CPU, memory controller, bus bridge integrated circuits, layout structures, system and methods

Claim 2

A single chip integrated circuit device comprising: a substrate with bond pads, a microprocessor occupying a substantially rectangular region lying on or near a first side of said substrate; a memory controller unit occupying a first strip along one side of and substantially perpendicular to the length of said microprocessor, said first strip lying on or near a second side of said substrate; and an internal bus connecting said microprocessor and said memory controller unit; and an external bus to internal bus interface circuit, occupying a second strip substantially perpendicular to said first strip and disposed along microprocessor, said second strip lying on or near a third side of said substrate and having a length providing physical width accessibility to more than one terminals for connection to a bus.

Claim 3

The device claimed in claim 1 wherein said interface circuit comprises a Peripheral Components Interconnect (PCI) bus bridge connected between said internal bus and bond pads for connection to a PCI external bus, and a data routing and buffering unit coupled to said internal bus and to said bond pads for connection to said PCI external bus, said routing and buffering unit further coupled to bond pads for memory data communication.

Claim 4

The device claimed in claim 1 further comprising a cache memory lying on or near a fourth side of said substrate, adjacent and perpendicular to said microprocessor length, opposite and parallel to said memory controller unit length, and perpendicular to said interface circuit length.

Claim 5

The device claimed in claim 1 wherein the microprocessor comprises a microcode ROM and an execution unit, and said interface circuit is located on or near opposite side of said substrate from said microcode ROM.

Claim 6

The device claimed in claim 1 wherein said substrate has sides, said sides being approximately equal in length.

Claim 7

A personal computer comprising: an input device; a memory, a display; and an integrated circuit comprising: a substrate with bond pads, a microprocessor coupled to said input device, said memory and said display and occupying a substantially rectangular region lying on or near a first side of said substrate; a memory controller unit occupying a first strip along one side of and substantially perpendicular to the length of said microprocessor, said first strip lying on or near a second side of said substrate; an internal bus connecting said microprocessor and said memory controller unit; and an external bus to internal bus interface circuit, occupying a second step substantially perpendicular to said first strip and disposed along microprocessor, said second strip lying on or near a third side of said substrate and having a length providing physical width accessibility to more than one terminals for connection to a bus.

Claim 8

A personal computer comprising: an input device; a memory, a display; and an integrated circuit comprising: a substrate with bond pads, a microprocessor coupled to said input device, said memory and said display and occupying a substantially rectangular region lying on or near a first side of said substrate; a memory controller unit occupying a first strip along one side of and substantially perpendicular to the length of said microprocessor, said first strip lying on or near a second side of said substrate; an internal bus connecting said microprocessor and said memory controller unit; and an external bus to internal bus interface circuit, occupying a second step substantially perpendicular to said first strip and disposed along microprocessor, said second strip lying on or near a third side of said substrate and having a length providing physical width accessibility to more than one terminals for connection to a bus.

Claim 9

The personal computer claimed in claim 6 wherein said interface circuit comprises a Peripheral Components Interconnect (PCI) bus bridge connected between said internal bus and bond pads for connection to a PCI external bus, and a data routing and buffering unit coupled to said internal bus and to said bond pads for connection to said PCI external bus, said routing and buffering unit further coupled to bond pads for memory data communication.

Claim 10

The personal computer claimed in claim 6 further comprising a cache memory lying in or near a fourth side of said substrate, adjacent said microprocessor, opposite and parallel to said memory controller unit length, and perpendicular to said interface circuit length.

Claim 11

The personal computer claimed in claim 6 wherein said microprocessor comprises a microcode ROM and an execution unit, and said interface circuit is located on or near an opposite side of said substrate from said microcode ROM.

Claim 12

The personal computer claimed in claim 6 wherein said input device includes a keyboard.

Claim 13

The personal computer claimed in claim 6 wherein said display includes a CRT.

Claim 14

The personal computer claimed in claim 6 wherein the personal computer has the form of a notebook computer.

Claim 15

An electronic wiring board article of manufacture comprising: a printed wiring board having a substantially planar board element, conductors in or on said planar board element; an integrated circuit mounted on said printed wiring board said integrated circuit comprising: a substrate with bond pads; a microprocessor occupying a substantially rectangular region lying on or near a first side of said substrate; a memory controller unit occupying a first strip along one side of and substantially perpendicular to the length of said microprocessor, said first strip lying on or near a second side of said substrate; an internal bus connecting said microprocessor and said memory controller unit; and an external bus to internal bus interface circuit, occupying a second strip substantially perpendicular to said first strip and disposed along microprocessor, said second strip lying on or near a third side of said substrate and having a length providing physical width accessibility to more than one terminals for connection to a bus.

Claim 16

An electronic wiring board article of manufacture comprising: a printed wiring board having a substantially planar board element, conductors in or on said planar board element; an integrated circuit mounted on said printed wiring board said integrated circuit comprising: a substrate with bond pads; a microprocessor occupying a substantially rectangular region lying on or near a first side of said substrate; a memory controller unit occupying a first strip along one side of and substantially perpendicular to the length of said microprocessor, said first strip lying on or near a second side of said substrate; an internal bus connecting said microprocessor and said memory controller unit; and an external bus to internal bus interface circuit, occupying a second strip substantially perpendicular to said first strip and disposed along microprocessor, said second strip lying on or near a third side of said substrate and having a length providing physical width accessibility to more than one terminals for connection to a bus.

Claim 17

The electronic wiring board claimed in claim 13 wherein said interface circuit comprises a Peripheral Components Interconnect (PCI) bus bridge connected between said internal bus and bond pads for connection to a PCI external bus, and a data routing and buffering unit coupled to said internal bus and said bond pads for connection to said PCI external bus, said routing and buffering unit further coupled to bond pads for memory data communication.

Claim 18

The electronic wiring board claimed in claim 13 further comprising a cache memory lying on or near a fourth side of said substrate, adjacent to said microprocessor, opposite and parallel to said memory controller unit length, and perpendicular to said interface circuit length.

Claim 19

The electronic wiring board claimed in claim 13 wherein said microprocessor comprises a microcode ROM and an execution unit, and said interface circuit is located on or near an opposite side of said substrate from said microcode ROM.

Claim 20

The device claimed in claim 1 wherein said memory controller unit and said interface circuit are accessible via said bond pads.