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US5786304A
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Joining product of oxide superconducting material and process for producing the same
Assignee: Nippon Steel Corp
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Filing: 1993-04-02
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Granted: 1998-07-28
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Expires: 2013-04-02
Abstract
Abstract PCT No. PCT/JP93/00432 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Apr. 2, 1993 PCT Pub. No. WO93/20025 PCT Pub. Date Oct. 14, 1993A joining product of oxide superconducting materials having a high current density and process for producing the same. A joining product comprising a plurality of oxide superconducting materials having an identical crystal orientation joined with each other through a superconducting phase of the same type as described above which has the same crystal orientation as the oxide superconducting materials and a lower peritectic temperature than the oxide superconducting materials. A joining method comprising the steps of: regulating oxide superconducting materials to be joined so that they have an identical crystal orientation; either inserting as a solder a material comprising elements constituting an oxide superconductor having a lower peritectic temperature than the oxide superconducting materials or bringing the material comprising elements constituting an oxide superconductor having a lower peritectic temperature than the oxide superconducting materials into contact with the oxide superconducting materials to be joined; heating the assembly to a temperature below the peritectic temperature of the superconducting materials to be joined and above the peritectic temperature of the solder; and gradually cooling the heated assembly to orient and grow the same type of oxide superconductor at the joining interface. A junction product of oxide superconducting materials free from such crystal grain boundary as to inhibit the current flow and having a high critical current density can be provided and can be utilized as a magnet, a magnetic shield and a current leading material.
Inventors
- 👤 Keiichi Kimura
- 👤 Katuyoshi Miyamoto
- 👤 Misao Hashimoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 05:54
CPC Classifications
C; C04; C04B; C04B35/00; C04B35/01; C04B35/45; C04B35/4504; C04B35/4508; C04B37/00; C04B37/003; C04B37/005; H; H10; H10N; H10N60/00; H10N60/80; C04B2235/00; C04B2235/02; C04B2235/30; C04B2235/32; C04B2235/3205; C04B2235/3215; C04B2235/3224; C04B2235/3225; C04B2235/65; C04B2235/656; C04B2235/6562; C04B2235/658; C04B2235/6583; C04B2235/6585; C04B2237/00; C04B2237/02; C04B2237/04; C04B2237/06; C04B2237/30; C04B2237/32; C04B2237/34; C04B2237/50; C04B2237/68; C04B2237/70; C04B2237/708; C04B2237/78; C04B2237/82; C04B2237/86; C04B2237/88; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9265; Y10S428/93; Y10S505/00; Y10S505/70; Y10S505/701; Y10S505/704; Y10S505/825; Y10S505/917; Y10S505/927
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
182 words
A joined product comprising a plurality of RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, with each segment having a joining area and an identical crystal orientation, said segments joined with each other at said joining areas with an RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder formed by a melt process, wherein RE 1 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, RE 2 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder has a lower peritectic temperature than said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, and said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder has the same crystal orientation as said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments.
Claim 2
Dependent Claim
182 words
A joined product comprising a plurality of RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, with each segment having a joining area and an identical crystal orientation, said segments joined with each other at said joining areas with an RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder formed by a melt process, wherein RE 1 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, RE 2 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder has a lower peritectic temperature than said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, and said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder has the same crystal orientation as said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments.
Claim 3
Dependent Claim
39 words
A joined product according to claim 1 wherein said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder is sandwiched between said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments.
Claim 4
Dependent Claim
196 words
A joined product comprising a plurality of RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, with each segment having a joining area and an identical crystal orientation, said segments joined with each other at said joining areas with an RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder formed by a melt process, wherein RE 1 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, RE 2 is identical to RE 1 , said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder has added thereto at least one element selected from a group consisting of Ag and Au whereby said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder has a lower peritectic temperature than said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, and said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder has the same crystal orientation as said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments.
Claim 5
Dependent Claim
196 words
A joined product comprising a plurality of RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, with each segment having a joining area and an identical crystal orientation, said segments joined with each other at said joining areas with an RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder formed by a melt process, wherein RE 1 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, RE 2 is identical to RE 1 , said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder has added thereto at least one element selected from a group consisting of Ag and Au whereby said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder has a lower peritectic temperature than said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, and said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder has the same crystal orientation as said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments.
Claim 6
Dependent Claim
393 words
A joining method for monocrystalline superconducting material segments comprising: providing at least two RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, wherein RE 1 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, aligning at least two of said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments to be joined so that they have an identical crystal orientation, inserting a solder between faces of said oriented monocrystalline RE 1 Ba 2 Cu 3 O x -based superconducting material segments to be joined to form an assembly, wherein said solder is at least one member selected from a group consisting of an RE 2 Ba 2 Cu 3 O x -based superconducting material and a raw material for an RE 2 Ba 2 Cu 3 O x -based superconducting material, wherein RE 2 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, wherein said RE 2 Ba 2 Cu 3 O x -based superconducting material has a lower peritectic temperature than said monocrystalline RE 1 Ba 2 Cu 3 O x -based superconducting material segments to be joined, heating said assembly to a temperature above the peritectic temperature of said solder and below the peritectic temperature of said monocrystalline RE 1 Ba 2 Cu 3 O x -based superconducting material segments to be joined, said temperature of heating said assembly decomposing said member selected from a group consisting of said RE 2 Ba 2 Cu 3 O 3 -based superconducting material and said raw material for said RE 2 Ba 2 Cu 3 O x -based superconducting material into a Ba, Cu, and O liquid phase and an RE 2 2 BaCuO 5 solid phase, gradually cooling said heated assembly, said gradual cooling of said heated assembly providing an RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder joining said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, with said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder having the same crystalline orientation as said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments joined by said solder.
