Optical module having a vertical-cavity surface-emitting laser

Claim 2

An optical module comprising: a first substrate; a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate; an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate; and a second substrate comprising a first bump and a second bump, wherein an upper surface of the electrode structure and the upper surface of the vertical-cavity surface-emitting laser jut out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and the upper surface of the vertical-cavity surface-emitting laser, respectively, and each of the first bump and the second bump is made of a material which respectively accomplishes electrical bonding between the first bump and the electrode structure and electrical bonding between the second bump and the vertical-cavity surface-emitting laser without involving melting of the first bump and the second bump.

Claim 3

An optical module comprising: a first substrate; a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate; an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate; a first supporting structure comprising a conductive upper surface, the first supporting structure being supported on the first substrate; a first line for electrically connecting the upper surface of the vertical-cavity surface-emitting laser and the first supporting structure; and a second substrate comprising a first bump and a second bump, wherein an upper surface of the electrode structure and the upper surface of the first supporting structure jut out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and the upper surface of the first supporting structure, respectively, and wherein the vertical-cavity surface-emitting laser, the electrode structure and the first supporting structure are positioned at different positions from each other on the first substrate, respectively.

Claim 4

An optical module comprising: a first substrate; a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate; an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate; a first supporting structure comprising a conductive upper surface, the first supporting structure being supported on the first substrate; a first line for electrically connecting the upper surface of the vertical-cavity surface-emitting laser and the first supporting structure; and a second substrate comprising a first bump and a second bump, wherein an upper surface of the electrode structure and the upper surface of the first supporting structure jut out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and the upper surface of the first supporting structure, respectively, and wherein the vertical-cavity surface-emitting laser, the electrode structure and the first supporting structure are positioned at different positions from each other on the first substrate, respectively.

Claim 5

An optical module according to claim 1, further comprising a transistor supported on the first substrate and a third bump provided on the second substrate, wherein the third bump is partially in contact with the transistor.

Claim 6

An optical module according to claim 2, further comprising: a transistor supported on the first substrate; a second supporting structure comprising a conductive upper surface, the second supporting structure being formed on the first substrate; a second line for electrically connecting the transistor and the second supporting structure; and a third bump provided on the second substrate, wherein the third bump is in contact with the upper surface of the second supporting structure.

Claim 7

An optical module comprising: a first substrate; a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface which is in contact with the first substrate, and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate; a bipolar transistor formed on the upper surface of the vertical-cavity surface-emitting laser; an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate; and a second substrate comprising a first bump and a second bump, wherein an upper surface of the electrode structure juts out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and an upper surface of the bipolar transistor, respectively, and each of the first bump and the second bump is made of a material which respectively accomplishes electrical bonding between the first bump and the electrode structure and electrical bonding between the second bump and the vertical-cavity surface-emitting laser without involving melting of the first bump and the second bump.

Claim 8

An optical module comprising: a first substrate; a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface which is in contact with the first substrate, and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate; a bipolar transistor formed on the upper surface of the vertical-cavity surface-emitting laser; an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate; and a second substrate comprising a first bump and a second bump, wherein an upper surface of the electrode structure juts out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and an upper surface of the bipolar transistor, respectively, and each of the first bump and the second bump is made of a material which respectively accomplishes electrical bonding between the first bump and the electrode structure and electrical bonding between the second bump and the vertical-cavity surface-emitting laser without involving melting of the first bump and the second bump.

Claim 9

An optical module comprising: a first substrate; a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate; a bipolar transistor formed on the upper surface of the vertical-cavity surface-emitting laser; an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate; and a first supporting structure comprising a conductive upper surface, the first supporting structure being supported on the first substrate; a first line for electrically connecting the bipolar transistor and the upper surface of the first supporting structure; and a second substrate comprising a first bump and a second bump, wherein an upper surface of the electrode structure and the upper surface of the first supporting structure jut out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and the upper surface of the first supporting structure, respectively, and wherein the vertical-cavity surface-emitting laser, the electrode structure and the first supporting structure are positioned at different positions from each other on the first substrate, respectively.

