Patent US5773898A successfully refreshed from Google Patents.
US5773898A
Expired / Lapsed
US
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Hybrid integrated circuit with a spacer between the radiator plate and loading portion of the IC
Assignee: Mitsubishi Electric Corp
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Filing: 1996-11-26
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Granted: 1998-06-30
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Expires: 2016-11-26
Abstract
Abstract A hybrid integrated circuit is provided with a radiator plate having a power device fixed at the surface through a spacer. As the spacer for preventing heat transfer from the radiator plate to the substrate, the solder layer has at least one supporting element selected from the group consisting of (1) globular metal grains of 80 to l200 μm in diameter uniformly distributed therein, (2) a first solder layer of 50 to 200 μm applied on the lower surface of the radiator, and (3) a dummy layer of 80 to 150 μm high including at least one selected from the group consisting of a resistor layer, conductive layer and a glass layer on the radiator loading part.
Inventors
- 👤 Eiji Kobayashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 10:39
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H10W40/00; H10W40/10; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/09; H05K1/092; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09781; H05K2201/10; H05K2201/10613; H05K2201/10954; H05K2201/10969; H05K2201/10992; H05K2203/00; H05K2203/04; H05K2203/041; H10W72/071; H10W72/073; H10W72/07321; H10W72/07327; H10W72/07331; H10W72/07336; H10W72/075; H10W72/381; H10W72/50; H10W72/531; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W74/00; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
120 words
A hybrid integrated circuit comprising: a substrate; a loading portion affixed to an upper surface of said substrate; a radiator plate attached to said loading portion; a first solder layer positioned between said loading portion and said radiator plate; a transistor attached to an upper surface of said radiator plate; and a spacer layer for maintaining a predetermined gap between said radiator plate and said loading portion, said spacer layer including one of (1) a plurality of globular metal particles distributed within said first solder layer, (2) a high melting point solder layer positioned between said first solder layer and said radiator plate, and (3) a dummy layer formed of a plurality of stacked elements within said first solder layer.
Claim 2
Dependent Claim
120 words
A hybrid integrated circuit comprising: a substrate; a loading portion affixed to an upper surface of said substrate; a radiator plate attached to said loading portion; a first solder layer positioned between said loading portion and said radiator plate; a transistor attached to an upper surface of said radiator plate; and a spacer layer for maintaining a predetermined gap between said radiator plate and said loading portion, said spacer layer including one of (1) a plurality of globular metal particles distributed within said first solder layer, (2) a high melting point solder layer positioned between said first solder layer and said radiator plate, and (3) a dummy layer formed of a plurality of stacked elements within said first solder layer.
Claim 3
Dependent Claim
23 words
The device according to claim 1, wherein said spacer layer includes a plurality of globular metal particles distributed within said first solder layer.
Claim 4
Dependent Claim
21 words
The device according to claim 2, wherein said globular metal particles each have a diameter of 80 μm to 200 μm.
Claim 5
Dependent Claim
18 words
The device according to claim 2, wherein said globular metal particles are distributed uniformly within said solder layer.
Claim 6
Dependent Claim
22 words
The device according to claim 1, wherein said spacer layer forms a parallel gap between said radiator plate and said loading portion.
Claim 7
Dependent Claim
27 words
The device according to, claim 1, wherein said spacer layer includes a high melting point solder layer positioned between said first solder layer and said radiator plate.
Claim 8
Dependent Claim
27 words
The device according to claim 6, wherein a second high melting point solder layer is positioned between the upper surface of said radiator plate and said transistor.
Claim 9
Dependent Claim
22 words
The device according to claim 6, wherein said high melting point solder layer has a thickness of 50 μm to 200 μm.
Claim 10
Dependent Claim
26 words
The device according to claim 1, wherein said spacer layer includes a dummy layer formed of a plurality of stacked elements within said first solder layer.
Claim 11
Dependent Claim
26 words
The device according to claim 9, wherein said stacked elements each include a conductive layer positioned between at least one resistor layer and a glass layer.
Claim 12
Dependent Claim
26 words
The device according to claim 10, wherein the height of said dummy layer is determined by the number of resistor layers included within said stacked elements.
Claim 13
Dependent Claim
22 words
The device according to claim 10, wherein said dummy layer has a thickness in the range of 80 μm to 150 μm.
Claim 14
Dependent Claim
31 words
The device according to claim 9, wherein said dummy layer includes a plurality of spacers each having a conductive layer positioned between at least one resistor layer and a glass layer.
References Cited (Backward Citations)
US4504849A
Cited
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2001-06-29 | 2001-12-29 | 2002-06-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-29 | 2005-12-29 | 2006-06-30 | $3760.00 | Window Closed / Lapsed |
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