Patent US5789280A successfully refreshed from Google Patents.
US5789280A
Expired / Lapsed
US
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Leadframe having secured outer leads, semiconductor device using the leadframe and method of making them
Assignee: Motorola Solutions Inc
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Filing: 1996-07-29
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Granted: 1998-08-04
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Expires: 2016-07-29
Abstract
Abstract A method of making a leadframe and a semiconductor device using the leadframe. The leadframe has a plurality of outer leads. Linking isolation members are located in the direction crossing to the extension direction of the outer leads so as to connect the neighboring outer leads with each other.
Inventors
- 👤 Eiji Yokota
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 07:40
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/435; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
55 words
A method of making a leadframe, said leadframe having outer leads, characterized by: in an etching step for forming said outer leads on a leadframe substrate, forming two patterns which connects each of said outer leads in a direction crossing to the extension direction of said outer leads; and coating resin between the two patterns.
Claim 2
Independent Claim
55 words
A method of making a leadframe, said leadframe having outer leads, characterized by: in an etching step for forming said outer leads on a leadframe substrate, forming two patterns which connects each of said outer leads in a direction crossing to the extension direction of said outer leads; and coating resin between the two patterns.
Claim 3
Independent Claim
92 words
A method of making a semiconductor device utilizing a leadframe, the leadframe characterized by two patterns for connecting each of said outer leads in a direction crossing to the extension direction of said outer leads, said method comprising the steps of: disposing a semiconductor element on said leadframe; encapsulating the leadframe having said semiconductor element disposed thereon; after the step of encapsulating, shaping each of said outer leads by cutting two patterns, said patterns connecting each of said outer leads in a direction crossing to the extension direction of said outer leads.
Claim 4
Independent Claim
92 words
A method of making a semiconductor device utilizing a leadframe, the leadframe characterized by two patterns for connecting each of said outer leads in a direction crossing to the extension direction of said outer leads, said method comprising the steps of: disposing a semiconductor element on said leadframe; encapsulating the leadframe having said semiconductor element disposed thereon; after the step of encapsulating, shaping each of said outer leads by cutting two patterns, said patterns connecting each of said outer leads in a direction crossing to the extension direction of said outer leads.
Claim 5
Dependent Claim
145 words
A method according to claim 2, wherein said step of encapsulating comprises the step of: placing at least an island portion of said leadframe and said semiconductor element between a pair of molding halves and surrounding said island portion and said semiconductor element to form a mold cavity; and injecting a molten plastic material into said cavity, wherein each of said molding halves has a main cavity-forming dent in its center, said main cavity forming dent surrounding said island and said semiconductor element, and at least one of said molding halves has a sub-cavity forming dent for forming a linking member, said sub-cavity forming dent being linked to a portion of said main cavity forming dent, separated from a periphery of said main cavity forming dent and extending therealong, and wherein said sub-cavity forming dent is located between said two patterns formed on said leadframe.
Claim 6
Dependent Claim
18 words
A method according to claim 2, including the step of shaping said outer leads into a gull-wing configuration.
Claim 7
Independent Claim
102 words
A method of making a leadframe having outer leads, said method comprising the steps of: etching to form said outer leads on a leadframe substrate; after said step of etching, forming a linking isolation member, said linking isolation member located in a direction crossing to the extension direction of said outer leads and connecting adjacent ones of said outer leads with each other, wherein in said step of forming a linking isolation member, said linking isolation member is formed by coating liquid resin in the middle of said outer leads in a direction crossing to the extension direction of said outer leads.
Claim 8
Independent Claim
102 words
A method of making a leadframe having outer leads, said method comprising the steps of: etching to form said outer leads on a leadframe substrate; after said step of etching, forming a linking isolation member, said linking isolation member located in a direction crossing to the extension direction of said outer leads and connecting adjacent ones of said outer leads with each other, wherein in said step of forming a linking isolation member, said linking isolation member is formed by coating liquid resin in the middle of said outer leads in a direction crossing to the extension direction of said outer leads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-03 | 2002-02-02 | 2002-08-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-03 | 2006-02-02 | 2006-08-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-03 | 2010-02-02 | 2010-08-04 | $7700.00 | Window Closed / Lapsed |