises a thermoplastic reworkable material.
Claim 18
Dependent Claim
14 words
The structure of claim 13 wherein the dielectric material is a thermoset non-reworkable material.
Claim 19
Dependent Claim
74 words
An interconnection and encapsulation structure comprising: a first substrate having a plurality of first contact locations; a second substrate having a plurality of second contact locations; a dielectric adhesive film having a plurality of interconnect cluster means comprising a plurality of electrically conductive filaments which are substantially dendritic in form, said film being sandwiched between said first and second substrate, said plurality of interconnect cluster means electrically connecting said first and second contact locations.
Claim 20
Dependent Claim
74 words
An interconnection and encapsulation structure comprising: a first substrate having a plurality of first contact locations; a second substrate having a plurality of second contact locations; a dielectric adhesive film having a plurality of interconnect cluster means comprising a plurality of electrically conductive filaments which are substantially dendritic in form, said film being sandwiched between said first and second substrate, said plurality of interconnect cluster means electrically connecting said first and second contact locations.
Claim 21
Dependent Claim
19 words
The structure of claim 16 wherein said film encapsulates electrical circuit components at said first and second contact locations.
Claim 22
Dependent Claim
21 words
The structure of claim 17 wherein said electrical circuit components includes means for forming an electrical connection to an electrical circuit.
Claim 23
Dependent Claim
21 words
The structure of claim 16 wherein said plurality of interconnect cluster means fill through-holes at preselected locations in said dielectric adhesive.
Claim 24
Dependent Claim
14 words
The structure of claim 16 wherein the dielectric adhesive film comprises a thermoplastic material.
Claim 25
Dependent Claim
15 words
The structure of claim 16 wherein the dielectric adhesive film comprises a thermoset non-reworkable material.
Claim 26
Dependent Claim
25 words
The structure of claim 13 wherein the dielectric adhesive film contains dispersed dielectric fillers to preselect the thermal conductivity and thermal expansion of said film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-09-28 | 2002-03-30 | 2002-09-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-09-28 | 2006-03-30 | 2006-09-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-09-28 | 2010-03-30 | 2010-09-29 | $7700.00 | Window Closed / Lapsed |