Claim 10

An optical module comprising: a first substrate; a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate; a bipolar transistor formed on the upper surface of the vertical-cavity surface-emitting laser; an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate; and a first supporting structure comprising a conductive upper surface, the first supporting structure being supported on the first substrate; a first line for electrically connecting the bipolar transistor and the upper surface of the first supporting structure; and a second substrate comprising a first bump and a second bump, wherein an upper surface of the electrode structure and the upper surface of the first supporting structure jut out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and the upper surface of the first supporting structure, respectively, and wherein the vertical-cavity surface-emitting laser, the electrode structure and the first supporting structure are positioned at different positions from each other on the first substrate, respectively.

Claim 11

An optical module according to claim 2, wherein the first supporting structure is formed close to the vertical-cavity surface-emitting laser.

Claim 12

An optical module according to claim 2, wherein the first supporting structure comprises: the same semiconductor layers as the semiconductor layers of the semiconductor multi-layered structure; an insulating layer provided on the semiconductor layers; and an electrode structure provided on the insulating layer.

Claim 13

An optical module according to claim 2, wherein the first supporting structure at least comprises: the same semiconductor layers as the semiconductor layers of the semiconductor multi-layered structure; and a metallic film provided on the semiconductor layers.

Claim 14

An optical module according to claim 2, wherein a distance between the first substrate and the upper surface of the first supporting structure is longer than a distance between the first substrate and the upper surface of the vertical-cavity surface-emitting laser.

Claim 15

An optical module according to claim 3, wherein the bipolar transistor is a field-effect transistor.

Claim 16

An optical module according to claim 3, wherein the bipolar transistor is a heterojunction bipolar transistor.

Claim 17

An optical module according to claim 1, wherein a gap between the first substrate and the second substrate is filled with an adhesive.

Claim 18

An optical module according to claim 13, wherein the adhesive is made of a thermosetting resin.

Claim 19

An optical module according to claim 13, wherein the adhesive is made of an ultraviolet curable resin.

Claim 20

An optical module according to claim 2, wherein a gap between the first substrate and the second substrate is filled with an adhesive.

Claim 21

An optical module according to claim 16, wherein the adhesive is made of a thermosetting resin.

Claim 22

An optical module according to claim 16, wherein the adhesive is made of an ultraviolet curable resin.

Claim 23

An optical module according to claim 1, comprising a plurality of electrode structures and a plurality of vertical-cavity surface-emitting lasers, wherein the plurality of electrode structures are disposed at respective vertexes of a polygon and the plurality of vertical-cavity surface-emitting lasers are disposed inside the polygon on the first substrate.

Claim 24

An optical module according to claim 2, comprising a plurality of electrode structures and a plurality of vertical-cavity surface-emitting lasers, wherein the plurality of electrode structures are disposed at respective vertexes of a polygon and the plurality of vertical-cavity surface-emitting lasers are disposed inside the polygon on the first substrate.

Claim 25

An optical module according to claim 2, wherein the first bump and the second bump are made of a metal having a melting point of 350° C. or lower.

Claim 26

An optical module according to claim 21, wherein the first bump and the second bump are made of bismuth.

Claim 27

An optical module according to claim 2, wherein the upper surface of the vertical-cavity surface-emitting laser and the upper surface of the electrode structure are made of a metal having a melting point of 350° C. or lower.

Claim 28

An optical module according to claim 23, wherein the upper surface of the vertical-cavity surface-emitting laser and the upper surface of the electrode structure are made of bismuth.

Claim 29

An optical module according to claim 2, wherein the vertical-cavity surface-emitting laser further comprises a first distributed Bragg reflector and a second distributed Bragg reflector which are formed by a semiconductor multi-layered structure and disposed so as to interpose the light-emitting layer.

Claim 30

An optical module according to claim 2, wherein a guiding groove to receive an optical fiber is provided in a reverse side of the first substrate in a portion corresponding to the position at which the vertical-cavity surface emitting laser is provided.

Claim 31

An optical module according to claim 2, wherein each of the first bump and the second bump is made of a material which respectively accomplishes electrical bonding between the first bump and the electrode structure and electrical bonding between the second bump and the vertical-cavity surface-emitting laser without involving melting of the first bump and the second bump.

Claim 32

An optical module according to claim 6, wherein each of the first bump and the second bump is made of a material which respectively accomplishes electrical bonding between the first bump and the electrode structure and electrical bonding between the second bump and the vertical-cavity surface-emitting laser without involving melting of the first bump and the second bump.

Claim 33

An optical module according to claim 1, wherein the electrode structure has a broken p-n junction therein so as to have a low resistance between the upper surface and a bottom surface thereof.

