Patent US5786986A successfully refreshed from Google Patents.
US5786986A
Expired / Lapsed
US
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Multi-level circuit card structure
Assignee: International Business Machines Corp
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Filing: 1994-08-01
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Granted: 1998-07-28
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Expires: 2014-08-01
Abstract
Abstract Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates each having a thermally and/or electrically conductive core surrounded by a dielectric material. The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.
Inventors
- 👤 Mark Fielding Bregman
- 👤 Stephen Leslie Buchwalter
- 👤 Karl Hermann
- 👤 Caroline Ann Kovac
- 👤 Paige Adams Poore
- 👤 Alfred Viehbeck
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:42
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H05K1/00; H05K1/02; H05K1/14; H05K1/144; H05K3/44; H05K3/445; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W72/00; H10W90/00; H10W90/401; H05K1/0272; H05K1/03; H05K1/05; H05K1/056; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/03; H05K2201/0302; H05K2201/0314; H05K2201/06; H05K2201/068; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/09554; H05K2201/09581; H05K2201/096; H05K2203/00; H05K2203/03; H05K2203/0323; H05K2203/04; H05K2203/041; H05K2203/11; H05K2203/1184; H05K2203/14; H05K2203/1438; H05K3/30; H05K3/32; H05K3/321; H05K3/325; H05K3/40; H05K3/42; H05K3/429
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
142 words
An electronic device mounting structure comprising: a plurality of substrates, each having a major surface, each of said substrates having a thermally conductive core; a dielectric material on a major surface of said conductive core; a major surface of one of said plurality of substrates facing a major surface of another of said plurality of substrates so that there are adjacent major surfaces each having said dielectric material; an electrical conductor pattern on each of said dielectric-coated adjacent major surfaces, at least one of said electrical conductor patterns being electrically connected to at least one of said conductive cores; a plurality of malleable connectors disposed between and spacing apart said adjacent major surfaces to form a thermal conduction path therebetween; and a part of said plurality of malleable connectors electrically connecting a part of said conductor patterns on said adjacent major surfaces.
Claim 2
Dependent Claim
142 words
An electronic device mounting structure comprising: a plurality of substrates, each having a major surface, each of said substrates having a thermally conductive core; a dielectric material on a major surface of said conductive core; a major surface of one of said plurality of substrates facing a major surface of another of said plurality of substrates so that there are adjacent major surfaces each having said dielectric material; an electrical conductor pattern on each of said dielectric-coated adjacent major surfaces, at least one of said electrical conductor patterns being electrically connected to at least one of said conductive cores; a plurality of malleable connectors disposed between and spacing apart said adjacent major surfaces to form a thermal conduction path therebetween; and a part of said plurality of malleable connectors electrically connecting a part of said conductor patterns on said adjacent major surfaces.
Claim 3
Dependent Claim
14 words
The structure of claim 1, wherein said at least one core is electrically conductive.
Claim 4
Dependent Claim
24 words
The structure of claim 1, wherein said core is a material selected from one or more of Cu, Al, Cu-Invar-Cu, Mo and alloys thereof.
Claim 5
Dependent Claim
19 words
The structure of claim 1, wherein said conductive core has a thickness from about 0.1 to about 40 mils.
Claim 6
Dependent Claim
20 words
The structure of claim 1, further including an electronic device electrically mounted onto one of said plurality of said substrates.
Claim 7
Dependent Claim
21 words
The structure of claim 5, wherein said device is mounted in thermal contact to one of said plurality of said substrates.
Claim 8
Dependent Claim
31 words
The structure of claim 1, wherein at least one of said substrates has at least one electrically conductive via therein to provide electrical connection between said first and second major surface.
Claim 9
Dependent Claim
13 words
The structure of claim 1, wherein said dielectric material is a polymeric material.
Claim 10
Dependent Claim
11 words
The structure of claim 6, wherein said polymeric material is filled.
Claim 11
Dependent Claim
21 words
The structure of claim 8, wherein said dielectric material has a thickness of from about 0.1 mil to about 10 mils.
Claim 12
Dependent Claim
20 words
The structure of claim 8, wherein said polymeric material is selected from the group of a polyimide and a fluoropolymer.
Claim 13
Dependent Claim
19 words
The structure of claim 7, wherein said electrically conductive via is electrically insulated from said at least one core.
Claim 14
Dependent Claim
41 words
The structure of claim 12, wherein said electrically conducting via is formed from a through-hole in at least one of said substrates having an electrically insulating material disposed about the periphery of said through-hole and an electrically conductive material disposed thereover.
