US5798014A
Expired / Lapsed
US
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Methods of making multi-tier laminate substrates for electronic device packaging
Assignee: Interconnect Systems Inc
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Filing: 1996-10-16
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Granted: 1998-08-25
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Expires: 2016-10-16
Abstract
Abstract A method for making multi-tier laminate substrates for electronic device packaging is provided wherein a spacing mechanism is used to protect the bond fingers of a trace on a lower tier of the laminated substrate when a milling bit is used to cut an opening above a die cavity in the multi-tier substrate.
Inventors
- 👤 Patrick O. Weber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 19:06
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/021; B; B23; B23B; B23B35/00; H05K3/00; H05K3/46; H05K3/4697; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; H10W99/00; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09845; H05K2203/00; H05K2203/06; H05K2203/063; H05K2203/14; H05K2203/1476; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/0058; H05K3/0061; H10W70/682; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1062; Y10T156/1074; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
170 words
A method for making multi-tier laminate substrates for electronic device packaging comprising the steps of: providing a first laminating layer having a trace on a first side and a second laminating layer having a trace on a first side; making an annular depression in the first side of the first laminating layer; making a first window corresponding to the annular depression in at least one layer of dielectric; laminating together the first laminating layer, the second laminating layer, and the layer of dielectric to produce a laminated substrate, wherein the layer of dielectric is located between the trace on the first side of the first laminating layer and the trace on the first side of the second laminating layer; making vias through the laminated substrate; plating the vias; producing traces on a second side of the first laminating layer and a second side of the second laminating layer; making a first opening in the first laminating layer corresponding to the annular depression; and treating exposed surfaces of the laminating layers.
Claim 2
Independent Claim
170 words
A method for making multi-tier laminate substrates for electronic device packaging comprising the steps of: providing a first laminating layer having a trace on a first side and a second laminating layer having a trace on a first side; making an annular depression in the first side of the first laminating layer; making a first window corresponding to the annular depression in at least one layer of dielectric; laminating together the first laminating layer, the second laminating layer, and the layer of dielectric to produce a laminated substrate, wherein the layer of dielectric is located between the trace on the first side of the first laminating layer and the trace on the first side of the second laminating layer; making vias through the laminated substrate; plating the vias; producing traces on a second side of the first laminating layer and a second side of the second laminating layer; making a first opening in the first laminating layer corresponding to the annular depression; and treating exposed surfaces of the laminating layers.
Claim 3
Dependent Claim
13 words
The method of claim 1 wherein the annular depression is produced by milling.
Claim 4
Dependent Claim
37 words
The method of claim 1 wherein the first opening is produced by milling the first laminating layer over the annular depression so as to not damage the trace on the first side of the second laminating layer.
Claim 5
Dependent Claim
25 words
The method of claim 1 further comprising: making a second opening in the second laminating layer of sufficient size to locate an electronic device therein.
Claim 6
Dependent Claim
16 words
The method of claim 4 wherein the first window and second opening are produced by photoablation.
Claim 7
Dependent Claim
16 words
The method of claim 4 wherein the first window and second opening are produced by routing.
Claim 8
Dependent Claim
37 words
The method of claim 1 wherein the first opening is produced by ablating the first laminating layer over the annular depression so as to not damage the trace on the first side of the second laminating layer.
Claim 9
Dependent Claim
38 words
The method of claim 1 wherein the treating step comprises: solder masking the desired exposed surfaces; gold plating the traces on the second side of the first laminating layer and the first side of the second laminating layer.
Claim 10
Dependent Claim
44 words
The method of claim 1 wherein the treating step comrprises: solder masking the desired exposed surfaces before making the first opening; and gold plating the traces on the second side of the first laminating layer and the first side of the second laminating layer.
Claim 11
Dependent Claim
20 words
The method of claim 1 wherein the first window and the annular depression are made before laminating the layers together.
Claim 12
Dependent Claim
13 words
The method of claim 1 wherein the treating step is performed before lamination.
Claim 13
Dependent Claim
65 words
The method of claim 1 further comprising: making a second window in a third laminating layer having traces on a first side and a second side; and wherein the third laminating layer is located between the layer of dielectric contacting the trace on the first side of the second laminating layer and a layer of dielectric contacting the first side of the first laminating layer.
Claim 14
Dependent Claim
27 words
The method of claim 12 wherein the third laminating layer, the second laminating layer and the dielectric between them are laminated together before forming the laminated substrate.
Claim 15
Dependent Claim
57 words
The method of claim 1 wherein the first opening are made after the traces on the second side of the first laminating layer and the second side of the second laminating layer so that the traces on the first side of the first laminating layer and the first side of the second laminating layer will be protected.
Claim 16
Dependent Claim
18 words
The method of claim 1 wherein the dielectric is unsupported B-staged film or prepreg film-coated with B-staged adhesive.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-24 | 2002-02-23 | 2002-08-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-24 | 2006-02-23 | 2006-08-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-24 | 2010-02-23 | 2010-08-25 | $7700.00 | Window Closed / Lapsed |