Patent US5779522A successfully refreshed from Google Patents.
US5779522A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Directional spray pad scrubber
Assignee: Micron Technology Inc
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Filing: 1997-03-26
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Granted: 1998-07-14
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Expires: 2017-03-26
Abstract
Abstract The present invention is a pad scrubber that cleans the planarizing surface of a polishing pad used in CMP processing of semiconductor wafers. The pad scrubber has a fluid manifold, a first nozzle attached to one side of the manifold, and a second nozzle attached to another side of the manifold. The first nozzle directs a first fluid stream generally outwardly toward a peripheral edge of the pad, and the second nozzle directs a second fluid stream generally outwardly to the peripheral edge of the pad and also toward the first fluid stream. The first and second fluid streams converge on the planarizing surface of the pad to separate accumulated waste matter from the polishing pad and to create a contained stream of separated particles that flows across the planarizing surface to the peripheral edge of the pad.
Inventors
- 👤 Michael A. Walker
- 👤 Karl M. Robinson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:42
CPC Classifications
B; B24; B24B; B24B53/00; B24B53/017; B08; B08B; B08B3/00; B08B3/02; B08B3/022
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
131 words
A chemical-mechanical planarization apparatus, comprising: a platen; a polishing pad positioned on the platen, the polishing pad having a planarizing surface; a wafer carrier positioned over the polishing pad, wherein at least one of the wafer carrier and the platen is moveable with respect to the other to impart relative motion therebetween and planarize a wafer; and a pad scrubber located proximate to the planarizing surface of the polishing pad, the pad scrubber having a fluid manifold, a first nozzle attached to the manifold for directing a first fluid stream generally outwardly toward a peripheral edge of the polishing pad, and a second nozzle attached to the manifold and canted for directing a second fluid stream outwardly toward the peripheral edge of the polishing pad and toward the first fluid stream.
Claim 2
Dependent Claim
131 words
A chemical-mechanical planarization apparatus, comprising: a platen; a polishing pad positioned on the platen, the polishing pad having a planarizing surface; a wafer carrier positioned over the polishing pad, wherein at least one of the wafer carrier and the platen is moveable with respect to the other to impart relative motion therebetween and planarize a wafer; and a pad scrubber located proximate to the planarizing surface of the polishing pad, the pad scrubber having a fluid manifold, a first nozzle attached to the manifold for directing a first fluid stream generally outwardly toward a peripheral edge of the polishing pad, and a second nozzle attached to the manifold and canted for directing a second fluid stream outwardly toward the peripheral edge of the polishing pad and toward the first fluid stream.
Claim 3
Dependent Claim
57 words
The apparatus of claim 1 wherein a plurality of first nozzles are positioned along a leading edge of the manifold and a plurality of second nozzles are positioned along a trailing edge of the manifold, the first nozzles being positioned opposite the second nozzles to form a contained stream at the planarizing surface of the polishing pad.
Claim 4
Dependent Claim
85 words
The apparatus of claim 1 wherein a plurality of first nozzles are positioned along a leading edge of the manifold and a plurality of second nozzles are positioned along a trailing edge of the manifold, the first nozzles being positioned opposite the second nozzles to form a contained stream at the planarizing surface of the polishing pad, and the first and second nozzles being canted toward one another at an angle Θ and toward the peripheral edge of the polishing pad at an angle Φ.
Claim 5
Dependent Claim
45 words
The apparatus of claim 3 wherein the angle Θ is between 20 and 70 degrees with respect to a plane normal to the planarizing surface and the angle Φ is between 20 and 70 degrees with respect to a plane normal to the planarizing surface.
Claim 6
Dependent Claim
74 words
The apparatus of claim 1 wherein the manifold comprises a flat elongated tube having a leading edge and a trailing edge, and wherein a plurality of first nozzles are positioned along the leading edge of the manifold and a plurality of second nozzles are positioned along the trailing edge of the manifold, the first nozzles being positioned opposite the second nozzles to form a contained stream at the planarizing surface of the polishing pad.
Claim 7
Dependent Claim
23 words
The apparatus of claim 1, further comprising a brush attached to the pad scrubber for contacting the planarizing surface of the polishing pad.