Claim 15
Dependent Claim
19 words
The structure of claim 7, wherein said electrically conductive via is electrically connected to said at least one core.
Claim 16
Dependent Claim
40 words
The structure of claim 14, wherein said electrically conducting via is formed from a through hole in said at least one of said plurality of said substrate, said through hole having an electrically conductive material disposed about the periphery thereof.
Claim 17
Dependent Claim
23 words
The structure of claim 1, wherein at least one of said plurality of connectors is electrically connected to said at least one core.
Claim 18
Dependent Claim
43 words
The structure of claim 1 wherein said conductor pattern of at least one of said plurality of said substrates is electrically connected to said core of said at least one of said plurality of said substrate through an opening in said dielectric material.
Claim 19
Dependent Claim
35 words
The structure of claim 1, wherein said plurality of connectors are selected from the group consisting of a solder mound, a mound of conductive epoxy and a mound of an elastomer having metal embedded therein.
Claim 20
Dependent Claim
20 words
The structure of claim 12, wherein said solder mound has a diameter from about 2 mil to about 20 mils.
Claim 21
Dependent Claim
17 words
The structure of claim 14 wherein said electrically insulating material about said through-hole is a polymeric material.
Claim 22
Dependent Claim
92 words
The structure of claim 1, wherein at least one of said substrates comprises: plurality of substrates, each having a major surface; each of said substrates having a conductive core, there being a dielectric material on a surface of said conductive core; a major surface of one of said plurality of substrates facing and adhering to a major surface of another of said plurality of substrates with a dielectric material therebetween; an electrical conductor pattern on at least one of said major surfaces electrically connected to at least one of said conductive cores.
Claim 23
Dependent Claim
37 words
The structure of claim 1, wherein said at least one conductor pattern is connected to said at least one core through an opening in said dielectric material around the periphery of a through-hole extending into said core.
Claim 24
Dependent Claim
31 words
The structure of claim 1, wherein said at least one conductor pattern is connected to said at least one core through an opening in said dielectric material on said major surface.
Claim 25
Dependent Claim
221 words
An electronic device mounting structure comprising: a plurality of substrates, each having a major surface, each of said substrates having an electrically and thermally conductive core; a dielectric material on a major surface of said conductive core; a major surface of one of said plurality of substrates facing a major surface of another of said plurality of substrates so that there are adjacent major surfaces forming a stack of substrates, said stack having two end major surfaces; an electrical conductor pattern on each of said adjacent major surfaces, at least one of said electrical conductor patterns being electrically connected to at least one of said conductive cores; a plurality of malleable solder mounds disposed between and spacing apart said adjacent surfaces and forming a thermal conduction path therebetween; a part of said plurality of malleable solder mounds electrically connecting a part of said conductor patterns on said adjacent major surfaces; an electronic device having a back face and an active face mounted on one of said major surfaces, said active face having contact locations thereon, said back face mounted in thermal contact to one of said end major surfaces of said structure; and conducting leads electrically connecting said contact locations of said active face of said electronic device to said conductor pattern on at least one of said end major surfaces.
Claim 26
Dependent Claim
221 words
An electronic device mounting structure comprising: a plurality of substrates, each having a major surface, each of said substrates having an electrically and thermally conductive core; a dielectric material on a major surface of said conductive core; a major surface of one of said plurality of substrates facing a major surface of another of said plurality of substrates so that there are adjacent major surfaces forming a stack of substrates, said stack having two end major surfaces; an electrical conductor pattern on each of said adjacent major surfaces, at least one of said electrical conductor patterns being electrically connected to at least one of said conductive cores; a plurality of malleable solder mounds disposed between and spacing apart said adjacent surfaces and forming a thermal conduction path therebetween; a part of said plurality of malleable solder mounds electrically connecting a part of said conductor patterns on said adjacent major surfaces; an electronic device having a back face and an active face mounted on one of said major surfaces, said active face having contact locations thereon, said back face mounted in thermal contact to one of said end major surfaces of said structure; and conducting leads electrically connecting said contact locations of said active face of said electronic device to said conductor pattern on at least one of said end major surfaces.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-07-27 | 2002-01-26 | 2002-07-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-07-27 | 2006-01-26 | 2006-07-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-07-27 | 2010-01-26 | 2010-07-28 | $7700.00 | Window Closed / Lapsed |