Abstract A cooling device for an electronic component, such as a computer processor, generally comprises a heat sink and a plurality of fans. The fans are redundant in that sufficient cooling is supplied should one fan fail. The fans are independently powered and are inspectable and independently replaceable in situ without un-powering the other fan or the processor. The heat sink includes a base plate having a bottom for surface contact with the processor, a front row of fins projecting upward from the front of the base plate and a rear row of fins projecting upward from the rear of the base plate. A plurality of fans are mounted substantially within a cavity between fan rows. Each fan blows a flow of air such that the flow impinges on the base plate. A central channel between the front and rear fin rows provides a path for air such that should one fan fail, the other fans still being operable for generating a flow of air that impinges on the top surface beneath the failed fan for cooling the top surface beneath the failed fan.
Inventors
👤 Douglas A. Dodson
Bibliographic Details
Application Number—
JurisdictionUS
Data Sourcegoogle_patents
Last Synchronized2026-11-09 14:22
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/43
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
101 words
A cooling device for an electronic component having a heat-emitting surface; said cooling device comprising: a heat sink including: a base plate including: a bottom including: a surface adapted for substantial surface contact with the heat-emitting surface the electronic component; a top including: a surface; and at least three fans mounted to said heat sink above said surface of said top; each fan being operable for generating a flow of air such that the flow impinges on said surface of said top beneath said fan for cooling said surface; should a said fan fail, the other said fans still being operable.
Claim 2
Dependent Claim
101 words
A cooling device for an electronic component having a heat-emitting surface; said cooling device comprising: a heat sink including: a base plate including: a bottom including: a surface adapted for substantial surface contact with the heat-emitting surface the electronic component; a top including: a surface; and at least three fans mounted to said heat sink above said surface of said top; each fan being operable for generating a flow of air such that the flow impinges on said surface of said top beneath said fan for cooling said surface; should a said fan fail, the other said fans still being operable.
Claim 3
Dependent Claim
47 words
The cooling device of claim 1, wherein should one fan fail, the other said fans still being operable for generating a flow of air that impinges on said surface of said top beneath said failed fan for cooling said surface of said top beneath said failed fan.
Claim 4
Dependent Claim
76 words
The cooling device of claim 2, wherein: said heat sink includes: a left end; and a right end; and said heat sink top includes: fins projecting upward from said top surface defining a central channel means between said left end and said right end of said top for providing a path for air impinging on said top surface in said central channel from an operating fan to impinge on said top surface under an inoperative fan.