Claim 8
Independent Claim
116 words
An apparatus for chemical-mechanical planarization of a wafer, comprising: a platen; a polishing pad positioned on the platen, the polishing pad having a planarizing surface; and a pad scrubber located proximate to the planarizing surface of the polishing pad, the pad scrubber having a fluid manifold, a plurality of first nozzles attached to the manifold along a leading edge, and a plurality second nozzles attached to the manifold along a trailing edge, wherein the first and second nozzles are canted toward one another at an angle Θ and toward the peripheral edge of the polishing pad at an angle Φ to direct first and second streams of fluid onto the planarizing surface of the polishing pad.
Claim 9
Independent Claim
116 words
An apparatus for chemical-mechanical planarization of a wafer, comprising: a platen; a polishing pad positioned on the platen, the polishing pad having a planarizing surface; and a pad scrubber located proximate to the planarizing surface of the polishing pad, the pad scrubber having a fluid manifold, a plurality of first nozzles attached to the manifold along a leading edge, and a plurality second nozzles attached to the manifold along a trailing edge, wherein the first and second nozzles are canted toward one another at an angle Θ and toward the peripheral edge of the polishing pad at an angle Φ to direct first and second streams of fluid onto the planarizing surface of the polishing pad.
Claim 10
Dependent Claim
37 words
The apparatus of claim 7 wherein each first nozzle is positioned opposite a second nozzle so that a first fluid stream from the first nozzle and a second fluid stream from the second nozzle intersect one another.
Claim 11
Dependent Claim
31 words
The apparatus of claim 7 wherein the angles Θ and Φ direct the first and second fluid streams toward one another to intersect at the planarizing surface of the polishing pad.
Claim 12
Dependent Claim
45 words
The apparatus of claim 9 wherein the angle Θ is between 20 and 70 degrees with respect to a plane normal to the planarizing surface and the angle Φ is between 20 and 70 degrees with respect to a plane normal to the planarizing surface.
Claim 13
Dependent Claim
36 words
The apparatus of claim 7 wherein the manifold comprises a flat elongated tube, the leading edge extending longitudinally along one side of the tube and the trailing edge extending longitudinally along another side of the tube.
Claim 14
Dependent Claim
115 words
A chemical-mechanical planarization apparatus, comprising: a moveable platen; a polishing pad positioned on the platen, the polishing pad having a planarizing surface; and a pad scrubber located proximate to the planarizing surface of the polishing pad, the pad scrubber having a fluid manifold, a brush with one end attached to the manifold and another end engaged with the planarizing surface, a first nozzle attached to the manifold for directing a first fluid stream generally outwardly toward a peripheral edge of the polishing pad, and a second nozzle attached to the manifold and canted to direct the second fluid stream generally outwardly toward the peripheral edge of the polishing pad and toward the first fluid stream.
Claim 15
Dependent Claim
115 words
A chemical-mechanical planarization apparatus, comprising: a moveable platen; a polishing pad positioned on the platen, the polishing pad having a planarizing surface; and a pad scrubber located proximate to the planarizing surface of the polishing pad, the pad scrubber having a fluid manifold, a brush with one end attached to the manifold and another end engaged with the planarizing surface, a first nozzle attached to the manifold for directing a first fluid stream generally outwardly toward a peripheral edge of the polishing pad, and a second nozzle attached to the manifold and canted to direct the second fluid stream generally outwardly toward the peripheral edge of the polishing pad and toward the first fluid stream.
Claim 16
Dependent Claim
57 words
The apparatus of claim 12 wherein a plurality of first nozzles are positioned along a leading edge of the manifold and a plurality of second nozzles are positioned along a trailing edge of the manifold, the first nozzles being positioned opposite the second nozzles to form a contained stream at the planarizing surface of the polishing pad.
Claim 17
Dependent Claim
85 words
The apparatus of claim 12 wherein a plurality of first nozzles are positioned along a leading edge of the manifold and a plurality of second nozzles are positioned along a trailing edge of the manifold, the first nozzles being positioned opposite the second nozzles to form a contained stream at the planarizing surface of the polishing pad, and the first and second nozzles being canted toward one another at an angle Θ and toward the peripheral edge of the polishing pad at an angle Φ.
Claim 18
Dependent Claim
45 words
The apparatus of claim 14 wherein the angle Θ is between 20 and 70 degrees with respect to a plane normal to the planarizing surface and the angle Φ is between 20 and 70 degrees with respect to a plane normal to the planarizing surface.