Claim 34

An optical module according to claim 2, wherein the electrode structure has a broken p-n junction therein so as to have a low resistance between the upper surface and a bottom surface thereof.

Claim 35

An optical module according to claim 5, wherein the electrode structure has a broken p-n junction therein so as to have a low resistance between the upper surface and a bottom surface thereof.

Claim 36

An optical module according to claim 6, wherein the electrode structure has a broken p-n junction therein so as to have a low resistance between the upper surface and a bottom surface thereof.

Claim 37

An optical module comprising: a first substrate; a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate; an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate; and a second substrate comprising a first bump and a second bump, wherein an upper surface of the electrode structure and the upper surface of the vertical-cavity surface-emitting laser jut out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and the upper surface of the vertical-cavity surface-emitting laser, respectively, and wherein each of the first bump and the second bump is made of a constituent material which accomplishes bonding of the first substrate with the second substrate through formation of an alloy of the constituent material.

Claim 38

An optical module comprising: a first substrate; a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate; an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate; and a second substrate comprising a first bump and a second bump, wherein an upper surface of the electrode structure and the upper surface of the vertical-cavity surface-emitting laser jut out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and the upper surface of the vertical-cavity surface-emitting laser, respectively, and wherein each of the first bump and the second bump is made of a constituent material which accomplishes bonding of the first substrate with the second substrate through formation of an alloy of the constituent material.

Claim 39

An optical module according to claim 33, further comprising a transistor supported on the first substrate and a third bump provided on the second substrate, wherein the third bump is partially in contact with the transistor.

Claim 40

An optical module according to claim 34, wherein the bipolar transistor is a field-effect transistor.

Claim 41

An optical module according to claim 34, wherein the bipolar transistor is a heterojunction bipolar transistor.

Claim 42

An optical module according claim 33, wherein a gap between the first substrate and the second substrate is filled with an adhesive.

Claim 43

An optical module according to claim 37, wherein the adhesive is made of a thermosetting resin.

Claim 44

An optical module according to claim 37, wherein the adhesive is made of an ultraviolet curable resin.

Claim 45

An optical module according to claim 33, comprising a plurality of electrode structures and a plurality of vertical-cavity surface-emitting lasers, wherein the plurality of electrode structures are disposed at respective vertexes of a polygon and the plurality of vertical-cavity surface-emitting lasers are disposed inside the polygon on the first substrate.

Claim 46

An optical module according to claim 33, wherein the first bump and the second bump are made of a metal having a melting point of 350° C. or lower.

Claim 47

An optical module according to claim 41, wherein the first bump and the second bump are made of bismuth.

Claim 48

An optical module according to claim 33, wherein the upper surface of the vertical-cavity surface-emitting laser and the upper surface of the electrode structure are made of a metal having a melting point of 350° C. or lower.

Claim 49

An optical module according to claim 43, wherein the upper surface of the vertical-cavity surface-emitting laser and the upper surface of the electrode structure are made of bismuth.

Claim 50

An optical module according to claim 33, wherein the vertical-cavity surface-emitting laser further comprises a first distributed Bragg reflector and a second distributed Bragg reflector which are formed by a semiconductor multi-layered structure and disposed so as to interpose the light-emitting layer.

Claim 51

An optical module according to claim 33, wherein a guiding groove to receive an optical fiber is provided in a reverse side of the first substrate in a portion corresponding to the position at which the vertical-cavity surface emitting laser is provided.

Claim 52

An optical module according to claim 1, wherein a voltage is applied across the vertical-cavity surface-emitting laser and the electrode structure adjacent thereto for driving the vertical-cavity surface-emitting laser.

Claim 53

An optical module according to claim 2, wherein a voltage is applied across the vertical-cavity surface-emitting laser and the electrode structure adjacent thereto for driving the vertical-cavity surface-emitting laser.

Claim 54

An optical module according to claim 5, wherein a voltage is applied across the vertical-cavity surface-emitting laser and the electrode structure adjacent thereto for driving the vertical-cavity surface-emitting laser.

Claim 55

An optical module according to claim 6, wherein a voltage is applied across the vertical-cavity surface-emitting laser and the electrode structure adjacent thereto for driving the vertical-cavity surface-emitting laser.

Claim 56

An optical module according to claim 33, wherein a voltage is applied across the vertical-cavity surface-emitting laser and the electrode structure adjacent thereto for driving the vertical-cavity surface-emitting laser.