Claim 7
Dependent Claim
393 words
A joining method for monocrystalline superconducting material segments comprising: providing at least two RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, wherein RE 1 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, aligning at least two of said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments to be joined so that they have an identical crystal orientation, inserting a solder between faces of said oriented monocrystalline RE 1 Ba 2 Cu 3 O x -based superconducting material segments to be joined to form an assembly, wherein said solder is at least one member selected from a group consisting of an RE 2 Ba 2 Cu 3 O x -based superconducting material and a raw material for an RE 2 Ba 2 Cu 3 O x -based superconducting material, wherein RE 2 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, wherein said RE 2 Ba 2 Cu 3 O x -based superconducting material has a lower peritectic temperature than said monocrystalline RE 1 Ba 2 Cu 3 O x -based superconducting material segments to be joined, heating said assembly to a temperature above the peritectic temperature of said solder and below the peritectic temperature of said monocrystalline RE 1 Ba 2 Cu 3 O x -based superconducting material segments to be joined, said temperature of heating said assembly decomposing said member selected from a group consisting of said RE 2 Ba 2 Cu 3 O 3 -based superconducting material and said raw material for said RE 2 Ba 2 Cu 3 O x -based superconducting material into a Ba, Cu, and O liquid phase and an RE 2 2 BaCuO 5 solid phase, gradually cooling said heated assembly, said gradual cooling of said heated assembly providing an RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder joining said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, with said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder having the same crystalline orientation as said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments joined by said solder.
Claim 8
Dependent Claim
390 words
A joining method for monocrystalline superconducting material segments comprising: providing at least two RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, wherein RE 1 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, aligning at least two of said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments to be joined so that they have an identical crystal orientation, placing a solder on said monocrystalline RE 1 Ba 2 Cu 3 O x -based superconducting material segments to be joined to form an assembly, wherein said solder is at least one member selected from a group consisting of an RE 2 Ba 2 Cu 3 O x -based superconducting material and a raw material for an RE 2 Ba 2 Cu 3 O x -based superconducting material, wherein RE 2 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, wherein said RE 2 Ba 2 Cu 3 O x -based superconducting material has a lower peritectic temperature than said monocrystalline RE 1 Ba 2 Cu 3 O x -based superconducting material segments to be joined, heating said assembly to a temperature above the peritectic temperature of said solder and below the peritectic temperature of said monocrystalline RE 1 Ba 2 Cu 3 O x -based superconducting material segments to be joined, said temperature of heating said assembly decomposing said member selected from a group consisting of said RE 2 Ba 2 Cu 3 O x -based superconducting material and said raw material for said RE 2 Ba 2 Cu 3 O x -based superconducting material into a Ba, Cu, and O liquid phase and an RE 2 2 BaCuO 5 solid phase, gradually cooling said heated assembly, said gradual cooling of said heated assembly providing an RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder joining said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, with said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder having the same crystalline orientation as said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments joined by said solder.
Claim 9
Dependent Claim
390 words
A joining method for monocrystalline superconducting material segments comprising: providing at least two RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, wherein RE 1 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, aligning at least two of said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments to be joined so that they have an identical crystal orientation, placing a solder on said monocrystalline RE 1 Ba 2 Cu 3 O x -based superconducting material segments to be joined to form an assembly, wherein said solder is at least one member selected from a group consisting of an RE 2 Ba 2 Cu 3 O x -based superconducting material and a raw material for an RE 2 Ba 2 Cu 3 O x -based superconducting material, wherein RE 2 is at least one element selected from a group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, wherein said RE 2 Ba 2 Cu 3 O x -based superconducting material has a lower peritectic temperature than said monocrystalline RE 1 Ba 2 Cu 3 O x -based superconducting material segments to be joined, heating said assembly to a temperature above the peritectic temperature of said solder and below the peritectic temperature of said monocrystalline RE 1 Ba 2 Cu 3 O x -based superconducting material segments to be joined, said temperature of heating said assembly decomposing said member selected from a group consisting of said RE 2 Ba 2 Cu 3 O x -based superconducting material and said raw material for said RE 2 Ba 2 Cu 3 O x -based superconducting material into a Ba, Cu, and O liquid phase and an RE 2 2 BaCuO 5 solid phase, gradually cooling said heated assembly, said gradual cooling of said heated assembly providing an RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder joining said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments, with said RE 2 Ba 2 Cu 3 O x -based superconducting phase monocrystalline solder having the same crystalline orientation as said RE 1 Ba 2 Cu 3 O x -based monocrystalline superconducting material segments joined by said solder.
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