Claim 19
Dependent Claim
74 words
The apparatus of claim 12 wherein the manifold comprises a flat elongated tube having a leading edge and a trailing edge, and wherein a plurality of first nozzles are positioned along the leading edge of the manifold and a plurality of second nozzles are positioned along the trailing edge of the manifold, the first nozzles being positioned opposite the second nozzles to form a contained stream at the planarizing surface of the polishing pad.
Claim 20
Dependent Claim
93 words
A polishing pad scrubber for cleaning a planarizing surface of a polishing pad used in chemical-mechanical planarization of substrates, comprising: a fluid manifold; a plurality of first nozzles attached to the manifold along a leading edge; and a plurality second nozzles attached to the manifold along a trailing edge, wherein the first and second nozzles are canted toward one another at an angle Θ and toward the peripheral edge of the polishing pad at an angle Φ to direct first and second streams of fluid onto the planarizing surface of the polishing pad.
Claim 21
Dependent Claim
93 words
A polishing pad scrubber for cleaning a planarizing surface of a polishing pad used in chemical-mechanical planarization of substrates, comprising: a fluid manifold; a plurality of first nozzles attached to the manifold along a leading edge; and a plurality second nozzles attached to the manifold along a trailing edge, wherein the first and second nozzles are canted toward one another at an angle Θ and toward the peripheral edge of the polishing pad at an angle Φ to direct first and second streams of fluid onto the planarizing surface of the polishing pad.
Claim 22
Dependent Claim
37 words
The apparatus of claim 17 wherein each first nozzle is positioned opposite a second nozzle so that a first fluid stream from the first nozzle and a second fluid stream from the second nozzle intersect one another.
Claim 23
Dependent Claim
30 words
The apparatus of claim 17 wherein the angles Θ and Φ direct the first and second fluid streams toward one another to intersect at the planarizing surface of the polishing.
Claim 24
Dependent Claim
45 words
The apparatus of claim 19 wherein the angle Θ is between 20 and 70 degrees with respect to a plane normal to the planarizing surface and the angle Φ is between 20 and 70 degrees with respect to a plane normal to the planarizing surface.
Claim 25
Dependent Claim
38 words
The apparatus of claim 17 wherein the manifold comprises a flat elongated tube, and wherein the leading edge extends longitudinally along one side of the tube and the trailing edge extends longitudinally along another side of the tube.
Claim 26
Dependent Claim
95 words
A polishing pad scrubber for cleaning a planarizing surface of a polishing pad used in chemical-mechanical planarization of substrates, comprising: a fluid manifold; a brush with one end attached to the manifold and another end engaged with the planarizing surface; a first nozzle attached to the manifold for directing a first fluid stream generally outwardly toward a peripheral edge of the polishing pad; and a second nozzle attached to the manifold and canted to direct the second fluid stream generally outwardly toward the peripheral edge of the polishing pad and toward the first fluid stream.
Claim 27
Dependent Claim
95 words
A polishing pad scrubber for cleaning a planarizing surface of a polishing pad used in chemical-mechanical planarization of substrates, comprising: a fluid manifold; a brush with one end attached to the manifold and another end engaged with the planarizing surface; a first nozzle attached to the manifold for directing a first fluid stream generally outwardly toward a peripheral edge of the polishing pad; and a second nozzle attached to the manifold and canted to direct the second fluid stream generally outwardly toward the peripheral edge of the polishing pad and toward the first fluid stream.
Claim 28
Dependent Claim
57 words
The apparatus of claim 22 wherein a plurality of first nozzles are positioned along a leading edge of the manifold and a plurality of second nozzles are positioned along a trailing edge of the manifold, the first nozzles being positioned opposite the second nozzles to form a contained stream at the planarizing surface of the polishing pad.
Claim 29
Dependent Claim
86 words
The apparatus of claim 22 wherein a plurality of first nozzles are positioned along a leading edge of the manifold and a plurality of second nozzles are positioned along a trailing edge of the manifold, the first nozzles being positioned directly opposite the second nozzles to form a contained stream at the planarizing surface of the polishing pad, and the first and second nozzles being canted toward one another at an angle Θ and toward the peripheral edge of the polishing pad at an angle Φ.
