Abstract A method for making a RF module by a ball grid array package includes: perforating a feed-through hole which penetrates top and bottom surfaces of a terminal position of a chip populated on a substrate; forming a conductive line connecting top and bottom surfaces of said substrate into said feed-through hole; coating a part excepting a ball grid array pad on said conductive line with an insulator, by using emulsion mesh on said top surface of said substrate; making a stencil mask which provides a predetermined-sized aperture on a top surface of said ball grid array pad by using a metal mesh, and printing a solder paste on said ball grid array pad by using said stencil mask; and forming a ball grid array package solder ball through a reflow soldering of the solder paste in a nitrogen atmosphere. This method accuratly and easily forms a desired RF module without a solder printing process about a minute terminal pattern, thereby reducing a cost of production and preventing a poor product.
A method for making a RF module by a ball grid array package, comprising: a step of forming a feed-through hole which penetrates top and bottom surfaces of a terminal position of a chip populated on a substrate; a step of forming a conductive line connecting top and bottom surfaces of said substrate into said feed-through hole; a step of coating a part excepting a ball grid array pad on said conductive line with an insulator, by using emulsion mesh on said top surface of said substrate; a step of making a stencil mask which provides a predetermined-sized aperture on a top surface of said ball grid array pad by using a metal mesh, and printing a solder paste on said ball grid array pad by using said stencil mask; and a step of forming a ball grid array package solder ball through a reflow soldering of the solder paste in a nitrogen atmosphere.
Claim 2
Independent Claim
154 words
A method for making a RF module by a ball grid array package, comprising: a step of forming a feed-through hole which penetrates top and bottom surfaces of a terminal position of a chip populated on a substrate; a step of forming a conductive line connecting top and bottom surfaces of said substrate into said feed-through hole; a step of coating a part excepting a ball grid array pad on said conductive line with an insulator, by using emulsion mesh on said top surface of said substrate; a step of making a stencil mask which provides a predetermined-sized aperture on a top surface of said ball grid array pad by using a metal mesh, and printing a solder paste on said ball grid array pad by using said stencil mask; and a step of forming a ball grid array package solder ball through a reflow soldering of the solder paste in a nitrogen atmosphere.
Claim 3
Dependent Claim
15 words
The method according to claim 1, wherein said substrate is made of an alumina ceramic.
Claim 4
Dependent Claim
21 words
The method according to claim 1, wherein said conductive line is formed by a thin film pattern generation through an electroplating.
Claim 5
Dependent Claim
22 words
The method according to claim 1, wherein said conductive line is formed by a thick film pattern generation using a conductive paste.