US5796158A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frame coining for semiconductor devices
Assignee: Micron Technology Inc
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Filing: 1995-07-31
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Granted: 1998-08-18
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Expires: 2015-07-31
Abstract
Abstract A semiconductor device comprises a semiconductor die having a circuit side and a lead frame having a plurality of lead fingers. Each of the lead fingers comprises a first side having a generally planar first portion which overlies the die and a second side having a first surface and a second surface discontinuous or noncoplanar with the first surface. The circuit side of the die is attached to the second surface. The first side, the first surface and the second surface have generally parallel planes. A distance through each finger from the first side to the first surface is greater than a second distance through the finger from the first side to the second surface.
Inventors
- 👤 Jerrold L. King
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 16:18
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/075; H10W72/30; H10W72/321; H10W72/851; H10W72/853; H10W72/865; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
92 words
A semiconductor device comprising: a wafer section; and a wafer section support having at least one lead finger, said lead finger comprising a generally planar first side and a second side having a first surface and a second surface noncoplanar with said first surface, said wafer section being attached to said second surface, wherein a first distance through said finger from said first side to said first surface is greater than a second distance through said finger from said first side to said second surface and said second surface overlies said die.
Claim 2
Dependent Claim
92 words
A semiconductor device comprising: a wafer section; and a wafer section support having at least one lead finger, said lead finger comprising a generally planar first side and a second side having a first surface and a second surface noncoplanar with said first surface, said wafer section being attached to said second surface, wherein a first distance through said finger from said first side to said first surface is greater than a second distance through said finger from said first side to said second surface and said second surface overlies said die.
Claim 3
Dependent Claim
20 words
The semiconductor device of claim 1 further comprising a bond wire attached to said first side and said wafer section.
Claim 4
Dependent Claim
14 words
The semiconductor device of claim 1 wherein said first surface overlies said wafer section.
Claim 5
Dependent Claim
18 words
The semiconductor device of claim 1 wherein said first surface and said second surface have generally parallel planes.
Claim 6
Dependent Claim
21 words
The semiconductor device of claim 1 wherein said first surface, said second surface, and said first side have generally parallel planes.
Claim 7
Dependent Claim
23 words
The semiconductor device of claim 1 wherein said wafer section is a semiconductor die and said wafer section support is a lead frame.
Claim 8
Dependent Claim
19 words
The semiconductor device of claim 1 further comprising an adhesive which attaches said wafer section to said second surface.
Claim 9
Dependent Claim
37 words
The semiconductor device of claim 1 wherein said wafer section comprises a plurality of bond pads and said wafer section support comprises a plurality of fingers wherein none of said fingers overlie any of said bond pads.
Claim 10
Dependent Claim
14 words
The device of claim 1 wherein said first surface is at least partially encapsulated.
Claim 11
Dependent Claim
102 words
A leads-over-chip semiconductor device assembly comprising: a wafer section having a side with circuitry thereon; a wafer section support having a plurality of lead fingers, each said lead finger comprising a first side having a generally planar first portion which overlies said wafer section and a second side having a first surface and a second surface noncoplanar with said first surface, said wafer section being attached to said second surface, wherein a first distance through said finger from said first side to said first surface is greater than a second distance through said finger from said first side to said second surface.
Claim 12
Dependent Claim
102 words
A leads-over-chip semiconductor device assembly comprising: a wafer section having a side with circuitry thereon; a wafer section support having a plurality of lead fingers, each said lead finger comprising a first side having a generally planar first portion which overlies said wafer section and a second side having a first surface and a second surface noncoplanar with said first surface, said wafer section being attached to said second surface, wherein a first distance through said finger from said first side to said first surface is greater than a second distance through said finger from said first side to said second surface.
Claim 13
Dependent Claim
20 words
The semiconductor device of claim 10 wherein said circuit side of said wafer section is attached to said second surface.
Claim 14
Dependent Claim
20 words
The semiconductor device of claim 10 further comprising a bond wire attached to said first side and said wafer section.
Claim 15
Dependent Claim
18 words
The semiconductor device of claim 8 wherein said first surface and said second surface have generally parallel planes.
Claim 16
Dependent Claim
21 words
The semiconductor device of claim 10 wherein said first surface, said second surface, and said first side have generally parallel planes.
Claim 17
Dependent Claim
23 words
The semiconductor device of claim 10 wherein said wafer section is a semiconductor die and said wafer section support is a lead frame.
Claim 18
Dependent Claim
19 words
The semiconductor device of claim 10 further comprising an adhesive which attaches said wafer section to said second surface.
Claim 19
Dependent Claim
18 words
The semiconductor device of claim 10 wherein said first surface and said second surface overlie said wafer section.
Claim 20
Dependent Claim
14 words
The device of claim 10 wherein said first surface is at least partially encapsulated.
Claim 21
Dependent Claim
125 words
A semiconductor device comprising: a semiconductor die having a circuit side; a lead frame having a plurality of lead fingers, each said lead finger comprising a first side having a generally planar first portion which overlies said die and a second side having a first surface and a second surface noncoplanar with said first surface, said circuit side of said die being attached to said second surface, said first side, said first surface, and said second surface having generally parallel planes, wherein a first distance through said finger from said first side to said first surface is greater than a second distance through said finger from said first side to said second surface; and a bond wire attached to said first side and said die.
Claim 22
Dependent Claim
125 words
A semiconductor device comprising: a semiconductor die having a circuit side; a lead frame having a plurality of lead fingers, each said lead finger comprising a first side having a generally planar first portion which overlies said die and a second side having a first surface and a second surface noncoplanar with said first surface, said circuit side of said die being attached to said second surface, said first side, said first surface, and said second surface having generally parallel planes, wherein a first distance through said finger from said first side to said first surface is greater than a second distance through said finger from said first side to said second surface; and a bond wire attached to said first side and said die.
Claim 23
Dependent Claim
18 words
The semiconductor device of claim 19 further comprising an adhesive which attaches said die to said second surface.
Claim 24
Dependent Claim
17 words
The semiconductor device of claim 19 wherein said first surface and said second surface overlie said die.
Claim 25
Dependent Claim
14 words
The device of claim 19 wherein said first surface is at least partially encapsulated.
Claim 26
Dependent Claim
72 words
A semiconductor device comprising: a wafer section; a wafer section support having a plurality of lead fingers each comprising a first portion and a second portion each having a thickness wherein said thickness of said first portion is greater than said thickness of said second portion, wherein said second portions are cooperatively formed to define a recess to receive an adhesive which connects said wafer section with said plurality of lead fingers.
Claim 27
Dependent Claim
72 words
A semiconductor device comprising: a wafer section; a wafer section support having a plurality of lead fingers each comprising a first portion and a second portion each having a thickness wherein said thickness of said first portion is greater than said thickness of said second portion, wherein said second portions are cooperatively formed to define a recess to receive an adhesive which connects said wafer section with said plurality of lead fingers.
Claim 28
Dependent Claim
19 words
The semiconductor device of claim 23 wherein said second portion of each said lead finger overlies said wafer section.
Claim 29
Dependent Claim
13 words
The semiconductor device of claim 23 wherein said recess receives said wafer section.
Claim 30
Dependent Claim
20 words
The device of claim 23 wherein said first and second portions of each said lead finger overlie said wafer section.
Claim 31
Dependent Claim
14 words
The device of claim 23 wherein said first portion is at least partially encapsulated.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-17 | 2002-02-16 | 2002-08-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-17 | 2006-02-16 | 2006-08-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-17 | 2010-02-16 | 2010-08-18 | $7700.00 | Window Closed / Lapsed |