Claim 30
Dependent Claim
45 words
The apparatus of claim 24 wherein the angle Θ is between 20 and 70 degrees with respect to a plane normal to the planarizing surface and the angle Φ is between 20 and 70 degrees with respect to a plane normal to the planarizing surface.
Claim 31
Dependent Claim
74 words
The apparatus of claim 22 wherein the manifold comprises a flat elongated tube having a leading edge and a trailing edge, and wherein a plurality of first nozzles are positioned along the leading edge of the manifold and a plurality of second nozzles are positioned along the trailing edge of the manifold, the first nozzles being positioned opposite the second nozzles to form a contained stream at the planarizing surface of the polishing pad.
Claim 32
Independent Claim
76 words
A method for cleaning a planarizing surface of a polishing pad, comprising: directing a first fluid stream onto a planarizing surface of a polishing pad toward a peripheral edge of the polishing pad; aiming a second fluid stream to impinge the planarizing surface and flow toward the peripheral edge and the first fluid stream, wherein the first and second fluid streams form a combined stream that flows outwardly toward the peripheral edge of the polishing pad.
Claim 33
Independent Claim
76 words
A method for cleaning a planarizing surface of a polishing pad, comprising: directing a first fluid stream onto a planarizing surface of a polishing pad toward a peripheral edge of the polishing pad; aiming a second fluid stream to impinge the planarizing surface and flow toward the peripheral edge and the first fluid stream, wherein the first and second fluid streams form a combined stream that flows outwardly toward the peripheral edge of the polishing pad.
Claim 34
Dependent Claim
114 words
The method of claim 27 wherein: the act of directing the first fluid stream comprises pumping fluid through a fluid manifold and a plurality of first nozzles attached to the manifold along a leading edge of the manifold; and the act of aiming the second fluid stream comprises pumping fluid through the manifold and a plurality second nozzles attached to the manifold along a trailing edge of the manifold, wherein the first and second nozzles are canted toward one another at an angle Θ and toward the peripheral edge of the polishing pad at an angle Φ to direct the first and second streams of fluid onto the planarizing surface of the polishing pad.
Claim 35
Dependent Claim
39 words
The method of claim 28, further comprising configuring each first nozzle to be positioned opposite a second nozzle so that each first fluid stream from each first nozzle intersects a corresponding second fluid stream from an opposing second nozzle.
Claim 36
Dependent Claim
39 words
The method of claim 28, further comprising configuring the first and second nozzles so that the angles Θ and Φ direct the first and second fluid streams toward one another to intersect at the planarizing surface of the polishing.
Claim 37
Dependent Claim
51 words
The method of claim 30 wherein in the act of configuring comprises making the angle Θ between 20 and 70 degrees with respect to a plane normal to the planarizing surface and making the angle Φ between 20 and 70 degrees with respect to a plane normal to the planarizing surface.
Claim 38
Independent Claim
119 words
A method of planarizing a substrate, comprising: pressing the substrate against a planarizing surface of a polishing pad; moving at least one of the substrate and the polishing pad with respect to the other to impart relative motion therebetween and remove material from the substrate; directing a first fluid stream onto a planarizing surface of a polishing pad toward a peripheral edge of the polishing pad; and aiming a second fluid stream to impinge the planarizing surface and flow toward the peripheral edge and the first fluid stream, wherein the first and second fluid streams form a combined stream that cleans the planarizing surface of the polishing pad and flows outwardly toward the peripheral edge of the polishing pad.
Claim 39
Independent Claim
119 words
A method of planarizing a substrate, comprising: pressing the substrate against a planarizing surface of a polishing pad; moving at least one of the substrate and the polishing pad with respect to the other to impart relative motion therebetween and remove material from the substrate; directing a first fluid stream onto a planarizing surface of a polishing pad toward a peripheral edge of the polishing pad; and aiming a second fluid stream to impinge the planarizing surface and flow toward the peripheral edge and the first fluid stream, wherein the first and second fluid streams form a combined stream that cleans the planarizing surface of the polishing pad and flows outwardly toward the peripheral edge of the polishing pad.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-07-13 | 2002-01-12 | 2002-07-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-07-13 | 2006-01-12 | 2006-07-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-07-13 | 2010-01-12 | 2010-07-14 | $7700.00 | Window Closed / Lapsed |